JPH045638U - - Google Patents
Info
- Publication number
- JPH045638U JPH045638U JP1990045837U JP4583790U JPH045638U JP H045638 U JPH045638 U JP H045638U JP 1990045837 U JP1990045837 U JP 1990045837U JP 4583790 U JP4583790 U JP 4583790U JP H045638 U JPH045638 U JP H045638U
- Authority
- JP
- Japan
- Prior art keywords
- package
- insulating base
- element mounting
- semiconductor element
- storing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W70/682—
-
- H10W72/01308—
-
- H10W72/07311—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045837U JPH045638U (enExample) | 1990-04-27 | 1990-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045837U JPH045638U (enExample) | 1990-04-27 | 1990-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045638U true JPH045638U (enExample) | 1992-01-20 |
Family
ID=31560369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990045837U Pending JPH045638U (enExample) | 1990-04-27 | 1990-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045638U (enExample) |
-
1990
- 1990-04-27 JP JP1990045837U patent/JPH045638U/ja active Pending