JPH0459143U - - Google Patents
Info
- Publication number
- JPH0459143U JPH0459143U JP10198590U JP10198590U JPH0459143U JP H0459143 U JPH0459143 U JP H0459143U JP 10198590 U JP10198590 U JP 10198590U JP 10198590 U JP10198590 U JP 10198590U JP H0459143 U JPH0459143 U JP H0459143U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor chip
- substrate
- electrodes
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10198590U JPH0459143U (ar) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10198590U JPH0459143U (ar) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459143U true JPH0459143U (ar) | 1992-05-21 |
Family
ID=31845872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10198590U Pending JPH0459143U (ar) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459143U (ar) |
-
1990
- 1990-09-27 JP JP10198590U patent/JPH0459143U/ja active Pending