JPH0459952U - - Google Patents
Info
- Publication number
- JPH0459952U JPH0459952U JP1990102391U JP10239190U JPH0459952U JP H0459952 U JPH0459952 U JP H0459952U JP 1990102391 U JP1990102391 U JP 1990102391U JP 10239190 U JP10239190 U JP 10239190U JP H0459952 U JPH0459952 U JP H0459952U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- punch
- forming
- die
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102391U JPH0459952U (enExample) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990102391U JPH0459952U (enExample) | 1990-09-28 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459952U true JPH0459952U (enExample) | 1992-05-22 |
Family
ID=31846610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990102391U Pending JPH0459952U (enExample) | 1990-09-28 | 1990-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459952U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013000795A (ja) * | 2011-06-22 | 2013-01-07 | Yazaki Corp | 金属導線の加工方法及び加工装置 |
-
1990
- 1990-09-28 JP JP1990102391U patent/JPH0459952U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013000795A (ja) * | 2011-06-22 | 2013-01-07 | Yazaki Corp | 金属導線の加工方法及び加工装置 |