JPH0455854A - Photomask device and pattern forming method using this device - Google Patents

Photomask device and pattern forming method using this device

Info

Publication number
JPH0455854A
JPH0455854A JP2167951A JP16795190A JPH0455854A JP H0455854 A JPH0455854 A JP H0455854A JP 2167951 A JP2167951 A JP 2167951A JP 16795190 A JP16795190 A JP 16795190A JP H0455854 A JPH0455854 A JP H0455854A
Authority
JP
Japan
Prior art keywords
light
phase
degrees
transmitted light
transmitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2167951A
Other languages
Japanese (ja)
Inventor
Koji Matsuoka
松岡 晃次
Yoshihiko Hirai
義彦 平井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2167951A priority Critical patent/JPH0455854A/en
Publication of JPH0455854A publication Critical patent/JPH0455854A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the formation of unnecessary dark parts and to easily form open loop patterns and isolated patterns, etc., by providing a 3rd light transmission region which allows the transmission of light with the intermediate phase of the phases of the transmitted light of 1st and 2nd light for forming dark parts varying in the phases of the transmitted light by about 180 deg. in the parts where the dark parts of the joint parts of these light transmission regions are not required. CONSTITUTION:The 3rd light transmission region 11C which allows the transmission of the light with the intermediate phase of the phases of the transmitted light of the adjacent 1st and 2nd light transmission regions 11A, 11B having 180 deg. phase difference of the transmitted light is provided at the boundary of these light transmission regions, by which the light intensity of this boundary part is raised. The 3rd light transmission region 11C has the effect of less releaving the transfer of the phases of the light in the boundary part of the 1st and 2nd light transmission regions 11A, 11B and has the effect of weakening the interference of the two light beams having 180 deg. phase difference. The formation of the unnecessary dark part below the boundary part of the adjacent 1st and 2nd light transmission regions is prevented in this way and the branch patterns and open loop patterns are easily formed by a phase shift method.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ハーフミクロン以下の微細パターンを有す
る半導体装置等の製造におけるリソグラフィ等に使われ
るフォトマスク装置とそれを用いたパターン形成方法に
関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a photomask device used in lithography, etc. in the manufacture of semiconductor devices having fine patterns of half a micron or less, and a pattern forming method using the same. It is.

〔従来の技術〕[Conventional technology]

縮小投影露光法における解像限界を向上させる方法とし
て位相シフト法が、アイ・イー・イー・イー・トランス
アクションズ・オン・エレクトロン・テ゛パイスジOL
、HD−29,NO,12,12月1982年(IEE
E  Tl?ANSACTIONSON  ELECT
I?ON  DEVICES、  VOL。
The phase shift method is a method to improve the resolution limit in the reduction projection exposure method, as proposed by IE Transactions on Electron Technology.
, HD-29, NO, 12, December 1982 (IEE
E Tl? ANSACTIONSON ELECT
I? ON DEVICES, VOL.

ED−29,NO,12,DECEMBE)l 198
2 )に提案されている。この位相シフト法によれば、
その解像限界を通常の透過型フォトマスク装置による露
光法に比べて数段向上させることができる。また最近で
は、補助パターンによる補助型位相シフト法が、例えば
 1988秋季応用物理学会4a−に−7寺沢ら、19
89 TEEE CH2637−7/8910000−
0057等で発表されている。
ED-29,NO,12,DECEMBE)l 198
2) is proposed. According to this phase shift method,
The resolution limit can be improved by several steps compared to an exposure method using a normal transmission type photomask device. Recently, an auxiliary phase shift method using an auxiliary pattern has been proposed, for example, in 1988 Autumn Applied Physics Conference 4a-7 Terasawa et al., 19
89 TEEE CH2637-7/8910000-
It has been announced as 0057 etc.

第5図falは位相シフト法によるフォトマスク装置の
平面図を示し、41は透明の石英板上の光透過領域、4
2は石英板上にクロム等を塗布して形成した透過光遮断
領域、43は透過光の位相を180度変化さセる位相変
換シフタであり、光透過領域41のうち位相変換シフタ
43のない部分の光透過領域41Aの透過光の位相と位
相変換シフタ43のある部分の光透過領域41Bの透過
光の位相は180度異l6゜ 第5図(b)は、シミュレーションによる第5図(al
のフォトマスク装置の透過光の光強度分布図を示すもの
である6図中の実線はパターン形成限界光強度を示し、
以降のシミュレーション結果についても同様である。
FIG. 5 fal shows a plan view of a photomask device using the phase shift method, in which 41 is a light transmitting area on a transparent quartz plate;
2 is a transmitted light blocking region formed by applying chromium or the like on a quartz plate; 43 is a phase conversion shifter that changes the phase of transmitted light by 180 degrees; The phase of the light transmitted through the light transmission region 41A of the part and the phase of the light transmitted through the light transmission region 41B of the part of the phase conversion shifter 43 are different by 180 degrees.
The solid line in Figure 6, which shows the light intensity distribution diagram of the transmitted light of the photomask device, indicates the limit light intensity for pattern formation,
The same applies to subsequent simulation results.

