JPH0459867A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPH0459867A JPH0459867A JP17423790A JP17423790A JPH0459867A JP H0459867 A JPH0459867 A JP H0459867A JP 17423790 A JP17423790 A JP 17423790A JP 17423790 A JP17423790 A JP 17423790A JP H0459867 A JPH0459867 A JP H0459867A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- polyarylate
- epoxy
- thermoplastic resin
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 32
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 13
- 229920001230 polyarylate Polymers 0.000 claims abstract description 42
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 30
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 30
- 239000004952 Polyamide Substances 0.000 claims abstract description 18
- 229920002647 polyamide Polymers 0.000 claims abstract description 18
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 12
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000003118 aryl group Chemical group 0.000 claims abstract description 9
- 229920006033 core shell type graft co-polymer Polymers 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920002302 Nylon 6,6 Polymers 0.000 claims abstract description 5
- 229920002292 Nylon 6 Polymers 0.000 claims abstract description 4
- 229920000728 polyester Polymers 0.000 claims abstract description 4
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 claims description 2
- 239000000178 monomer Substances 0.000 abstract description 14
- 125000000524 functional group Chemical group 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 5
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 239000000806 elastomer Substances 0.000 abstract 1
- 125000002348 vinylic group Chemical group 0.000 abstract 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 21
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 18
- 239000000243 solution Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000004080 punching Methods 0.000 description 12
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical group CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229930185605 Bisphenol Natural products 0.000 description 10
- -1 aromatic dicarboxylic acids Chemical class 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical group Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000011258 core-shell material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 3
- 229920000578 graft copolymer Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004448 titration Methods 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N 1-propanol Substances CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000001118 alkylidene group Chemical group 0.000 description 2
- 239000008346 aqueous phase Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N 1-butanol Substances CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- WIFDRXSVRSCMMY-UHFFFAOYSA-N 2,6-dichloro-4-[(3,5-dichloro-4-hydroxyphenyl)methyl]phenol Chemical compound C1=C(Cl)C(O)=C(Cl)C=C1CC1=CC(Cl)=C(O)C(Cl)=C1 WIFDRXSVRSCMMY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QUBNFZFTFXTLKH-UHFFFAOYSA-N 2-aminododecanoic acid Chemical compound CCCCCCCCCCC(N)C(O)=O QUBNFZFTFXTLKH-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- LFEWXDOYPCWFHR-UHFFFAOYSA-N 4-(4-carboxybenzoyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C=C1 LFEWXDOYPCWFHR-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- KQSIVRHDEPHUII-UHFFFAOYSA-N 4-(4-hydroxy-3,5-dimethylphenoxy)-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(OC=2C=C(C)C(O)=C(C)C=2)=C1 KQSIVRHDEPHUII-UHFFFAOYSA-N 0.000 description 1
- SUCTVKDVODFXFX-UHFFFAOYSA-N 4-(4-hydroxy-3,5-dimethylphenyl)sulfonyl-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(S(=O)(=O)C=2C=C(C)C(O)=C(C)C=2)=C1 SUCTVKDVODFXFX-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- CYCBPQPFMHUATH-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)butan-1-ol Chemical compound OCCCCOCC1CO1 CYCBPQPFMHUATH-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- AZZWZMUXHALBCQ-UHFFFAOYSA-N 4-[(4-hydroxy-3,5-dimethylphenyl)methyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(CC=2C=C(C)C(O)=C(C)C=2)=C1 AZZWZMUXHALBCQ-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- FYTJMUYAPJUVHO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-6-ol Chemical compound C1CCCC2OC21O FYTJMUYAPJUVHO-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- VJGNLOIQCWLBJR-UHFFFAOYSA-M benzyl(tributyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CC1=CC=CC=C1 VJGNLOIQCWLBJR-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010612 desalination reaction Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical group 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐衝撃性、特に耐高速打ち抜き衝撃性、表面
性、及びウェルド部強度に優れることを特徴とする成形
用樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a molding resin composition characterized by excellent impact resistance, particularly high-speed punching impact resistance, surface properties, and weld part strength.
ポリアリレートは芳香族ジカルボン酸又はその誘導体と
、ビスフェノール又はその誘導体から得られるエンジニ
アリングプラスチックであり、高い熱変形温度と高い熱
分解温度を有していることが知られている。Polyarylate is an engineering plastic obtained from aromatic dicarboxylic acid or its derivative and bisphenol or its derivative, and is known to have a high heat distortion temperature and a high thermal decomposition temperature.
また、ポリアリレートとポリアミドからなる樹脂組成物
は、ポリアミドの良好な成形性、耐薬品性と、ポリアリ
レートの耐熱変形性の長所を合わせもつ成形材料として
優れた物性バランスが、期待される。Furthermore, a resin composition composed of polyarylate and polyamide is expected to have an excellent balance of physical properties as a molding material, combining the good moldability and chemical resistance of polyamide with the heat deformation resistance of polyarylate.
かかる樹脂組成物の有用性は特公昭56−14699、
特開昭52−98765に開示されている。しかし乍ら
、ポリアリレートとポリアミドのみからなる樹脂組成物
は耐衝撃性が低いという欠点を有している。かかる欠点
を改良する目的で、各種の耐衝撃性付与剤を用いる方法
が開示されている。例えば特公昭62−944、特開昭
61183353、特開昭62−277462、特開昭
62−283146には特定の変性ポリオレフィンを用
いる方法が開示されている。このように耐衝撃性付与剤
として特定の変性ポリオレフィンを用いると、確かにフ
イゾソト衝撃強度は向上するが、実用的により重要な耐
高速打ち抜き衝撃性は低いままである。特に−30°C
程度の低温での高速打ち抜き衝撃性は著しく低いままで
あり、このような欠点は自動車外板のような低温下での
耐衝撃性が要求される用途では大きな障害となる。The usefulness of such resin compositions is disclosed in Japanese Patent Publication No. 56-14699,
It is disclosed in Japanese Patent Application Laid-Open No. 52-98765. However, resin compositions consisting only of polyarylate and polyamide have a drawback of low impact resistance. In order to improve these drawbacks, methods using various impact resistance imparting agents have been disclosed. For example, Japanese Patent Publications No. 62-944, No. 61183353, No. 62-277462, and No. 62-283146 disclose methods using specific modified polyolefins. As described above, when a specific modified polyolefin is used as an impact resistance imparting agent, the phizoso impact strength is certainly improved, but the high-speed punching impact resistance, which is more important in practical terms, remains low. Especially -30°C
The high-speed punching impact resistance at moderately low temperatures remains extremely low, and such drawbacks are a major hindrance in applications requiring low-temperature impact resistance, such as automobile exterior panels.
