JPH0459432U - - Google Patents
Info
- Publication number
- JPH0459432U JPH0459432U JP10190790U JP10190790U JPH0459432U JP H0459432 U JPH0459432 U JP H0459432U JP 10190790 U JP10190790 U JP 10190790U JP 10190790 U JP10190790 U JP 10190790U JP H0459432 U JPH0459432 U JP H0459432U
- Authority
- JP
- Japan
- Prior art keywords
- high thermal
- laminated
- isothermal
- block
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Thermally Actuated Switches (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案の一実施例の構成図、第2図は
本考案の他の実施例を示す構成図、第3図は従来
の等温化構造の一例を示す構成図である。
1……基板、2……端子、3……積層ブロツク
、4a……高熱伝導材料(第1部材)、4b……
熱絶縁材料(第2部材)、5……ポツテイング材
。
FIG. 1 is a block diagram of one embodiment of the present invention, FIG. 2 is a block diagram of another embodiment of the present invention, and FIG. 3 is a block diagram of an example of a conventional isothermal structure. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Terminal, 3...Laminated block, 4a...High thermal conductivity material (first member), 4b...
Heat insulating material (second member), 5...potting material.
Claims (1)
きい金属ブロツクと、 熱伝導率の高い第1の部材と熱絶縁性の高い第
2の部材が積層され、前記金属ブロツクに重ね合
わされる積層部材、 とで構成されたことを特徴とする等温化構造。[Claims for Utility Model Registration] A metal block with a large heat capacity formed to surround an isothermal object, a first member with high thermal conductivity and a second member with high thermal insulation are laminated, and the metal An isothermal structure characterized by comprising: a laminated member superimposed on a block;
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10190790U JPH0459432U (en) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10190790U JPH0459432U (en) | 1990-09-28 | 1990-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0459432U true JPH0459432U (en) | 1992-05-21 |
Family
ID=31845727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10190790U Pending JPH0459432U (en) | 1990-09-28 | 1990-09-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0459432U (en) |
-
1990
- 1990-09-28 JP JP10190790U patent/JPH0459432U/ja active Pending
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