以上のように構成された従来の位相シフト法によるフォ
トマスク装置においては、第5図fatのC1C2vA
で示す部分では、通常の光透過領域41A(位相変換シ
フタ43のない領域)と透過光の位相が180度変化す
る光透過領域41B(位相変換シフタ43のある領域)
との間に透過光遮断領域42が存在する。その結果、第
5図(alの01−〇2線上での透過光のコントラスト
は、位相変換シフタのない通常の透過型フォトマスク装
置に比べて数段向上する。
In the photomask device using the conventional phase shift method configured as described above, the C1C2vA of fat in FIG.
In the part indicated by , a normal light transmission area 41A (area without phase conversion shifter 43) and a light transmission area 41B (area with phase conversion shifter 43) where the phase of transmitted light changes by 180 degrees.
A transmitted light blocking region 42 exists between the two. As a result, the contrast of the transmitted light on the 01-02 line of FIG.

位相変換シフタのない通常の透過型フォトマスク装置で
は、透過光遮断領域の幅が狭くなると、透過光遮断領域
のエツジ部分からの光の回折によって、その透過光遮断
領域の下方のi3過光の光強度は完全にOにはならない
。つまり、光をi!i遇する部分と遮断する部分とで、
光の強弱の差が少なくなり(言い替えれば、光のコント
ラストが悪くなり)、フォトマスクどおりのパターン形
成ができなくなる。
In a normal transmission type photomask device without a phase conversion shifter, when the width of the transmitted light blocking area becomes narrow, the i3 transmitted light below the transmitted light blocking area is The light intensity does not become completely O. In other words, the light is i! The part that treats you and the part that blocks you,
The difference in intensity of light decreases (in other words, the contrast of light deteriorates), making it impossible to form a pattern according to the photomask.

しかし、第5図fa+のフォトマスク装置のように、透
過光遮断領域42を介して透過光の位相を180度変化
させる位相変換シフタ43を片側の光透過領域41Bに
設けた場合、透過光遮断領域42では位相が180度異
l6た2つの透過光が干渉する。
However, as in the photomask device shown in FIG. In the region 42, two transmitted lights whose phases differ by 180 degrees l6 interfere with each other.

それらの回折光は、互いに消し合う作用があるため、透
過光遮断領域42の下方の透過光の光強度はほぼ0にな
る。よって、透過光遮断領域42の幅が狭くても、光の
コントラストが向上し、より微細なパターン形成が可能
となる。つまり、幅の狭い透過光遮断領域42を挟んで
接合する、互いに透過光の位相路180変異なる2つの
光i3過碩域41A、41Bは、その接合部の下方に暗
部を形成する作用をもつことになる。
Since these diffracted lights have the effect of canceling each other out, the light intensity of the transmitted light below the transmitted light blocking region 42 becomes approximately 0. Therefore, even if the width of the transmitted light blocking region 42 is narrow, the contrast of light is improved and it becomes possible to form a finer pattern. In other words, the two light i3-excess regions 41A and 41B, which are joined across the narrow transmitted light blocking region 42 and whose transmitted light phase paths differ by 180, have the effect of forming a dark region below the joint. It turns out.

第7図ta+は補助型の位相シフト法の一例によるフォ
トマスク装置の平面図を示し、51は透明の石英板上の
光透過領域、52は石英板上にクロム等を塗布して形成
した透過光遮断領域、53は透過光の位相を180度変
化させる位相変換シフタであり、光透過領域51の透過
光遮断領域52に接する領域に形成されており、光透過
領域51のうち位相変換シフタ53のない部分の光透過
領域51Aの透過光の位相と位相変換シフタ53のある
部分の光透過領域51Bの透過光の位相は180度異l
6゜ 第7図Cb)は第7図(alのフォトマスク装置の透過
光の振幅の分布図を示し、第7図(C1は透過光の光強
度分布図を示している。
FIG. 7 ta+ shows a plan view of a photomask device using an example of the auxiliary phase shift method, where 51 is a light transmitting area on a transparent quartz plate, and 52 is a light transmitting area formed by coating chromium or the like on the quartz plate. The light blocking area 53 is a phase conversion shifter that changes the phase of transmitted light by 180 degrees, and is formed in a region of the light transmission area 51 that is in contact with the transmitted light blocking area 52. The phase of the light transmitted through the light transmission region 51A in the portion without the phase conversion shifter 53 and the phase of the light transmitted in the light transmission region 51B in the portion with the phase conversion shifter 53 are different by 180 degrees.
6. FIG. 7 Cb) shows a distribution diagram of the amplitude of transmitted light of the photomask device of FIG. 7 (al), and FIG. 7 (C1) shows a light intensity distribution diagram of transmitted light.