また、一般に変性ポリオレフィンを使用すると成形品の
表面性が不良であり、シルバーマーク、フローマークな
どが生じるという問題点やウェルド部強度が低いという
問題点を有している。Furthermore, when modified polyolefins are used, the surface properties of molded products are generally poor, resulting in problems such as silver marks, flow marks, etc., and low weld strength.
かかる実情に鑑み、本発明の目的はポリアリレートとポ
リアミドからなる樹脂組成物において、高い耐高速打ち
抜き衝撃強度と成形品の表面性及びウェルド部強度を向
上せしめることにある。In view of these circumstances, an object of the present invention is to improve high-speed punching impact strength, surface properties of molded articles, and weld part strength in a resin composition comprising polyarylate and polyamide.
本発明者らはかかる目的で鋭意研究を重ねた結果、ポリ
アリレートとしてエポキシ基を有するポリアリレートを
用い、耐衝撃性付与剤としてコアシェル型グラフト共重
合体を用いることにより、本発明の目的が極めて高いレ
ベルで実現できることを見出した。As a result of extensive research for this purpose, the present inventors have found that the purpose of the present invention has been extremely achieved by using a polyarylate having an epoxy group as the polyarylate and using a core-shell type graft copolymer as an impact resistance imparting agent. I discovered what I could achieve at a high level.
即ち、本発明は、エポキシ基を有するポリアリレート2
0〜80重量%とポリアミド80〜20重量%からなる
樹脂組成物(A)100重量部に対し、コアシェル型グ
ラフト共重合体(B)1〜40重量部を添加してなる熱
可塑性樹脂組成物を内容とするものである。That is, the present invention provides polyarylate 2 having an epoxy group.
A thermoplastic resin composition obtained by adding 1 to 40 parts by weight of a core-shell type graft copolymer (B) to 100 parts by weight of a resin composition (A) consisting of 0 to 80% by weight and 80 to 20% by weight of polyamide. The content is as follows.
本発明に用いるポリアリレートは、一般にビスフェノー
ル類又はその誘導体と、芳香族ジカルボン酸又はその誘
導体から得られる芳香族ポリエステルであればその主鎖
構造に特に制限はないが、エポキシ基を有することが必
須である。エポキシ基は主鎖中又は末端のいずれに存在
してもよいが、末端に存在している方が本発明の効果が
より顕著に発現されるので好ましい。The polyarylate used in the present invention is generally not particularly limited in its main chain structure as long as it is an aromatic polyester obtained from bisphenols or derivatives thereof and aromatic dicarboxylic acids or derivatives thereof, but it is essential that it has an epoxy group. It is. Although the epoxy group may be present either in the main chain or at the end, it is preferable that the epoxy group be present at the end because the effects of the present invention are more clearly expressed.
ビスフェノール類は下記一般弐 〔但し、式中、−X−は−o−−s−−s。Bisphenols are general 2 below. [However, in the formula, -X- is -o--s--s.
−CO−、アルキレン基又はアルキリデン基(これらの
アルキレン基、アルキリデン基の水素原子は1又はそれ
以上の炭化水素基、ハロゲン基、ハロゲン化炭化水素基
で置換されていてもよい)よりなる群から選ばれ、R1
−R8は水素原子、ハロゲン原子及びCI”” Ct。-CO-, an alkylene group or an alkylidene group (the hydrogen atom of these alkylene groups or alkylidene groups may be substituted with one or more hydrocarbon groups, halogen groups, or halogenated hydrocarbon groups) Selected, R1
-R8 is a hydrogen atom, a halogen atom, and CI""Ct.
の炭化水素基よりなる群から選ばれる。〕で表わされる
ものが好適である。selected from the group consisting of hydrocarbon groups. ] is preferable.
かかるビスフェノール類を例示すれば、2,2−ビス(
4−ヒドロキシフェニル)プロパン(ビスフェノールA
)、ビス(4−ヒドロキシフェニル)メタン、ビス(4
−ヒドロキシ−3,5−ジメチルフェニル)メタン、ビ
ス(4−ヒドロキシ−3,5−ジクロロフェニル)メタ
ン、1.1−ビス(4−ヒドロキシフェニル)シクロヘ
キシルメタン、1.1−ビス(4−ヒドロキシフェニル
)エタン、1.1−ビス(4−ヒドロキシフェニル)1
−フェニルエタン、4.4’−ジヒドロキシジフェニル
エーテル、ビス(4−ヒドロキシ−3,5−ジメチルフ
ェニル)エーテル、ビス(4−ヒドロキシフェニル)ス
ルホン、ビス(4−ヒドロキシ−3,5−ジメチルフェ
ニル)スルホン、4,4″−ジヒドロキシベンゾフェノ
ン、2.2−ビス(4−ヒドロキシ−3,5−ジメチル
フェニル)プロパン等が挙げられ、これらは単独又は2
種以上組み合わせて用いられる。An example of such bisphenols is 2,2-bis(
4-Hydroxyphenyl)propane (bisphenol A
), bis(4-hydroxyphenyl)methane, bis(4
-hydroxy-3,5-dimethylphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, 1.1-bis(4-hydroxyphenyl)cyclohexylmethane, 1.1-bis(4-hydroxyphenyl) ) ethane, 1,1-bis(4-hydroxyphenyl)1
-Phenylethane, 4,4'-dihydroxydiphenyl ether, bis(4-hydroxy-3,5-dimethylphenyl)ether, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3,5-dimethylphenyl)sulfone , 4,4''-dihydroxybenzophenone, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, etc., which may be used alone or in combination with
Used in combination of more than one species.
また必要に応じ、他の2価の化合物、例えば4゜4′−
ビフェノール、ヒドロキノン、レゾルシノール、2.6
−シヒドロキシナフタレン等を前記ビスフェノール類に
少量加えて使用することができる。If necessary, other divalent compounds, such as 4゜4'-
Biphenol, hydroquinone, resorcinol, 2.6
-Sihydroxynaphthalene or the like can be used by adding a small amount to the above-mentioned bisphenols.
