JPH0460363U - - Google Patents

Info

Publication number
JPH0460363U
JPH0460363U JP10014090U JP10014090U JPH0460363U JP H0460363 U JPH0460363 U JP H0460363U JP 10014090 U JP10014090 U JP 10014090U JP 10014090 U JP10014090 U JP 10014090U JP H0460363 U JPH0460363 U JP H0460363U
Authority
JP
Japan
Prior art keywords
substrate
hot plate
support frame
board
preheating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10014090U
Other languages
English (en)
Japanese (ja)
Other versions
JP2515883Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990100140U priority Critical patent/JP2515883Y2/ja
Publication of JPH0460363U publication Critical patent/JPH0460363U/ja
Application granted granted Critical
Publication of JP2515883Y2 publication Critical patent/JP2515883Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1990100140U 1990-09-27 1990-09-27 基板予熱装置 Expired - Lifetime JP2515883Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990100140U JP2515883Y2 (ja) 1990-09-27 1990-09-27 基板予熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990100140U JP2515883Y2 (ja) 1990-09-27 1990-09-27 基板予熱装置

Publications (2)

Publication Number Publication Date
JPH0460363U true JPH0460363U (US06534493-20030318-C00166.png) 1992-05-25
JP2515883Y2 JP2515883Y2 (ja) 1996-10-30

Family

ID=31842560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990100140U Expired - Lifetime JP2515883Y2 (ja) 1990-09-27 1990-09-27 基板予熱装置

Country Status (1)

Country Link
JP (1) JP2515883Y2 (US06534493-20030318-C00166.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426476A (en) * 1977-07-29 1979-02-28 Fujitsu Ltd Reflow solder dipping device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426476A (en) * 1977-07-29 1979-02-28 Fujitsu Ltd Reflow solder dipping device

Also Published As

Publication number Publication date
JP2515883Y2 (ja) 1996-10-30

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