第7図[alのフォトマスク装置においては、第7図(
blのように、光透過領域51Aを通っ透過光の振幅T
1は、ゆるやかにすそをひく分布をもつ。
In the photomask device shown in FIG.
As shown in bl, the amplitude T of the transmitted light passing through the light transmitting region 51A is
1 has a distribution that tapers off gently.

一方、透過光の位相が180度変化する光透過領域51
Bを通った光の振幅T2は、光透過領域51Aを通った
光の振幅T1と逆の向きに、光透過領域51Aを通っ透
過光の振幅T1の両すそ部分で小さな山をもつ。両者を
たし合わせると、振幅T1のすそが振幅T2で打ち消さ
れて消滅し、急峻な振幅T3が得られる。よって、光透
過領域51と透過光遮断領域52との間に大きな強度差
をもった第7図tc+のような光強度分布が得られる。
On the other hand, a light transmission region 51 in which the phase of transmitted light changes by 180 degrees
The amplitude T2 of the light passing through B has small peaks at both sides of the amplitude T1 of the light passing through the light transmitting region 51A in the opposite direction to the amplitude T1 of the light passing through the light transmitting region 51A. When the two are added, the base of the amplitude T1 is canceled out by the amplitude T2 and disappears, resulting in a steep amplitude T3. Therefore, a light intensity distribution as shown in FIG. 7 tc+ with a large intensity difference between the light transmitting region 51 and the transmitted light blocking region 52 is obtained.

第8図fatは、光透過領域のみから構成される従来の
透過型フォトマスク装置を示す。第8図falにおいて
、91は透明の石英板上の光i3過領域(全体)、92
は石英板上に形成して透過光の位相を180度変化させ
る位相変換シフタであり、光透過領域91のうち位相変
換シフタ92のない部分の光透過領域91Aの透過光の
位相と位相変換シフタ92のある部分の光透過領域91
Bの透過光の位相は180度異l6゜この場合、透過光
の位相が180度異l6光透過領域を直接接合させるこ
とで、その接合部の下方に暗部が形成されることになり
、透過光の位相が180度異l62つの光透過領域が暗
部形成の作用をもつことになる。
FIG. 8 fat shows a conventional transmission type photomask device consisting of only a light transmission region. In Fig. 8 fal, 91 is the light i3 transmission area (entire area) on the transparent quartz plate, 92
is a phase conversion shifter formed on a quartz plate to change the phase of transmitted light by 180 degrees, and the phase of the transmitted light of the light transmission area 91A in the part of the light transmission area 91 where the phase conversion shifter 92 is not provided and the phase conversion shifter Light transmission area 91 in a certain part of 92
The phase of the transmitted light of B is different by 180 degrees l6 In this case, the phase of the transmitted light is different by 180 degrees l6 By directly joining the light transmitting regions, a dark part is formed below the joint, and the transmitted light The two light transmitting regions with a 180 degree difference in light phase function to form a dark area.

第8図(alに示すフォトマスク装置では、透過光の位
相を180度変化させる位相変換シフタ92の周辺部全
域で光強度がOになるため、位相変換シフタ92の周辺
に沿った一筆書きパターンが得られる。第9図fatに
、第8図(alに示すフォトマスク装置による転写像の
うち一点鎖線99Aで囲んだ領域の部分での透過光の相
対的な光強度のシミュレーション結果を示す。パターン
100は位相変換ソフタ92の周辺部に沿ってループ状
に形成されている。
In the photomask device shown in FIG. 8(al), the light intensity is O in the entire periphery of the phase conversion shifter 92 that changes the phase of transmitted light by 180 degrees, so the one-stroke pattern along the periphery of the phase conversion shifter 92 is FIG. 9 fat shows the simulation result of the relative light intensity of the transmitted light in the area surrounded by the dashed line 99A of the image transferred by the photomask device shown in FIG. 8 (al). The pattern 100 is formed in a loop shape along the periphery of the phase conversion softer 92.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、前記の通常の位相シフト法は、第5図t
a+に示すように、光透過領域41 (クロム等の透過
光遮断領域がない部分)で、かつ透過光の位相を180
度変化させる位相変換シフタ43の境界(第5図+al
のK)が存在するとき、つまり透過光の位相が180度
異l62つの光透過領域41A41Bが直接接合する領
域が存在するときは、その接合部の下方に不要暗部が形
成され、そこに透過光遮断領域があるかのようにレジス
トパターンが形成されてしまう。すなわち、そこでの断
面(第5図のり、−D2線)では、その境界で180度
の位相差を持つ2つの透過光の位相が、互いに相殺し、
その振幅がOになる。光強度は、振幅の2乗で表される
ので、前記のような境界ではほぼ0になる。第5図(′
b)に示した透過光の光強度のシミュレーション結果で
も、境界Kに対応する箇所では、そこに透過光遮断領域
があるかのように光強度は0になっている。
However, the conventional phase shift method described above is
As shown in a+, the phase of the transmitted light is set to 180 in the light transmitting region 41 (the part where there is no transmitted light blocking region such as chrome).
Boundary of the phase conversion shifter 43 that changes the degree (Fig. 5 + al
K) exists, that is, when there is a region where the two light transmitting regions 41A and 41B are directly joined, that is, the phase of the transmitted light differs by 180 degrees, an unnecessary dark region is formed below the joint, and the transmitted light is A resist pattern is formed as if there were a blocking area. That is, in the cross section there (line -D2 in Figure 5), the phases of the two transmitted lights that have a phase difference of 180 degrees at the boundary cancel each other out,
Its amplitude becomes O. Since the light intensity is expressed as the square of the amplitude, it becomes approximately 0 at the boundary as described above. Figure 5 ('
Also in the simulation result of the light intensity of the transmitted light shown in b), the light intensity is 0 at the location corresponding to the boundary K, as if there is a transmitted light blocking area there.

