JPH0458226A - Film carrier mounting structure - Google Patents

Abstract

PURPOSE:To obtain a film carrier mounting structure easy to repair by connecting and fixing a glass substrate and a film carrier to each other by a retaining plat and a wedge. CONSTITUTION:A parallel electrode 3 made of ITO or the like is formed on a glass substrate 2. With respect to a film carrier 1 to which the inner lead of a driving IC 6 is bonded, an outer lead is led out to face the parallel electrode 3. A liquid crystal display element and the film carrier are aligned to each other and are temporarily connected. The connection part is retained by a retaining plate 7, and a wedge 8 is inserted, and a pressure required for connection is applied to fix the connection part. The function of the liquid crystal display element is checked thereafter, and work is executed when failure is detected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a film carrier mounting structure, and more particularly to an outer lead connection structure between a glass substrate for liquid crystal display and a film carrier.

[Prior Art] In recent years, the field of use of liquid crystal display elements has expanded, and liquid crystal display elements, which are used in the display parts of office automation equipment such as word processors and personal computers, have satisfied the function of a display that replaces the conventional CRT. Therefore, there is a demand for higher capacity, higher definition, and improved resolution. The mounting structure of these liquid crystal display devices includes driving I
A commonly used method is to use C as a film carrier and connect it to parallel electrodes of a liquid crystal display element using an anisotropic conductive film.

FIG. 3 shows a cross-sectional view of the mounting structure.

In the figure, a liquid crystal drive member C6 is connected to a film made of polyimide or the like by inner leads, and is configured as a film carrier 1. This film carrier 1 is connected to parallel electrodes 3 made of ITO or the like formed on a glass substrate 2 of a liquid crystal display element by thermocompression using an anisotropic conductive film 4.

[Problems to be Solved by the Invention] However, according to the above-described mounting method, epoxy or styrene resin is often used as an adhesive for the anisotropic conductive film 4 used for connection.

Therefore, since the connection is maintained by the curing of the resin by thermocompression bonding, when a defective film carrier occurs, repairability is very poor and takes a long time.Also, even if repair is possible, the electrode 3 of the liquid crystal display element may be scratched, etc., resulting in a defective film carrier. There were some problems, such as problems.

SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide a film carrier mounting structure that can be easily repaired when mounting a glass substrate and a film carrier to solve the above-mentioned drawbacks of the prior art.

[Means to solve the problem]

The film carrier mounting structure of the present invention includes a glass substrate on which a plurality of parallel electrodes are formed on one end, and a film carrier on which a plurality of parallel electrodes are formed on one end of a flexible insulating film. In the film carrier mounting structure formed by connecting the glass substrate and the film carrier, the glass substrate and the film carrier are fixed by a holding plate and a wedge, and are connected to each other.

[Example 1] Hereinafter, the present invention will be explained in more detail based on an example. Fig. 1 is a perspective view showing an example of the present invention, and Fig. 2 is a sectional view thereof. In the figure, in the liquid crystal display element, parallel electrodes 3 made of ITO are formed on a glass substrate 2. Further, the film carrier 1 to which the driving IC 6 is inner lead-bonded has outer leads led out so as to face the parallel electrodes 3. The liquid crystal display element and the film carrier are aligned with each other to make a temporary connection. Next, the connection part is held down by the presser plate 7, and the wedge 8 is inserted to apply the pressure necessary for connection to fix the connection part. After that, we perform a functional test of the liquid crystal display element, and if any defects are found, rework is performed. The results of failures of liquid crystal display elements and film carriers mounted using such a film carrier mounting structure are compared with those of conventional mounting structures and are shown in the table below.

was also able to improve.

〔Effect of the invention〕

As described above, by using the film carrier mounting structure of the present invention, it is possible to provide a film carrier mounting structure that can be easily repaired when mounting a glass substrate and a film carrier.

As is clear from this table, by using the present invention,
Significant progress has been made.

Furthermore, although the present invention has been described regarding the mounting structure of a liquid crystal display element, it is also effective for general outer lead bonding using a film carrier.

[Example 2] In Example 1, the liquid crystal display element and film carrier 1
Example 1 Using a conductive connector film for the connection part of
When I implemented it using the same procedure as above, I got the same good results and the connection reliability was high.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing an embodiment of the film carrier mounting structure of the present invention, Fig. 2 is a sectional view showing the connection part of the film carrier mounting structure of the present invention, and Fig. 3 is a conventional film carrier with an anisotropic structure. FIG. 3 is a cross-sectional view showing a mounting structure when a conductive film is used for connection. Applicant Seiko Epson Co., Ltd. Agent Patent attorney Kizobe Suzuki and one other person Figure 2

Claims (2)

[Claims] (1) A film formed by connecting a glass substrate with multiple parallel electrodes formed on one end and a film carrier on a flexible insulating film with multiple parallel electrodes formed on one end. A film carrier mounting structure characterized in that the glass substrate and the film carrier are fixed by a holding plate and a wedge and are connected to each other. (2) The film carrier mounting structure according to claim 1, wherein the parallel electrodes of the glass substrate and the parallel electrodes of the film carrier are connected using a conductive connector film.