前記ビスフェノール類の誘導体とは、そのアルカリ金属
塩、ジアセテート等である。これらビスフェノール類の
なかでもビスフェノールA、1゜1−ビス(4−とドロ
キシフェニル)1−フェニルエタンあるいはこれらの混
合物の使用は成形流動性と耐熱性のバランスが優れてお
り好ましい。The derivatives of bisphenols include their alkali metal salts, diacetates, and the like. Among these bisphenols, it is preferable to use bisphenol A, 1°1-bis(4-and-droxyphenyl)1-phenylethane, or a mixture thereof because of their excellent balance between molding fluidity and heat resistance.
上記ポリアリレート中の芳香族ジカルボン酸としては、
例えばテレフタル酸、イソフタル酸、ジフェニルエーテ
ル−4,4′−ジカルボン酸、ベンゾフェノン−4,4
′−ジカルボン酸、ナフタレン−2,6−ジカルボン酸
等が挙げられ、これらは単独又は2種以上組み合わせて
用いられる。As the aromatic dicarboxylic acid in the above polyarylate,
For example, terephthalic acid, isophthalic acid, diphenyl ether-4,4'-dicarboxylic acid, benzophenone-4,4
'-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, etc., which may be used alone or in combination of two or more.
成形流動性と耐熱性のバランスから好ましい芳香族ジカ
ルボン酸はイソフタル酸及び/又はテレフタル酸であり
、更に好ましくはイソフタル酸とテレフタル酸のポリマ
ー中での重量比が1010〜7/3である。前記芳香族
ジカルボン酸の誘導体としてはこれらの酸のジクロライ
ド又はアルキル、アリール等のジエステルが挙げられる
。In view of the balance between molding fluidity and heat resistance, preferred aromatic dicarboxylic acids are isophthalic acid and/or terephthalic acid, and more preferably the weight ratio of isophthalic acid and terephthalic acid in the polymer is 1010 to 7/3. Examples of the aromatic dicarboxylic acid derivatives include dichlorides of these acids, and diesters of alkyl, aryl, and the like.
本発明において、好ましいエポキシ基の含有量はエポキ
シ価(樹脂1g中に含まれるエポキシ基の101当量)
で2〜100の範囲であり、更に好ましくは、10〜5
0の範囲である。この範囲外では耐高速打ち抜き衝撃強
度や表面性が低下したり、ウェルド強度が低下する。In the present invention, the preferred content of epoxy groups is epoxy value (101 equivalents of epoxy groups contained in 1 g of resin).
is in the range of 2 to 100, more preferably 10 to 5
It is in the range of 0. Outside this range, high-speed punching impact strength and surface properties are reduced, and weld strength is reduced.
なお、上記エポキシ価は、l5O−3001法(エポキ
シ樹脂のエポキシ価の測定法)に従い、次式により算出
される。The above epoxy value is calculated by the following formula according to the 15O-3001 method (method for measuring the epoxy value of epoxy resin).
エポキシ価(10−’当量/g)
但し、上式において、
TS:試料の滴定に要した0、1規定HC104の酢酸
溶液の量(d)
Tb:空試験の滴定に要した0、 1規定HC104の
酢酸溶液の量1d)
F : 0.1規定HC104の酢酸溶液のファクター
W:試料の重量(g)
である。Epoxy value (10-' equivalent/g) However, in the above formula, TS: Amount of 0, 1 N HC104 acetic acid solution required for titration of the sample (d) Tb: 0, 1 N required for titration of blank test Amount of HC104 acetic acid solution 1d) F: 0.1N Factor W of HC104 acetic acid solution: Weight of sample (g).
本発明のエポキシ基を有するポリアリレートは、その製
造方法に制限はないが、例えば、以下に述べるごとく、
カルボン酸クロライド基を有するポリアリレートと、ヒ
ドロキシル基及びエポキシ基を同一分子内に持つ化合物
とを反応させることにより得ることができる。The method for producing the polyarylate having an epoxy group of the present invention is not limited, but for example, as described below,
It can be obtained by reacting a polyarylate having a carboxylic acid chloride group with a compound having a hydroxyl group and an epoxy group in the same molecule.
酸クロライド基を存するポリアリレートは、例えば、特
開平1−22851に開示されているように、芳香族ジ
カルボン酸のジクロライドをビスフェノール類及び必要
に応じて使用されるフェノール系化合物総量に対し、官
能基量基準で理論当量より過剰に用いて重合を行うこと
により得られる。この様にして得られる酸クロライド基
を有するポリアリレートは、本発明で望ましいエポキシ
価を得るために必要な酸クロライド基量を含有していな
ければならない、即ち、酸クロライド基を有するポリア
リレートの酸クロライド基含有量は、酸クロライド価(
樹脂1g中に含まれる酸クロライド基の104当量)に
して、2〜100でなければならない。For polyarylates containing acid chloride groups, for example, as disclosed in JP-A-1-22851, dichloride of an aromatic dicarboxylic acid is added to a functional group based on the total amount of bisphenols and phenolic compounds used as necessary. It can be obtained by carrying out polymerization using an amount in excess of the theoretical equivalent. The polyarylate having acid chloride groups obtained in this way must contain the amount of acid chloride groups necessary to obtain the desired epoxy value in the present invention. The chloride group content is determined by the acid chloride value (
It must be between 2 and 100 (in terms of 104 equivalents of acid chloride groups contained in 1 g of resin).
かかる酸クロライド基を有するポリアリレートと反応さ
せるヒドロキシル基及びエポキシ基を同一分子内に持つ
化合物の具体例としては、2.3エポキシ−1−プロパ
ツール、3.4−エポキシーl−ブタノール、3.4−
エポキシ−シクロヘキサノール、エチレングリコールモ
ノグリシジルエーテル、テトラメチレングリコールモノ
グリシジルエーテル等の脂肪族、脂環式化合物、4−(
1’、2’ −エポキシエチル)−フェノール、P−ヒ
ドロキシ安息香酸グリシジル、2.2−ビス(4−ヒド
ロキシフェニル)−プロパンモノグリシジルエーテル等
の芳香族系化合物が挙げられる。Specific examples of compounds having a hydroxyl group and an epoxy group in the same molecule to be reacted with the polyarylate having an acid chloride group include 2.3-epoxy-1-propatol, 3.4-epoxy-1-butanol, and 3.4-epoxy-1-propanol. 4-
Aliphatic and alicyclic compounds such as epoxy-cyclohexanol, ethylene glycol monoglycidyl ether, and tetramethylene glycol monoglycidyl ether, 4-(
Examples include aromatic compounds such as 1',2'-epoxyethyl)-phenol, glycidyl P-hydroxybenzoate, and 2,2-bis(4-hydroxyphenyl)-propane monoglycidyl ether.
