JPH045649U - - Google Patents

Info

Publication number
JPH045649U
JPH045649U JP4579590U JP4579590U JPH045649U JP H045649 U JPH045649 U JP H045649U JP 4579590 U JP4579590 U JP 4579590U JP 4579590 U JP4579590 U JP 4579590U JP H045649 U JPH045649 U JP H045649U
Authority
JP
Japan
Prior art keywords
circuit board
casing
lid
conductor layer
grounding conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4579590U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4579590U priority Critical patent/JPH045649U/ja
Publication of JPH045649U publication Critical patent/JPH045649U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
JP4579590U 1990-04-27 1990-04-27 Pending JPH045649U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4579590U JPH045649U (ko) 1990-04-27 1990-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4579590U JPH045649U (ko) 1990-04-27 1990-04-27

Publications (1)

Publication Number Publication Date
JPH045649U true JPH045649U (ko) 1992-01-20

Family

ID=31560289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4579590U Pending JPH045649U (ko) 1990-04-27 1990-04-27

Country Status (1)

Country Link
JP (1) JPH045649U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014010074A1 (ja) * 2012-07-13 2014-01-16 三菱電機株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014010074A1 (ja) * 2012-07-13 2014-01-16 三菱電機株式会社 半導体装置
US9363914B2 (en) 2012-07-13 2016-06-07 Mitubishi Electric Corporation Semiconductor device

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