さらに、第5図のり、−D2線上でのフォトマスク装置
の断面図を第6図(alに示し、その透過光の光強度分
布図を第6図(blに示し、またそれによって形成され
るレジストパターンの断面図を第6図(C1に示す。こ
のとき、上記の理由により、正常なレジストパターン4
8の他に、境界Kに対応する箇所にレジストパターン4
8Aが形成されることになる。
Furthermore, a cross-sectional view of the photomask device taken along the line -D2 in FIG. 5 is shown in FIG. 6 (al), and a light intensity distribution diagram of the transmitted light is shown in FIG. A cross-sectional view of the resist pattern is shown in FIG. 6 (C1).
8, resist pattern 4 is placed at the location corresponding to boundary K.
8A will be formed.

これは、つぎのエンチング工程ではマスクとなり、本来
つながらないパターンがつながってしまうという好まし
くない事態が起こる。
This becomes a mask in the next etching process, and an undesirable situation occurs in which patterns that should not originally be connected are connected.

以上のように、従来の位相シフト法では、光透過領域が
分枝パターンでの境界が存在しにくい閉ループでは適応
が可能であるが、前記のような境界が存在する開ループ
では、位相変換シックの境界でパターンがつながり、適
応が不可能である。
As described above, the conventional phase shift method can be applied in a closed loop where the light transmission region has a branch pattern and boundaries are difficult to exist, but in an open loop where such boundaries exist, the phase shift method is difficult to apply. The patterns are connected at the boundaries of the , making adaptation impossible.

現在、主流になっている高解像度レジストがポジレジス
トであり、より微細化を要求されるパターンが配線等の
開ループであることを考慮すると、位相変換シックを適
応できるパターンが非常に限られてくるという問題点を
有していた。
Considering that the currently mainstream high-resolution resist is a positive resist, and that the patterns that require further miniaturization are open loops such as wiring, the patterns to which phase conversion thick can be applied are extremely limited. However, there was a problem that

また前記の補助型位相シフト法は、位相シフト法で問題
となるパターンによる制限はない。しかし、その効果は
位相シフト法に比べて少なく、主流の技術とはなりにく
いことは日経マイクロデバイス(NIKKEI MIC
I?0DEVICE > 1990年5月号P7475
に論ぜられている。
Furthermore, the auxiliary phase shift method described above is not limited by patterns, which is a problem with the phase shift method. However, the effect is less than that of the phase shift method, and it is unlikely that it will become a mainstream technology, according to NIKKEI MIC.
I? 0DEVICE > May 1990 issue P7475
is discussed.

一方、第8図(alに示す従来の透過型フォトマスク装
置では、位相変換シフタ92の周辺に沿った一筆書きパ
ターンしか得られず、孤立したパターンが得られないと
いう欠点がある。
On the other hand, the conventional transmission type photomask device shown in FIG. 8(al) has the disadvantage that only a single stroke pattern along the periphery of the phase conversion shifter 92 can be obtained, and an isolated pattern cannot be obtained.

この発明の目的は、位相変換シフタを用いてパターン形
成を行う際に、不要暗部の形成を防止し、開ループパタ
ーンや孤立パターン等を容易に形成することができるフ
ォトマスク装置およびこれを用いたパターン形成方法を
提供することである。
An object of the present invention is to provide a photomask device that can prevent the formation of unnecessary dark areas and easily form open-loop patterns, isolated patterns, etc. when forming patterns using a phase conversion shifter, and a photomask device using the same. An object of the present invention is to provide a pattern forming method.