ポリアリレートの酸クロライド基とヒドロキシル基及び
エポキシ基を同一分子内に持つ化合物との反応は、低分
子化合物の酸クロライド基と水酸基の反応と同様な方法
によって行うことができる。The reaction between the acid chloride group of polyarylate and a compound having a hydroxyl group and an epoxy group in the same molecule can be carried out in the same manner as the reaction between the acid chloride group and hydroxyl group of a low-molecular compound.
即ち、両者の反応によって脱離する塩化水素をトラップ
する酸受容体の存在下で反応を行う。具体的には、酸ク
ロライド基を有するポリアリレートを実質的に水と相溶
しない有機溶媒に溶解した状態で、酸受容体存在下、ヒ
ドロキシル基及びエポキシ基を同一分子内に持つ化合物
を添加し反応させる方法である。酸受容体としては、ア
ルカリ水溶液ないしは第三級アミン類が用いられる。That is, the reaction is carried out in the presence of an acid acceptor that traps the hydrogen chloride released by the reaction between the two. Specifically, a polyarylate having an acid chloride group is dissolved in an organic solvent that is substantially incompatible with water, and a compound having a hydroxyl group and an epoxy group in the same molecule is added in the presence of an acid acceptor. This is a method of causing a reaction. As the acid acceptor, an alkaline aqueous solution or tertiary amines are used.
ポリアリレートの分子量は固有粘度(クロロホルム溶液
、30°C)で0.2〜1.5d/gの範囲が好ましく
、より好ましくは0.4〜0.8d1/gの範囲である
。この範囲外では耐高速打ち抜き新替性が低下したり、
成形性が低下したりして好ましくない。The molecular weight of the polyarylate is preferably in the range of 0.2 to 1.5 d/g, more preferably in the range of 0.4 to 0.8 d1/g in terms of intrinsic viscosity (chloroform solution, 30°C). Outside this range, high-speed punching resistance and replaceability may decrease,
This is not preferable because moldability may deteriorate.
本発明で用いられるポリアミドは、脂肪族のアミノ酸、
ラクタムあるいはジアミンとジカルボン酸を主成分とす
るポリアミドである。その主成分の代表例を挙げると、
6−アミノカプロン酸、11−アミノウンデカン酸、1
2−アミノドデカン酸等のアミノ酸、ε−カプロラクタ
ム、ω−ラウロラクタム等のラクタム、テトラメチレン
ジアミン、ヘキサメチレンジアミン、ウンデカメチレン
ジアミン、ドデカメチレンジアミン等のジアミン、アジ
ピン酸、アゼライン酸、セバシン酸、ドデカンニ酸、ジ
グリコール酸等のジカルボン酸などであり、これらの脂
肪族成分以外に少量の芳香族成分や脂環族成分を導入し
た共重合ポリアミドの使用も可能である。The polyamide used in the present invention includes aliphatic amino acids,
It is a polyamide whose main components are lactam or diamine and dicarboxylic acid. Typical examples of its main components are:
6-aminocaproic acid, 11-aminoundecanoic acid, 1
Amino acids such as 2-aminododecanoic acid, lactams such as ε-caprolactam and ω-laurolactam, diamines such as tetramethylene diamine, hexamethylene diamine, undecamethylene diamine, and dodecamethylene diamine, adipic acid, azelaic acid, sebacic acid, These include dicarboxylic acids such as dodecanoic acid and diglycolic acid, and it is also possible to use copolyamides into which small amounts of aromatic components and alicyclic components are introduced in addition to these aliphatic components.
特に本発明で有用なポリアミドは、ポリカプロアミド(
ナイロン−6)、ポリヘキサメチレンアジパミド(ナイ
ロン−66)、ポリテトラメチレンアジパミド(ナイロ
ン−46)、ポリドデカンアミド(ナイロン−12)で
ある。なかでもナイロン−6、ナイロン−66、ナイロ
ン−46が特に重要である。これらは単独で用いてもよ
く、また2種以上併用してもよい。Polyamides particularly useful in the present invention include polycaproamide (
Nylon-6), polyhexamethylene adipamide (Nylon-66), polytetramethylene adipamide (Nylon-46), and polydodecanamide (Nylon-12). Among them, nylon-6, nylon-66, and nylon-46 are particularly important. These may be used alone or in combination of two or more.
ポリアミド樹脂は、1%の濃硫酸溶液により25℃で測
定して求めた相対粘度が2.0〜5.0の範囲内にある
ことが好ましい。It is preferable that the relative viscosity of the polyamide resin is within the range of 2.0 to 5.0, as measured at 25° C. using a 1% concentrated sulfuric acid solution.
本発明において用いるコアシェル型グラフト共重合体は
、ゴム状弾性体に特定の成分をグラフト重合させたもの
である。ゴム状弾性体はガラス転移温度が0℃以下のも
のが好ましく、より好ましくは一40℃以下のものであ
る。具体的にはポリブタジェン、ブタジェン−スチレン
共重合体、ブタジェン−アクリル酸ブチル共重合体等の
ジエン系ゴム、ポリアクリル酸ブチル、ポリアクリル酸
、ポリアクリル酸2−エチルヘキシル等のアクリル系ゴ
ム、エチレン−プロピレン共重合体、エチレン−プロピ
レン−ジエン共重合体等のオレフィン系ゴムが例示され
る。ゴム状弾性体のゲル含有量は特に限定されないが、
10重量%以上のものが好ましい。The core-shell type graft copolymer used in the present invention is obtained by graft-polymerizing a specific component onto a rubber-like elastic body. The rubber-like elastic body preferably has a glass transition temperature of 0°C or lower, more preferably -40°C or lower. Specifically, diene rubbers such as polybutadiene, butadiene-styrene copolymer, butadiene-butyl acrylate copolymer, acrylic rubbers such as butyl polyacrylate, polyacrylic acid, and 2-ethylhexyl polyacrylate, ethylene- Examples include olefin rubbers such as propylene copolymers and ethylene-propylene-diene copolymers. The gel content of the rubber-like elastic body is not particularly limited, but
The content is preferably 10% by weight or more.
