JPH0456345U - - Google Patents
Info
- Publication number
- JPH0456345U JPH0456345U JP9847290U JP9847290U JPH0456345U JP H0456345 U JPH0456345 U JP H0456345U JP 9847290 U JP9847290 U JP 9847290U JP 9847290 U JP9847290 U JP 9847290U JP H0456345 U JPH0456345 U JP H0456345U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin molding
- line
- groove
- figures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9847290U JPH0456345U (fi) | 1990-09-21 | 1990-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9847290U JPH0456345U (fi) | 1990-09-21 | 1990-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456345U true JPH0456345U (fi) | 1992-05-14 |
Family
ID=31839682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9847290U Pending JPH0456345U (fi) | 1990-09-21 | 1990-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456345U (fi) |
-
1990
- 1990-09-21 JP JP9847290U patent/JPH0456345U/ja active Pending