〔課題を解決するための手段〕[Means to solve the problem]

請求項(1)記載のフォトマスク装置は、透過光の位相
が互いに略180変異なる暗部形成用の第1および第2
の光透過領域を直接もしくは透過光遮断領域を介して接
合し、前記第1および第2の光透過領域の接合部の暗部
形成不要部分に前記第1および第2の光透過領域の透過
光の位相の中間の位相で光を透過させる第3の光透過領
域を介在させている。
The photomask device according to claim (1) includes a first and a second mask for forming a dark area whose transmitted light has a phase difference of about 180 from each other.
The light transmitting regions of the first and second light transmitting regions are joined directly or through a transmitted light blocking region, and the transmitted light of the first and second light transmitting regions is connected to a portion where a dark region is not required to be formed at the junction of the first and second light transmitting regions. A third light transmitting region is interposed that transmits light at an intermediate phase.

請求項(2)記載のパターン形成方法は、請求項fi+
記載のフォトマスク装置を基板上に形成されたレジスト
上に設置し、前記フォトマスク装置の第1第2および第
3の光透過領域を通して露光光を前記レジスト上に照射
する。
The pattern forming method according to claim (2) is provided in claim fi+
The photomask device described above is placed on a resist formed on a substrate, and exposure light is irradiated onto the resist through first, second, and third light transmission regions of the photomask device.

〔作   用〕[For production]

請求項fil記載のフォトマスク装置では、透過光の位
相が互いに略180変異なる暗部形成用の第1および第
2の光透過領域を直接もしくは透過光遮断領域を介して
接合することで、第1の光透過領域を透過する光と第2
の光i3過領域を透過する光とが互いに弱め合い、これ
によって直接接合しもしくは透過光遮断領域を介して接
合した第1および第2の光透過領域の接合部周辺の下方
に暗部を形成する。
In the photomask device according to claim fil, the first and second light transmitting regions for forming a dark region, in which the phases of transmitted light differ from each other by approximately 180 degrees, are joined directly or through a transmitted light blocking region. The light that passes through the light transmitting region of
The light transmitted through the light i3 transmitting region weakens each other, thereby forming a dark region below the periphery of the junction of the first and second light transmitting regions that are directly joined or joined via the transmitted light blocking region. .

ところが、第1および第2の光透過領域を平面上に形成
する場合、暗部形成不要部分にも第1および第2の光透
過領域が接合する場合がある。このような暗部形成不要
部分において、第1および第2の光透過領域の間に第1
および第2の光透過領域の透過光の位相の中間の位相で
光を透過させる第3の光透過領域を介在させると、光の
打ち消し作用が抑えられることになり、不要暗部の形成
が防止される。
However, when the first and second light transmitting regions are formed on a flat surface, the first and second light transmitting regions may be joined to portions where dark portions are not required to be formed. In such a part where the formation of a dark part is unnecessary, the first light transmitting region is
By interposing a third light transmitting region that transmits light at a phase intermediate to that of the light transmitted through the second light transmitting region, the canceling effect of light is suppressed, and the formation of unnecessary dark areas is prevented. Ru.

つまり、このフォトマスク装置では、透過光の位相差を
180度有する隣接する第1および第2の光透過領域の
境界に、両光透過領域の透過光の位相の中間の位相で光
を透過させる第3の光透過領域を設けることにより、そ
の境界部分の光強度を持ち上げる。第3の光透過領域は
、第1および第2の光透過領域の境界部での光の位相の
移り変わりを、ゆるやかにする作用を存し、180度の
位相差を持つ2光の干渉を弱める作用をもつのである。
In other words, in this photomask device, light is transmitted through the boundary between adjacent first and second light transmitting regions, which have a phase difference of 180 degrees, with a phase that is intermediate between the phases of the transmitted light of both light transmitting regions. By providing the third light transmitting region, the light intensity at the boundary portion is increased. The third light transmitting region has the function of slowing down the transition of the phase of light at the boundary between the first and second light transmitting regions, and weakens the interference between two lights having a phase difference of 180 degrees. It has an effect.

これによって、透過光の位相差を180度をする隣接す
る第1および第2の光透過領域の境界部の下方における
不要暗部の形成を阻止し、位相シフト法によって分枝パ
ターンや開ループパターンを容易に形成できるものであ
る。
This prevents the formation of unnecessary dark areas below the boundary between the adjacent first and second light transmitting regions, which have a phase difference of 180 degrees between the transmitted light, and creates branch patterns and open loop patterns using the phase shift method. It can be easily formed.