コアシェル型グラフト共重合体に用いられる特定の成分
とはビニル系単量体、カルボン酸基、カルボン酸エステ
ル、酸無水物基、エポキシ基、イミド基、酸アミド基か
ら選ばれた少なくとも1種の官能基を有する単量体であ
る。ビニル系単量体としてはスチレン、メチルスチレン
、クロルスチレン、α−メチルスチレン等の芳香族ビニ
ル単量体、アクリロニトリル、メタアクリロニトリル等
のシアン化ビニル等が例示される。官能基を有する単量
体の例としてはアクリル酸、メタアクリル酸、マレイン
酸、フマル酸、イタコン酸、アクリル酸メチル、アクリ
ル酸エチル、アクリル酸ブチル、アクリル酸2−エチル
ヘキシル、無水マレイン酸、無水イタコン酸、アクリル
酸グリシジル、メタクリル酸グリシジル、アクリルアミ
ド、メタクリルアミド、マレイミド、フェニルマレイミ
ド等が例示される。The specific component used in the core-shell type graft copolymer is at least one type selected from vinyl monomers, carboxylic acid groups, carboxylic acid esters, acid anhydride groups, epoxy groups, imide groups, and acid amide groups. It is a monomer with a functional group. Examples of vinyl monomers include aromatic vinyl monomers such as styrene, methylstyrene, chlorostyrene, and α-methylstyrene, and vinyl cyanides such as acrylonitrile and methacrylonitrile. Examples of monomers with functional groups include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, maleic anhydride, and anhydride. Examples include itaconic acid, glycidyl acrylate, glycidyl methacrylate, acrylamide, methacrylamide, maleimide, phenylmaleimide, and the like.
本発明に用いられる特定成分の組成比は特に限定される
ものではないが、ビニル系単量体50〜99.9重量%
、官能基含有単量体0.1〜50重量%が好ましい。こ
の範囲外では耐衝撃性が低下したり、成形加工性が悪く
なったりして好ましくない。また、ビニル系単量体成分
の組成比も特に限定されないが、芳香族ビニル単量体4
0〜90重量%、シアン化ビニル単量体10〜60重量
%が好ましい。この範囲外では耐衝撃性が低下したり、
熱安定性が低下したりして好ましくない。ゴム状弾性体
と特定の単量体の組成比はゴム状弾性体30〜95重量
%、特定の単量体5〜70重量%の範囲が好ましい。こ
の範囲外では耐衝撃性、剛性等が低下したり、成形品表
面に不良が生じたりして好ましくない。The composition ratio of specific components used in the present invention is not particularly limited, but vinyl monomer 50 to 99.9% by weight
, the functional group-containing monomer is preferably 0.1 to 50% by weight. If it is outside this range, impact resistance may be lowered or moldability may be deteriorated, which is not preferable. Furthermore, the composition ratio of the vinyl monomer components is not particularly limited, but the aromatic vinyl monomer 4
0 to 90% by weight, preferably 10 to 60% by weight of vinyl cyanide monomer. Outside this range, impact resistance may decrease,
This is not preferable because thermal stability may decrease. The composition ratio of the rubbery elastic body and the specific monomer is preferably in the range of 30 to 95% by weight of the rubbery elastic body and 5 to 70% by weight of the specific monomer. Outside this range, impact resistance, rigidity, etc. may deteriorate, or defects may occur on the surface of the molded product, which is not preferable.
コアシェル型グラフト共重合体の製造方法は特に限定さ
れるものではなく溶液重合、懸濁重合、塊状重合、乳化
重合等の任意の方法を採用することができる。The method for producing the core-shell graft copolymer is not particularly limited, and any method such as solution polymerization, suspension polymerization, bulk polymerization, emulsion polymerization, etc. can be employed.
本発明の熱可塑性樹脂組成物は、エポキシ基を有するポ
リアリレート20〜80重量%とポリアミド80〜20
重量%からなる樹脂組成物(A)100重量部に対し、
コアシェル型グラフト共重合体(B)1〜40重量部、
より好ましくはエポキシ基を有するポリアリレート30
〜60重量%とポリアミド70〜40重量%からなる樹
脂組成物(A)100重量部に対し、コアシェル型グラ
フト共重合体(B)が3〜30重量部添加される。The thermoplastic resin composition of the present invention contains 20 to 80% by weight of polyarylate having epoxy groups and 80 to 20% by weight of polyamide.
With respect to 100 parts by weight of the resin composition (A) consisting of % by weight,
1 to 40 parts by weight of core-shell graft copolymer (B),
More preferably polyarylate 30 having an epoxy group
3 to 30 parts by weight of the core-shell type graft copolymer (B) is added to 100 parts by weight of the resin composition (A) consisting of ~60% by weight and 70 to 40% by weight of polyamide.
この範囲外では耐衝撃性、表面性、ウェルド強度、剛性
、成形性、耐薬品性等が低下して好ましくない。Outside this range, impact resistance, surface properties, weld strength, rigidity, moldability, chemical resistance, etc. deteriorate, making it undesirable.
本発明の、樹脂組成物を製造する方法は特に限定されな
いが、溶融混合による方法が特に好ましく、例えば押し
出し機、熱ロール、プラベンダー、バンバリーミキサ−
等を用いることができる。The method for producing the resin composition of the present invention is not particularly limited, but a method using melt mixing is particularly preferred, such as using an extruder, hot roll, plastic bender, Banbury mixer, etc.
etc. can be used.
本発明における樹脂組成物は、必要に応じ、更にワック
ス等の滑剤、フォスファイト系、フェノール系等の安定
剤、紫外線吸収剤、顔料、難燃化剤、可塑剤、無機質充
填材、フィラー、強化繊維等を添加することができる。The resin composition of the present invention may further contain lubricants such as wax, stabilizers such as phosphites and phenols, ultraviolet absorbers, pigments, flame retardants, plasticizers, inorganic fillers, fillers, and reinforcing agents. Fibers etc. can be added.
本発明の樹脂組成物は射出成形、押出成形、吹き込み成
形、圧縮成形等の成形に供することにより、高速打ち抜
き耐衝撃性、表面性、吸湿時の寸法安定性及びウェルド
強度に優れた成形品を得ることができ、これらの成形品
は各種自動車外装部品、自動車外板、機械部品、電気・
電子部品などの用途に有用である。The resin composition of the present invention can be molded by injection molding, extrusion molding, blow molding, compression molding, etc. to produce molded products with excellent high-speed punching impact resistance, surface properties, dimensional stability upon moisture absorption, and weld strength. These molded products are used in various automotive exterior parts, automotive exterior panels, mechanical parts, electrical and
Useful for applications such as electronic components.
