JPH0457843A - Conductive resin composition - Google Patents
Conductive resin compositionInfo
- Publication number
- JPH0457843A JPH0457843A JP16799890A JP16799890A JPH0457843A JP H0457843 A JPH0457843 A JP H0457843A JP 16799890 A JP16799890 A JP 16799890A JP 16799890 A JP16799890 A JP 16799890A JP H0457843 A JPH0457843 A JP H0457843A
- Authority
- JP
- Japan
- Prior art keywords
- carbon black
- resin composition
- surface modifier
- conductive
- conductive carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 15
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003607 modifier Substances 0.000 claims abstract description 12
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 239000005038 ethylene vinyl acetate Substances 0.000 abstract description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 abstract description 2
- 239000006229 carbon black Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 239000011362 coarse particle Substances 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004708 Very-low-density polyethylene Substances 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ゴム・プラスチック絶縁型カケープルの半導
電層用の材料として好適な導電性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a conductive resin composition suitable as a material for a semiconductive layer of a rubber/plastic insulation type capacitor.
（従来の技術）
高電圧用のゴム・プラスチック絶縁型カケープル（以下
「電カケープル」という）の内部半導電層及び外部半導
電層の形成材料としては、オレフィン系樹脂に導電性カ
ーボンブラックを配合したものが用いられている。(Prior technology) As a material for forming the inner and outer semiconductive layers of a rubber/plastic insulated cable for high voltage use (hereinafter referred to as "electric cable"), conductive carbon black is blended with olefin resin. something is being used.
（発明が解決しようとする課題）
導電性カーボンブラックのオレフィン系樹脂への分散性
が悪い場合には、俗にツブと言われる導電性カーボンブ
ラックが凝集した粗粒が多数束じることがある。このよ
うに多くの粗粒が発生した樹脂組成物により半導電層を
形成した場合には、半導電層と絶縁体層との界面に粗粒
が存在して突起を生じさせる。かかる突起は、電カケー
プルの使用時において電界の集中を招き、耐破壊特性を
低下させる原因となる。(Problem to be solved by the invention) If the dispersibility of conductive carbon black into olefin resin is poor, many coarse particles of conductive carbon black aggregated, commonly known as whelk, may be bundled together. . When a semiconductive layer is formed using a resin composition in which many coarse particles are generated in this way, the coarse particles are present at the interface between the semiconductive layer and the insulating layer, causing protrusions. Such protrusions cause concentration of the electric field when the electric cable is used, and cause deterioration of the breakdown resistance.
本発明は、上記問題を解決するため、ベース樹脂中に導
電性カーボブラックを均一に分散させ、電カケープル使
用時における耐破壊特性の低下を防止することを目的と
する。In order to solve the above-mentioned problems, the present invention aims to uniformly disperse conductive carboblack in a base resin to prevent deterioration of breakdown resistance when using an electric cable.
（課題を解決するための手段及び作用）上記目的を達成
するため本発明は、オレフィン系樹脂、導電性カーボン
ブラック及びアルミニウム系表面改質剤を含有すること
を特徴とする導電性樹脂組成物を提供する。(Means and effects for solving the problems) In order to achieve the above object, the present invention provides a conductive resin composition characterized by containing an olefin resin, conductive carbon black, and an aluminum surface modifier. provide.
本発明で用いるオレフィン系樹脂としては、低、中又は
高密度ポリエチレン、超低密度ポリエチレン、直鎖状低
密度ポリエチレン、ポリプロピレン、ポリブテン−１１
エチレン−プロピレン共重合体、エチレン−酢酸ビニル
共重合体、エチレン−アクリル酸共重合体、エチレン−
アクリル酸メチル共重合体、エチレン−アクリル酸エチ
ル共重合体、エチレン−スチレン共重合体、エチレン−
酢酸ビニル−塩化ビニル三元共重合体などを挙げること
ができる。これらは単独で又は二種以上を用いることが
できる。The olefin resin used in the present invention includes low, medium or high density polyethylene, very low density polyethylene, linear low density polyethylene, polypropylene, polybutene-11
Ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-
Methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-styrene copolymer, ethylene-
Examples include vinyl acetate-vinyl chloride terpolymer. These can be used alone or in combination of two or more.
本発明で用いる導電性カーボンブラックとしては、アセ
チレンブラック、ファーネスブラック、ケッチエンブラ
ックなどを挙げることができる。Examples of the conductive carbon black used in the present invention include acetylene black, furnace black, and Ketschen black.
導電性カーボンブラックの配合量は、オレフィン系樹脂
１００重量部に対して１０〜８０重量部が好ましい。The amount of conductive carbon black to be blended is preferably 10 to 80 parts by weight per 100 parts by weight of the olefin resin.
本発明で用いるアルミニウム系表面改質剤としては、例
えば、次式：
（式中Ｒは、炭素数５〜２０のアルキル基を表す）で示
されるものを用いることができる。前記式で示されるア
ルミニウム系表面改質剤としては、基Ｒが炭素数８〜１
８のアルキル基、例えば、オクチル基、ノニル基、デシ
ル基、ウンデシル基、ドデシル基、トリデシル基、テト
ラデシル基、ペンタデシル基、ヘキサデシル基、ヘプタ
デシル基、オクタデシル基が好ましい。As the aluminum-based surface modifier used in the present invention, for example, one represented by the following formula: (wherein R represents an alkyl group having 5 to 20 carbon atoms) can be used. As the aluminum-based surface modifier represented by the above formula, the group R has 8 to 1 carbon atoms.