請求項(2)記載のパターン形成方法では、フォトマス
ク装置の第1.第2および第3の光透過領域を通して露
光光を前記レジスト上に照射するので、レジストを分枝
パターンや開ループパターンに残すことができる。
In the pattern forming method according to claim (2), the first . Since the exposure light is directed onto the resist through the second and third light transmitting regions, the resist can be left in a branched pattern or an open loop pattern.

〔実 施 例〕〔Example〕

第1図ialはこの発明の第1の実施例の位相シフト法
によるフォトマスク装置の平面図を示し、(1)は透明
の石英板上の光透過領域、I2は石英板上にクロム等を
塗布して形成した透過光遮断領域、I3は透過光の位相
を180度変化させる位相変換シフタ、14は透過光の
位相を90度変化させる位相変換シフタであり、光透過
領域(1)のうち位相変換シフタ13.14のない部分
の光透過領域(1)Aの透過光の位相と位相変換シフタ
】3のある部分の光透過領域(1)Bの透過光の位相は
180度異変異、光透過領域(1)Aの透過光の位相と
位相変換シフタ14のある部分の光透過領域(1)Cの
透過光の位相は90度変異り、光透過領域(1)Cの透
過光の位相と位相変換シフタ13のある光透過領域(1
)Bの透過光の位相も90度変異る。
FIG. 1ial shows a plan view of a photomask device using a phase shift method according to a first embodiment of the present invention, in which (1) is a light transmitting area on a transparent quartz plate, and I2 is a layer of chromium etc. on the quartz plate. The transmitted light blocking area formed by coating, I3 is a phase conversion shifter that changes the phase of transmitted light by 180 degrees, and 14 is a phase conversion shifter that changes the phase of transmitted light by 90 degrees. Phase conversion shifter 13. The phase of the transmitted light of the part without phase conversion shifter 14 (1) A and the phase of the transmitted light of phase conversion shifter] The phase of the transmitted light of the part of 3 (1) B has a 180 degree variation, Phase and phase conversion of transmitted light in light transmitting region (1)A The phase of transmitted light in light transmitting region (1)C in the portion where the shifter 14 is located is shifted by 90 degrees, and the phase of transmitted light in light transmitting region (1)C is changed by 90 degrees. A light transmission area (1
) The phase of the transmitted light of B also changes by 90 degrees.

第1図中)は、シミュレーションによる第】図ta)の
フォトマスク装置の透過光の光強度分布図を示すもので
ある。
FIG. 1) shows a light intensity distribution diagram of transmitted light of the photomask device of FIG. ta) based on a simulation.

以上のように構成されたこの実施例のフォトマスク装置
において、以下その動作を説明する。
The operation of the photomask apparatus of this embodiment configured as described above will be explained below.

透過光の位相を180度変化させる位相変換シフタ13
の境界が光透過領域(1)に存在するとき、その境界部
に透過光の位相を90度変化させる位相変換シフタ14
を配置する。光透過領域(1)Aの透過光に対して90
度の位相差をもった光を透過させる位相変換シフタ14
は、光透過領域(1)Bから光透過領域(1)Aにかけ
て、透過光の位相が180度から0度へ移り変わるとき
のバッファの役割を果たし、境界部分の光強度がOにな
ることを避ける効果をもつ。つまり、180度位変位相
透過領域(1)Bと90度変位相光i3jM領域(1)
Cとの境界では光強度は0にならず、同様に90度の光
透過領域(1)Cと0変位相の光透過領域(1)Aとの
境界においても光強度が0にならない現象を利用して光
透過領域(1)A、IIBの接合部の下方の不要暗部の
形成を防止したものである。
Phase conversion shifter 13 that changes the phase of transmitted light by 180 degrees
phase conversion shifter 14 that changes the phase of transmitted light by 90 degrees at the boundary when the boundary exists in the light transmission region (1).
Place. Light transmission area (1) 90 for transmitted light of A
Phase conversion shifter 14 that transmits light with a phase difference of degrees
plays the role of a buffer when the phase of transmitted light changes from 180 degrees to 0 degrees from light transmission area (1) B to light transmission area (1) A, and the light intensity at the boundary becomes O. It has the effect of avoiding. In other words, the 180 degree shifted phase transmission region (1)B and the 90 degree shifted phase light i3jM region (1)
The light intensity does not become 0 at the boundary with C, and similarly, the light intensity does not become 0 at the boundary between the 90 degree light transmission area (1) C and the 0 phase shift light transmission area (1) A. This prevents the formation of an unnecessary dark area below the junction of the light transmitting regions (1) A and IIB.