以下、本発明を実施例により説明するが、本発明はこれ
ら実施例のみに限定されるものではない。EXAMPLES The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples.
参考例(エポキシ基を有するポリアリレートP1〜P−
9の合成)
P−1=
2.2−ビス(4−ヒドロキシフェニル)−プロパン(
ビスフェノールA)674.6g (2,955モル)
、p−(t−ブチル)フェノール13.52(0,09
モル)、ナトリウムハイドロサルファイド5.28 g
、4規定水酸化ナトリウム1,920d及び水3,32
0 dを窒素雰囲気中にて61フラスコ中で混合した後
、5℃に冷却して、ビスフェノールのアルカリ水溶液を
調整した。Reference examples (polyarylates P1 to P- having epoxy groups
Synthesis of 9) P-1 = 2.2-bis(4-hydroxyphenyl)-propane (
Bisphenol A) 674.6g (2,955 mol)
, p-(t-butyl)phenol 13.52 (0,09
mole), sodium hydrosulfide 5.28 g
, 1,920 d of 4N sodium hydroxide and 3,32 d of water
After mixing 0 d in a 61 flask in a nitrogen atmosphere, the mixture was cooled to 5°C to prepare an alkaline aqueous solution of bisphenol.
一方、別の61フラスコ中にテレフタル酸クロライド1
24.25g (0,612モル)及びイソフタル酸ク
ロライド496.99g (2,448モル)を塩化メ
チレン5,000dに溶解し、5°Cに冷却した。Meanwhile, in another 61 flask, terephthalic acid chloride 1
24.25 g (0,612 mol) and 496.99 g (2,448 mol) of isophthalic acid chloride were dissolved in 5,000 d of methylene chloride and cooled to 5°C.
次いで、更に別の15fセパラブルフラスコ中に、水2
.000m及び触媒としてのベンジルトリブチルアンモ
ニウムクロライド0.94g(0,03モル)を窒素雰
囲気下で仕込んでおき、5℃に冷却した。この冷却液を
激しく攪拌しながら、予め調整しておいた上記二液を同
時に15分間かけてポンプを用いて連続的に添加した。Then, in another 15f separable flask, add 2 ml of water.
.. 000m and 0.94 g (0.03 mol) of benzyltributylammonium chloride as a catalyst were charged under a nitrogen atmosphere, and the mixture was cooled to 5°C. While stirring the cooling liquid vigorously, the above two liquids prepared in advance were simultaneously added continuously using a pump over a period of 15 minutes.
添加終了後、60分経過した後に攪拌を停止したところ
、塩化メチレン相と水相の2相に分かれた。水相をデカ
ントした後、同量の水を加え攪拌しながら少量の塩酸で
中和した。さらに、水洗による脱塩を繰り返し行った後
、塩化メチレン相に同量のアセトンを加えてポリマー粉
末を析出させ、濾過後、同量のアセトン及び水で該粉末
を洗浄し、再度同様に濾過した。乾燥したポリマーの酸
クロライド価(104当量/g)を測定したところ、4
5であった。また、分子量は固有粘度(クロロホルム溶
液、30℃)で表して0.62dl/gであった。When stirring was stopped 60 minutes after the addition was completed, the mixture was separated into two phases: a methylene chloride phase and an aqueous phase. After decanting the aqueous phase, the same amount of water was added and neutralized with a small amount of hydrochloric acid while stirring. Furthermore, after repeated desalination by water washing, the same amount of acetone was added to the methylene chloride phase to precipitate a polymer powder, and after filtration, the powder was washed with the same amount of acetone and water, and filtered again in the same manner. . When the acid chloride value (104 equivalents/g) of the dried polymer was measured, it was 4.
It was 5. Further, the molecular weight was 0.62 dl/g expressed in terms of intrinsic viscosity (chloroform solution, 30°C).
このようにして得られたポリマー1,000gを151
セパラブルフラスコ中に仕込み、さらに塩化メチレン5
,0OOdを加え、攪拌、還流下でポリマーを溶解した
。完全にポリマー溶□液が透明になった後、5°Cに冷
却した。その後、攪拌下に2゜3−エポキシ−1−プロ
パツール44.45g(0゜6モル)の塩化メチレン溶
液(500M)及びトリエチルアミン6.68 g (
0,066モル)の塩化メチレン溶液(50d)を添加
した。60分経過した後、塩化メチレンと同量のアセト
ンを徐々に加えて、ポリマー粉末を析出させ、濾過後、
同量のアセトンで該粉末を洗浄し、再度同様に濾過し得
られたポリマー粉末について、下記の方法によりエポキ
シ価を測定した。1,000 g of the polymer obtained in this way was
Pour into a separable flask and add 5 methylene chloride.
,0OOd was added and the polymer was dissolved under stirring and reflux. After the polymer solution became completely transparent, it was cooled to 5°C. Then, under stirring, a methylene chloride solution (500M) of 44.45 g (0.6 mol) of 2°3-epoxy-1-propanol and 6.68 g of triethylamine (
0.066 mol) of methylene chloride solution (50d) was added. After 60 minutes, the same amount of acetone as methylene chloride was gradually added to precipitate the polymer powder, and after filtration,
The powder was washed with the same amount of acetone and filtered again in the same manner, and the epoxy value of the resulting polymer powder was measured by the method described below.
ポリマー粉末約0.2 gを精秤し、これに2(ldの
クローホルムを加えて溶かした。溶解後、テトラエチル
アンモニウムブロマイドの25%酢酸溶液l On及び
クリスタルバイオレットの0.1%酢酸溶液を指示薬と
して少量加えた。この紫色の試料溶液を速やかに0.I
Nのnctonの酢酸溶液により、指示薬の色が青緑色
に変色する点を畔点として滴定した。なお、別途、空試
験を行った。Approximately 0.2 g of polymer powder was accurately weighed, and 2 (ld) of chloroform was added and dissolved. After dissolving, a 25% acetic acid solution of tetraethylammonium bromide and a 0.1% acetic acid solution of crystal violet were added as indicators. This purple sample solution was immediately diluted with 0.I.
Titration was carried out using an acetic acid solution of N ncton, with the point at which the color of the indicator changed to blue-green as the tip point. Additionally, a blank test was conducted separately.
