JPH045642U - - Google Patents
Info
- Publication number
- JPH045642U JPH045642U JP4628790U JP4628790U JPH045642U JP H045642 U JPH045642 U JP H045642U JP 4628790 U JP4628790 U JP 4628790U JP 4628790 U JP4628790 U JP 4628790U JP H045642 U JPH045642 U JP H045642U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- suspender
- bonding tool
- end surface
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4628790U JPH08758Y2 (ja) | 1990-04-26 | 1990-04-26 | インナリードボンダ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4628790U JPH08758Y2 (ja) | 1990-04-26 | 1990-04-26 | インナリードボンダ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH045642U true JPH045642U (da) | 1992-01-20 |
JPH08758Y2 JPH08758Y2 (ja) | 1996-01-10 |
Family
ID=31561239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4628790U Expired - Lifetime JPH08758Y2 (ja) | 1990-04-26 | 1990-04-26 | インナリードボンダ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08758Y2 (da) |
-
1990
- 1990-04-26 JP JP4628790U patent/JPH08758Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH08758Y2 (ja) | 1996-01-10 |