この現象は、実数軸をX軸にとり、虚数軸をY軸にとっ
た複素平面を考えると理解できる。光強度を、長さ1を
もったベクトルと考えると、180変位相が異なったも
のどうしをたし合わせると−、クトルが0になる(つま
り消える)のが容易に理解される。これは光強度が0の
現象である。
This phenomenon can be understood by considering a complex plane in which the real axis is the X axis and the imaginary axis is the Y axis. If we consider the light intensity as a vector with length 1, it is easy to understand that when we add up the vectors with different phase shifts by 180, the vector becomes 0 (that is, disappears). This is a phenomenon when the light intensity is 0.

しかし、位相が90度変異ったものどうしをたし合わせ
ると45度傾いたベクトルが得られる。
However, if you add up vectors whose phases differ by 90 degrees, you will get a vector tilted by 45 degrees.

つまり、ベクトルが長さをもてば、その光強度は0には
ならない。また、45度1頃いたベクトルと13535
度傾ベクトルをたし合わせると、実数成分がOの虚数軸
上のベクトルができる。しかし、光強度は2乗した絶対
値で表されるから、この部分も光強度は0にはならない
。よって、180度と0度との間に位相が違う成分が入
ると、その境界での光強度は0よりも大きくなる。
In other words, if a vector has a length, its light intensity will not be zero. Also, the vector that was around 45 degrees 1 and 13535
Adding the degree-inclination vectors creates a vector on the imaginary axis whose real component is O. However, since the light intensity is expressed as an absolute value raised to the second power, the light intensity in this part does not become 0 either. Therefore, when a component with a different phase enters between 180 degrees and 0 degrees, the light intensity at the boundary becomes greater than 0.

よって、このフォトマスク装置に露光光が入射すると、
第1図(alのA、−A2線上では、通常のコントラス
ト向上効果が得られる。つまり、透過光遮断領域13を
介して光透過領域(1)Aと光透過領域(1)Bとが接
合しているので、従来例で述べたのと同様に、180度
位変位相なる光透過領域(1)A(1)Bの接合が暗部
を作るように作用する。
Therefore, when exposure light enters this photomask device,
On the lines A and -A2 of FIG. Therefore, as described in the conventional example, the junction of the light transmitting regions (1)A(1)B with a phase shift of about 180 degrees acts to create a dark area.

また、第1図falのB、−82線上では、i3過光の
位相を90度変化させる位相変換ソフタ14によって、
透過光の位相が0度、90度、180度と段階的に変化
する。
Moreover, on the B, -82 line of FIG.
The phase of the transmitted light changes stepwise from 0 degrees, 90 degrees, and 180 degrees.

よって、第1図(b)に示すように、はぼマスク通りの
光強度分布が得られる。
Therefore, as shown in FIG. 1(b), a light intensity distribution according to the mask is obtained.

つぎに、第1図(a)のB、−82線上のフォトマスク
装置の断面図を第2図(a)に示し、フォトマスク装置
を透過した光の強度分布図を同図(blに示し、それに
よって形成されたレジストパターンの断面図を同図fc
lに示す。透過光の位相を90度変化させる位相変換シ
フタ14を設けたことによって、従来例で現れた不要な
レジストパターンは現れず、マスク通りのレジストパタ
ーン18のみが形成される。
Next, a cross-sectional view of the photomask device on line B and -82 in FIG. 1(a) is shown in FIG. , a cross-sectional view of the resist pattern formed thereby is shown in the same figure fc.
Shown in l. By providing the phase conversion shifter 14 that changes the phase of transmitted light by 90 degrees, the unnecessary resist pattern that appears in the conventional example does not appear, and only the resist pattern 18 that matches the mask is formed.

以上のように、この実施例によれば、透過光の位相を9
0度変化させる位相変換シフタ14を180度位変位相
化させる位相変換シフタ13の境界に設けることにより
、位相が180度異l9光透過領域の接合による不要暗
部の形成を容易に防止することができ、分枝を含むよう
な開ループのパターンでもマスクを任意に作成すること
ができる。
As described above, according to this embodiment, the phase of the transmitted light is adjusted to 9
By providing the phase conversion shifter 14 that changes the phase by 0 degrees at the boundary of the phase conversion shifter 13 that changes the phase by 180 degrees, it is possible to easily prevent the formation of unnecessary dark areas due to the joining of light transmitting regions whose phases differ by 180 degrees. It is possible to create masks arbitrarily, even in open-loop patterns that include branches.

さらに前記の例は、わかりやすく90度変位相異なる位
相変換シフタ14を1つ間に挟んだが、その境界での光
強度分布をi3過型マスクのものに近づけようとすれば
、180度の光透過領域から0度の光透過領域の間に多
くの位相の異なる位相変換シフタを段階的に配置すれば
よい。
Furthermore, in the above example, one phase conversion shifter 14 with a 90-degree shift phase is sandwiched between them, but if we try to make the light intensity distribution at the boundary closer to that of the i3 over-type mask, the 180-degree light A large number of phase conversion shifters having different phases may be arranged stepwise between the transmission region and the light transmission region at 0 degrees.