エポキシ価を前弐により算出したところ、エポキシ価(
10−’当量/g)は30であった。また、分子量は固
有粘度(クロロホルム溶液、30°C)で表して0.6
2d1/gであった。When the epoxy value was calculated using the previous method, the epoxy value (
10-' equivalents/g) was 30. In addition, the molecular weight is expressed as an intrinsic viscosity (chloroform solution, 30°C) of 0.6
It was 2d1/g.
P−2〜6及びP−8:
上記P−1と同様の方法で、2.2−ビス(4−ヒドロ
キシフェニル)−プロパン(ビスフェノールA)と酸ク
ロライド成分の比率を変えて各種のエポキシ価を有する
ポリアリレートを製造した。P-2 to 6 and P-8: Using the same method as P-1 above, various epoxy values were obtained by changing the ratio of 2,2-bis(4-hydroxyphenyl)-propane (bisphenol A) and acid chloride components. A polyarylate having the following was produced.
また、ビスフェノール成分として2.2−ビス(4−ヒ
ドロキシフェニル)−プロパン(ビスフェノールA)と
1.1−ビス(4−ヒドロキシフェニル)−1−フェニ
ルエタン(ビスフェノールP)のモル比にして50:5
0の混合物をビスフェノール成分として用いたポリアリ
レートも製造した。P−1と同様にして測定したポリア
リレートのエポキシ価及び固有粘度を第1表に示す。In addition, as a bisphenol component, the molar ratio of 2.2-bis(4-hydroxyphenyl)-propane (bisphenol A) and 1.1-bis(4-hydroxyphenyl)-1-phenylethane (bisphenol P) is 50: 5
A polyarylate was also produced using a mixture of 0 and 0 as the bisphenol component. Table 1 shows the epoxy value and intrinsic viscosity of the polyarylate measured in the same manner as P-1.
P−7及びP−9=
また、比較として通常の界面重縮合による方法でエポキ
シ基を有していないポリアリレートを製造した。P−1
と同様にして測定したポリアリレートのエポキシ価及び
固有粘度を第1表に示す。P-7 and P-9= In addition, for comparison, polyarylates having no epoxy groups were produced by a conventional interfacial polycondensation method. P-1
Table 1 shows the epoxy value and intrinsic viscosity of polyarylate measured in the same manner as above.
実施例1〜16及び比較例1〜7
参考例で得られたポリアリレートP−1〜P−9と、ポ
リアミドとして東し■製アミランCM1026(ポリε
−カプロラクタム、相対粘度3゜2)と、コアシェル型
グラフト共重合体として、平均粒径0.25μ、ゲル含
有量83%のポリブタジェン70重量%にアクリロニト
リル6重量%、スチレン21重量%、メタアクリルM3
重量%の混合物を乳化重合法でグラフト反応させたもの
を第2表に示す割合で配合しトライブレンドしたのち、
80℃で真空乾燥を15時間行ない、二輪押し出し機を
用いて270℃で混練しベレットを得た。このベレット
を120°Cで真空乾燥を15時間行ない、樹脂温度2
90℃にて射出成形を行ない試験片を得た。Examples 1 to 16 and Comparative Examples 1 to 7 Polyarylates P-1 to P-9 obtained in the reference examples and Amilan CM1026 (polyε
- caprolactam, relative viscosity 3°2), as a core-shell graft copolymer, 70% by weight of polybutadiene with an average particle size of 0.25μ and a gel content of 83%, 6% by weight of acrylonitrile, 21% by weight of styrene, methacrylic M3
A mixture of % by weight was subjected to a graft reaction using an emulsion polymerization method, and the mixture was blended in the proportions shown in Table 2 and triblended.
Vacuum drying was performed at 80° C. for 15 hours, and then kneaded at 270° C. using a two-wheel extruder to obtain pellets. This pellet was vacuum dried at 120°C for 15 hours, and the resin temperature was 2.
A test piece was obtained by injection molding at 90°C.
試験片の性質を以下の方法で評価し、その結果を第2表
に示した。The properties of the test pieces were evaluated by the following method, and the results are shown in Table 2.
レオメトリック社製HRI78000型の高速打ち抜き
衝撃試験機を用いてポンチ(5/8インチ径)で5m/
sの速度で試験片(100X100×3閣)を打ち抜き
、打ち抜くために要したエネルギーを測定した。測定は
23℃及び−30℃で行った。Using a high-speed punching impact tester model HRI78000 made by Rheometric, a punch (5/8 inch diameter) was used to
A test piece (100 x 100 x 3 pieces) was punched out at a speed of 100 s, and the energy required for punching was measured. Measurements were performed at 23°C and -30°C.
試験片として中央部にウェルドラインが生成するように
二点ゲートにより成形した平板(100X100X3m
)を用いた。成形条件としては完全に充填する限界の射
出圧力より5kg/cd(ゲージ圧)高い射出圧力で成
形した。ウェルド部にポンチ先端が当たるようにして、
上記の条件で23℃における高速打ち抜き衝撃強度を測
定した。A flat plate (100 x 100 x 3 m
) was used. The molding conditions were an injection pressure 5 kg/cd (gauge pressure) higher than the limit injection pressure for complete filling. Make sure the tip of the punch touches the weld part,
High-speed punching impact strength at 23° C. was measured under the above conditions.
100X100X3−の平板を成形し、ゲート付近のフ
ローマーク、シルバーマーク等不良の有無を目視で観察
し評価した。A flat plate of 100×100×3− was molded, and the presence or absence of defects such as flow marks and silver marks near the gate was visually observed and evaluated.
O:はとんど不良の無いもの
△:やや不良のもの
×:不良の著しいもの
第2表の結果から明らかなように、本発明の樹脂組成物
は滞留後の溶融粘度並びに物性の低下が著しく改善され
、かつ成形品の諸物性も極めて優れている。O: Almost no defect △: Slightly defective ×: Significantly defective As is clear from the results in Table 2, the resin composition of the present invention shows no decrease in melt viscosity and physical properties after residence. This has been significantly improved, and the physical properties of the molded product are also excellent.
