JPH0456911A - Optical semiconductor module and production thereof - Google Patents

Abstract

PURPOSE:To obtain stable coupling efficiency between optical fibers and light emitting and receiving elements by mounting and fixing a semiconductor package into the aperture of a lens holder while this package is held inserted via the step part of a guide into the aperture, thereby decreasing the number of parts and joined parts. CONSTITUTION:The step part 16 of the guide is provided on the inside surface on the aperture side at one end of the lens holder 15. The semiconductor package 13 is mounted and fixed by soldering or welding to the lens holder 15 while the semiconductor package 13 is held inserted into the aperture. Since the step part 16 of the guide is formed within the range of the permissible design tolerance, the semiconductor package 13 is mounted and fixed to the lens holder 15 only with the parts accuracy without requiring an axial adjustment. The number of parts and joined parts is decreased in this way and the stable coupling efficiency is obtd. over a long period of time between the optical fibers and the light emitting and receiving elements.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to optical transmission,
Alternatively, the present invention relates to an optical semiconductor module used for optical reception and a manufacturing method thereof.

[Prior Art] As a module for optical transmission or optical reception according to this type of technology, one described in, for example, Japanese Unexamined Patent Publication No. 1-289904 is known.

In this case, as shown in FIG.
The light emitting/receiving element 43 is attached to the opening at one end of the element holder (constructed as a stainless steel cylindrical body) 44 to which the element holder 6 is fixed via the solder plating part 47 that has been previously applied to the inner surface of the opening. It is set to be fixed. Further, the optical fiber 41 is connected to the element holder 44 via the adjustment ring 45 with one end thereof fixed to the fiber holder 42.
However, the mounting and fixing is performed after axial adjustment between the light emitting/receiving element 43 and the optical fiber 41. With the axis adjusted, the element holder 44
and the adjustment ring 45 and between the adjustment ring 45 and the fiber holder 42 are welded using a YAG laser.

[Problems to be Solved by the Invention] However, the module obtained as described above has various defects.

Specifically, the first problem is that the solder material for fixing the light emitting/light receiving element and the element holder flows into the vicinity of the glass window cap of the light emitting/light receiving element, and the solder flux adheres to the glass window cap. . The second problem is that due to variations in the plating range of the solder plating part, the solder material penetrates into the vicinity of the lens fixed inside the element holder, and flux adheres to the lens end face (within the effective lens diameter). It is. Part 3 is that the single-shot/light-receiving element is attached and fixed via solder material without making direct contact with the element holder, so there is a risk that the emitting/light-receiving element may be attached/fixed at an angle to the element holder. , the optical axes of the lens and the light emitting/receiving element become misaligned. Part 4 is that when solder (gold or tin is also acceptable) is plated on the inner surface of the opening at one end of the element holder over a predetermined range, the inner surface other than the predetermined range is masked. is required.

Part 5 is that not only does the module have a large number of component parts (fiber holder (including optical fiber), light emitting/light receiving element, element holder, and adjustment ring), but also the number of joints (between the light emitting/light receiving element and the element holder) is large. There are many jumps between the element holder and the adjustment ring, and between the adjustment ring and the fiber holder. Due to thermal shock, temperature cycles, etc., these joints are likely to be misaligned, and as a result, the coupling efficiency between the optical fiber and the light emitting/receiving element is likely to deteriorate.

The object of the present invention is to reduce the number of component parts and joints by 9,
Moreover, it is an object of the present invention to provide an optical semiconductor module in which stable coupling efficiency can be obtained between an optical fiber and a light emitting/receiving element.

Another object of the present invention is to provide a method for manufacturing an optical semiconductor module that can easily manufacture such an optical semiconductor module while stabilizing the coupling efficiency between the optical fiber and the light emitting/receiving element. It is to serve.

[Means for Solving the Problems] The above object is that a semiconductor package (including a light emitting element or a light receiving element) and an optical fiber are attached and fixed to each of the two openings in the lens holder, but the semiconductor package is not attached to the lens. This is achieved by attaching and fixing a guide step provided over a predetermined length to the inner surface of the holder opening while being inserted thereinto.

Another purpose is to attach and fix the semiconductor package to the lens holder without adjustment, and then attach and fix the optical fiber to the lens holder with its axis adjusted. This is achieved by attaching and fixing the optical fiber to the lens holder without any adjustment after the optical fiber is attached and fixed with its axis adjusted.

[Function] The optical semiconductor module is configured such that a semiconductor package and an optical fiber are attached and fixed to a lens holder. At this time, the semiconductor package is positioned and inserted into the lens holder opening by a guide step. It is designed to be attached and fixed by welding or soldering. This prevents the semiconductor package from being installed or fixed at an angle with respect to the lens holder, and if it is installed or fixed by soldering, the guide steps prevent the solder material from entering the lens holder opening. It is something. Furthermore, since the lens holder itself is configured as an integrated element holder and adjustment ring, 1
This eliminates the need for locations where positional deviation occurs, and as a result, the overall coupling efficiency can be stabilized over a long period of time.