Preferred are alkyl groups of No. 8, such as octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, and octadecyl.
アルミニウム系表面改質剤の配合量は、オレフィン系樹
脂１００重量部に対して１〜１０重量部が好ましい。ま
た、このアルミニウム系表面改質剤の配合量は、導電性
カーボンブラックの配合量の０．５〜１０重量％となる
量であることが好ましい。The amount of the aluminum surface modifier to be blended is preferably 1 to 10 parts by weight per 100 parts by weight of the olefin resin. Further, the amount of the aluminum-based surface modifier is preferably 0.5 to 10% by weight of the amount of conductive carbon black.
本発明の導電性樹脂組成物には、上記成分のほかにも公
知の架橋剤、抗酸化剤、滑剤、各種充填剤などを配合す
ることができる。In addition to the above-mentioned components, the conductive resin composition of the present invention may contain known crosslinking agents, antioxidants, lubricants, various fillers, and the like.
本発明の導電性樹脂組成物においては、上記各成分を同
時に混練りすることにより得られるが、その他、オレフ
ィン系樹脂に、予めアルミニウム系表面改質剤により表
面処理した導電性カーボンブラックを配合し、混練りす
ることによっても得ることができる。The conductive resin composition of the present invention is obtained by simultaneously kneading the above components, but in addition, conductive carbon black whose surface has been previously treated with an aluminum surface modifier is blended with the olefin resin. It can also be obtained by kneading.
本発明の導電性樹脂組成物においては、導電性カーボン
ブラックがアルミニウム系表面改質剤により表面処理さ
れているため、ベース樹脂であるオレフィン系樹脂に導
電性カーボンブラックを均一に分散することができる。In the conductive resin composition of the present invention, since the conductive carbon black is surface-treated with an aluminum-based surface modifier, the conductive carbon black can be uniformly dispersed in the olefin resin that is the base resin. .
（実施例）
実施例１〜４及び比較例１．２
第１表に示す各成分をオープンロールで混練りし、各導
電性樹脂組成物を得た。(Example) Examples 1 to 4 and Comparative Example 1.2 Each component shown in Table 1 was kneaded with an open roll to obtain each conductive resin composition.
次に、各樹脂組成物をＴダイ付き押出機により押出成形
して試料とした。これらの試料について体積抵抗率及び
表面の平滑性を試験した。結果を第１表に示す。Next, each resin composition was extruded using an extruder equipped with a T-die to prepare samples. These samples were tested for volume resistivity and surface smoothness. The results are shown in Table 1.
（以下余白）
また、実施例１の樹脂組成物を内部半導電層用の材料と
して用い、下記仕様の電カケープルを試作した。(The following is a blank space.) Furthermore, using the resin composition of Example 1 as a material for an internal semiconductive layer, an electric cable having the following specifications was prototyped.
電カケープル仕様
この電カケープルの内部及び外部半導電層の表面は平滑
であり、ＡＣ破壊強度は６０ ｋＶ／ｍｍであった。Specifications of the electric cable The surfaces of the internal and external semiconductive layers of this electric cable were smooth, and the AC breakdown strength was 60 kV/mm.
（発明の効果）
本発明の導電性樹脂組成物においては、ベース樹脂とな
るオレフィン系樹脂に、アルミニウム系表面改質剤によ
り表面処理された導電性カーボンブラックが均一に分散
されている。(Effects of the Invention) In the conductive resin composition of the present invention, conductive carbon black surface-treated with an aluminum-based surface modifier is uniformly dispersed in the olefin resin serving as the base resin.
本発明の導電性樹脂組成物は、導電性カーボンブラック
の分散不良による粗粒の発生が少ないため、成形後にお
いても前記粗粒に起因する突起の発生を少なくできる。Since the conductive resin composition of the present invention generates fewer coarse particles due to poor dispersion of conductive carbon black, it is possible to reduce the generation of protrusions caused by the coarse particles even after molding.
本発明の導電性樹脂組成物を電カケープルの半導電層用
材料として適用した場合には、電カケープル使用時にお
ける電界の集中を防ぎ、耐破壊特性を著しく向上させる
ことができる。When the conductive resin composition of the present invention is applied as a material for a semiconductive layer of an electric cable, it is possible to prevent concentration of electric field during use of the electric cable and to significantly improve breakdown resistance.
Claims (2)
アルミニウム系表面改質剤を含有することを特徴とする
導電性樹脂組成物。(1) A conductive resin composition characterized by containing an olefin resin, conductive carbon black, and an aluminum surface modifier.
されるものである請求項１記載の導電性樹脂組成物。(2) The aluminum-based surface modifier is represented by the following formula: ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (wherein R represents an alkyl group having 5 to 20 carbon atoms) conductive resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16799890A JPH0457843A (en) | 1990-06-26 | 1990-06-26 | Conductive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16799890A JPH0457843A (en) | 1990-06-26 | 1990-06-26 | Conductive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0457843A true JPH0457843A (en) | 1992-02-25 |
Family
ID=15859907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16799890A Pending JPH0457843A (en) | 1990-06-26 | 1990-06-26 | Conductive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0457843A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008286992A (en) * | 2007-05-17 | 2008-11-27 | Nec Access Technica Ltd | Image forming apparatus |
-
1990
- 1990-06-26 JP JP16799890A patent/JPH0457843A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008286992A (en) * | 2007-05-17 | 2008-11-27 | Nec Access Technica Ltd | Image forming apparatus |
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