末端にエポキシ基を有するポリアリレートを用いること
による顕著な効果が奏される理由は明らかではないが、
エポキシ基を有しないポリアリレートを用いた場合に比
べて、ポリアミド中のポリアリレート分散相の分散粒径
が非常に小さく且つ均一であることが走査型電子顕微鏡
観察により認められた。また、この樹脂組成物を溶融状
態で滞留させた後も、その分散粒径はほとんど変わらな
いことがわかった。これらのことから、本発明の組成物
は、特異的にポリアリレート粒子とポリアミドの界面が
非常に安定化しているものと推定できる。このようなポ
リアリレートのエポキシ基の及ぼす効果は、従来全く知
られておらず、本発明者らにより初めて見出されたもの
である。Although it is not clear why the use of polyarylate having an epoxy group at the end produces a remarkable effect,
It was observed by scanning electron microscopy that the dispersed particle size of the polyarylate dispersed phase in the polyamide was much smaller and more uniform than when polyarylate without epoxy groups was used. Furthermore, it was found that even after this resin composition was allowed to remain in a molten state, the dispersed particle size remained almost unchanged. From these facts, it can be assumed that in the composition of the present invention, the interface between the polyarylate particles and the polyamide is particularly stabilized. Such an effect exerted by the epoxy group of polyarylate was completely unknown in the past, and was discovered for the first time by the present inventors.
また、耐衝撃性付与剤としてコアシェル型グラフト共重
合体を用いることにより、ポリアリレートとポリアミド
からなる樹脂組成物の前記問題点がことごとく解消され
ることは驚くべきことである。Furthermore, it is surprising that by using a core-shell type graft copolymer as an impact resistance imparting agent, all of the above-mentioned problems of resin compositions made of polyarylate and polyamide can be solved.
軟土の通り、本発明によれば耐衝撃性、特に耐高速打ち
抜き衝撃性、表面性、及びウェルド部強度並びに溶融状
態における滞留安定性をバランス良く備えた樹脂組成物
が提供される。As with soft soil, the present invention provides a resin composition having a well-balanced impact resistance, particularly high-speed punching impact resistance, surface properties, weld strength, and retention stability in a molten state.
特許出願人 鐘淵化学工業株式会社Patent applicant Kanebuchi Chemical Industry Co., Ltd.
Claims (1)
%とポリアミド80〜20重量%からなる樹脂組成物(
A)100重量部に対し、コアシェル型グラフト共重合
体(B)1〜40重量部を添加してなる熱可塑性樹脂組
成物。 2、エポキシ基を有するポリアリレートのエポキシ基含
有量がエポキシ価(樹脂1g中に含まれるエポキシ基の
10^−^6当量)にして2〜100である請求項1記
載の熱可塑性樹脂組成物。 3、エポキシ基を有するポリアリレートのエポキシ基含
有量がエポキシ価(樹脂1g中に含まれるエポキシ基の
10^−^6当量)にして10〜50である請求項1記
載の熱可塑性樹脂組成物。 4、ポリアリレートが2,2−ビス(4−ヒドロキシフ
ェニル)−プロパン(ビスフェノールA)と、テレフタ
ル酸及び/又はイソフタル酸からなる芳香族ポリエステ
ルである請求項1〜3記載の熱可塑性樹脂組成物。 5、ポリアリレートが2,2−ビス(4−ヒドロキシフ
ェニル)−プロパン(ビスフェノールA)及び1,1−
ビス(4−ヒドロキシフェニル)1−フェニルエタンと
、テレフタル酸及び/又はイソフタル酸からなる芳香族
ポリエステルである請求項1〜3記載の熱可塑性樹脂組
成物。 6、ポリアリレートの分子量が固有粘度(クロロホルム
溶液、30℃)で表して0.2〜1.5dl/gである
請求項1〜5記載の熱可塑性樹脂組成物。 7、ポリアリレートの分子量が固有粘度(クロロホルム
溶液、30℃)で表して0.4〜0.8dl/gである
請求項1〜5記載の熱可塑性樹脂組成物。 8、ポリアミドがナイロン−6である請求項1〜7記載
の熱可塑性樹脂組成物。 9、ポリアミドがナイロン−6,6である請求項1〜7
記載の熱可塑性樹脂組成物。[Scope of Claims] 1. A resin composition consisting of 20 to 80% by weight of polyarylate having an epoxy group and 80 to 20% by weight of polyamide (
A thermoplastic resin composition prepared by adding 1 to 40 parts by weight of a core-shell type graft copolymer (B) to 100 parts by weight of A). 2. The thermoplastic resin composition according to claim 1, wherein the epoxy group content of the polyarylate having epoxy groups is 2 to 100 in terms of epoxy value (10^-^6 equivalents of epoxy groups contained in 1 g of resin). . 3. The thermoplastic resin composition according to claim 1, wherein the polyarylate having epoxy groups has an epoxy group content of 10 to 50 in terms of epoxy value (10^-^6 equivalents of epoxy groups contained in 1 g of resin). . 4. The thermoplastic resin composition according to claims 1 to 3, wherein the polyarylate is an aromatic polyester consisting of 2,2-bis(4-hydroxyphenyl)-propane (bisphenol A) and terephthalic acid and/or isophthalic acid. . 5. Polyarylate is 2,2-bis(4-hydroxyphenyl)-propane (bisphenol A) and 1,1-
4. The thermoplastic resin composition according to claim 1, which is an aromatic polyester consisting of bis(4-hydroxyphenyl)1-phenylethane and terephthalic acid and/or isophthalic acid. 6. The thermoplastic resin composition according to claims 1 to 5, wherein the polyarylate has a molecular weight of 0.2 to 1.5 dl/g expressed in intrinsic viscosity (chloroform solution, 30°C). 7. The thermoplastic resin composition according to claims 1 to 5, wherein the polyarylate has a molecular weight of 0.4 to 0.8 dl/g expressed in intrinsic viscosity (chloroform solution, 30°C). 8. The thermoplastic resin composition according to claims 1 to 7, wherein the polyamide is nylon-6. 9. Claims 1 to 7 wherein the polyamide is nylon-6,6.
The thermoplastic resin composition described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17423790A JPH0459867A (en) | 1990-06-29 | 1990-06-29 | Thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17423790A JPH0459867A (en) | 1990-06-29 | 1990-06-29 | Thermoplastic resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0459867A true JPH0459867A (en) | 1992-02-26 |
Family
ID=15975119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17423790A Pending JPH0459867A (en) | 1990-06-29 | 1990-06-29 | Thermoplastic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0459867A (en) |
-
1990
- 1990-06-29 JP JP17423790A patent/JPH0459867A/en active Pending
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