JPH045653U - - Google Patents
Info
- Publication number
- JPH045653U JPH045653U JP4609290U JP4609290U JPH045653U JP H045653 U JPH045653 U JP H045653U JP 4609290 U JP4609290 U JP 4609290U JP 4609290 U JP4609290 U JP 4609290U JP H045653 U JPH045653 U JP H045653U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- solder film
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4609290U JPH045653U (xx) | 1990-04-27 | 1990-04-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4609290U JPH045653U (xx) | 1990-04-27 | 1990-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH045653U true JPH045653U (xx) | 1992-01-20 |
Family
ID=31560866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4609290U Pending JPH045653U (xx) | 1990-04-27 | 1990-04-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH045653U (xx) |
-
1990
- 1990-04-27 JP JP4609290U patent/JPH045653U/ja active Pending