JPH0458972U - - Google Patents
Info
- Publication number
- JPH0458972U JPH0458972U JP10051690U JP10051690U JPH0458972U JP H0458972 U JPH0458972 U JP H0458972U JP 10051690 U JP10051690 U JP 10051690U JP 10051690 U JP10051690 U JP 10051690U JP H0458972 U JPH0458972 U JP H0458972U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- contact portions
- connector
- fit
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000006071 cream Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10051690U JPH0458972U (enExample) | 1990-09-26 | 1990-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10051690U JPH0458972U (enExample) | 1990-09-26 | 1990-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0458972U true JPH0458972U (enExample) | 1992-05-20 |
Family
ID=31843238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10051690U Pending JPH0458972U (enExample) | 1990-09-26 | 1990-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0458972U (enExample) |
-
1990
- 1990-09-26 JP JP10051690U patent/JPH0458972U/ja active Pending