[Example] The present invention will be explained below with reference to FIGS. 1 to 3.

First, FIG. 1 shows a cross section of an example of an optical semiconductor module according to the present invention, and FIG. 2 shows a partially enlarged cross section. As shown in FIG. 1, a lens 14 is fixed inside. A semiconductor package 13 is attached and fixed to one opening of the lens holder 15, and an optical fiber 11 is attached and fixed to the other opening via a fiber holder 12, respectively. The lens 14 is soldered or press-fitted into the lens holder 15, which is configured as a cylindrical body made of Kovar or electromagnetic soft iron.
The lens holder 15 is fixed at a predetermined distance from both ends of the lens holder 15, and a characteristic feature of this lens holder 15 is that a guide stepped portion 16 is provided on the inner surface of the lens holder 15 on the opening side of one end. With the semiconductor package 13 inserted into the opening through the guide step 16, the semiconductor package 13 is attached to the lens holder 15 by soldering or welding.
It is attached and fixed to. Since the guide step portion 16 is formed within a design tolerance range, the semiconductor package 13 can be attached and fixed to the lens holder 15 with only component accuracy without the need for axis adjustment.

When the semiconductor package 13 is attached and fixed by solder, the solder material can be prevented from entering into the opening by the guide stepped portion 16.

After the semiconductor package 13 is attached and fixed to the lens holder 15 as described above, the fiber holder (
12 (configured as a cylindrical body made of aluminum, Kovar, electromagnetic soft iron, etc.) is attached and fixed to the lens holder 15 by soldering or welding with the axis adjusted between the lens holder 15 and the lens holder 15. It is. Since the lens holder 15 is constructed by integrating the element holder and adjustment ring according to the prior art, there is no room for positional displacement due to temperature cycles or thermal shock, and the connection is stable over a long period of time. This results in efficiency.

FIG. 3 also shows a cross section of another example of the optical semiconductor module according to the present invention. What is substantially different from the previous case is that the fiber holder 12 is attached and fixed to the lens holder 15 using only component precision without requiring axis adjustment. That is, in this example, the hole diameter at the other opening of the lens holder 15 and the outer diameter of the fiber holder 12 are within the design tolerance range,
Therefore, the fiber holder 12 can be attached and fixed to the lens holder 15 without the need for axis adjustment. After the fiber holder 12 is attached and fixed in this way, the semiconductor package 13 is attached and fixed in the same way as in the case of optical fibers, but the axis is adjusted when it is attached and fixed. There is.

[Effects of the Invention] As explained above, according to claim 1, stable coupling efficiency can be obtained between the optical fiber and the light emitting/receiving element over a long period of time without requiring a large number of parts or joints. Also,
According to claims 2 and 3.4, such an optical semiconductor module can be easily manufactured.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a cross section of an example of an optical semiconductor module according to the present invention, and FIG. 2 is a diagram showing a partially enlarged state thereof.
FIG. 3 is a diagram showing a cross section of another example of an optical semiconductor module according to the present invention, and FIG. 4 is a diagram showing the configuration of an optical transmitting/receiving module according to the prior art. 11... Optical fiber, 12... Fiber holder. 13... Semiconductor package, 14... Lens, 15
...Lens holder, 16...Guide stepped portion. System ■ Mouth No. 20 No. 3 Tsuta 4

Claims (1)

[Claims] 1. In a lens holder in which a lens is fixed, one opening has a semiconductor package containing a light emitting element or a light receiving element, and the other opening has a semiconductor package for optical communication with the semiconductor package. An optical semiconductor module in which optical fibers each having a tip processed with a ferrule and a connector connected to the other end are attached and fixed while being arranged in a relationship, and the semiconductor package is attached to a lens holder. - When fixing, the semiconductor package is inserted into the lens holder opening via a guide step provided over a predetermined length on the inner surface of the lens holder opening, and is then attached and fixed to the opening. Optical semiconductor module. 2. After the semiconductor package is attached and fixed to the lens holder by welding or soldering without adjustment, the optical fiber is attached and fixed by welding or soldering with the axis adjusted to the lens holder. 2. The method for manufacturing an optical semiconductor module according to claim 1. 3. After the semiconductor package is attached and fixed by welding or soldering with the axis adjusted to the lens holder (without adjusting the optical axis direction), the optical fiber is welded to the lens holder without adjustment, or 2. The method for manufacturing an optical semiconductor module according to claim 1, wherein the optical semiconductor module is attached and fixed using solder.