第3図は上記のような構成としたこの発明の第2の実施
例の位相シフト法によるフォトマスク装置の平面図を示
し、21は透明の石英板上の光透過領域、22は石英板
上にクロム等を塗布して形成した透過光遮断領域、23
は透過光の位相を180度変化させる位相変換シフタ、
25は透過光の位相を120度変化させる位相変換シフ
タ、26は透過光の位相を60度変化させる位相変換シ
フタであり、光透過領域21のうち位相変換シフタ23
.25.26のない部分の光透過領域21Aの透過光の
位相と位相変換シフタ23のある部分の光透過領域21
Bの透過光の位相は180度異l9、光透過領域21A
の透過光の位相と位相変換シフタ26のある部分の光M
 A ?iJf域21Cの透過光の位相は60度変異り
、光i3過領域2ICの透過光の位相と位相変換シフタ
25のある部分の光透過領域21Dのi3過先の位相も
60度変異り、光透過領域21Dの透過光の位相と位相
変換シフタ23のある部分の光透過領域21Bの透過光
の位相も60度変異る。
FIG. 3 shows a plan view of a photomask device using a phase shift method according to a second embodiment of the present invention configured as described above, in which 21 is a light transmitting area on a transparent quartz plate, and 22 is a light transmitting area on a quartz plate. Transmitted light blocking area formed by coating chromium etc. on 23
is a phase conversion shifter that changes the phase of transmitted light by 180 degrees,
25 is a phase conversion shifter that changes the phase of transmitted light by 120 degrees; 26 is a phase conversion shifter that changes the phase of transmitted light by 60 degrees;
.. 25. Phase of the transmitted light in the light transmitting region 21A where there is no 26 and phase conversion of the light transmitting region 21 where the shifter 23 is present
The phase of transmitted light of B is 180 degrees different l9, light transmission area 21A
The phase of the transmitted light and the phase conversion shifter 26 of the light M
A? The phase of the transmitted light in the iJf region 21C is shifted by 60 degrees, and the phase of the transmitted light in the light i3 passing region 2IC and the phase of the i3 passing part of the light transmitting region 21D in the part where the phase conversion shifter 25 is also shifted by 60 degrees, and the light The phase of the light transmitted through the transmission region 21D and the phase of the light transmitted through the light transmission region 21B in the portion where the phase conversion shifter 23 is located also differ by 60 degrees.

上記のように、透過光の位相を60度変化させる位相変
換シフタ26と120度変化させる位相変換シフタ25
を、段階的に180度位変位相化させる位相変換シフタ
23の境界に設けることにより、よりスムーズなマスク
通りの光強度分布が得られる。
As mentioned above, the phase conversion shifter 26 changes the phase of transmitted light by 60 degrees, and the phase conversion shifter 25 changes the phase of transmitted light by 120 degrees.
By providing this at the boundary of the phase conversion shifter 23 that shifts the phase by about 180 degrees in stages, a smoother light intensity distribution according to the mask can be obtained.

第4図はこの発明の第3の実施例の位相シフト法による
フォトマスク装置の平面図を示し、31は透明の石英板
上の光透過領域、32は石英板上にクロム等を塗布して
形成した透過光遮断領域、33は透過光の位相を90度
変化させる位相変換シフタ、34は透過光の位相を一9
0度変化させる位相変換シックであり、光i3過領域3
1のうち位相変換シフタ34のある部分の光透過領域3
1Aのi3過光の位相と位相変換シック33.34のな
い部分の光透過領域31Bの3過光の位相は90度変声
り、光透過領域31Bの透過光の位相と位相変換シフタ
33のある部分の光透過領域31Cの透過光の位相は9
0度変声り、光透過領域31Aの透過光の位相と光透過
領域31Cのi3過光の位相は180度異l6゜ この実施例では、位相を180度変化させる位相変換シ
フタを使わず、位相を90度変化させる位相変換シフタ
と位相を一90度変化させる位相変換ソフタとの2種類
の位相変換シックでコントラストを向上させ、位相変換
シフタのない透過光(0変位相)をへソファとして用い
ている。
FIG. 4 shows a plan view of a photomask device using a phase shift method according to a third embodiment of the present invention, in which 31 is a light transmitting area on a transparent quartz plate, and 32 is a light transmitting area on a quartz plate coated with chromium or the like. The transmitted light blocking region 33 changes the phase of the transmitted light by 90 degrees, and 34 changes the phase of the transmitted light by 90 degrees.
It is a phase conversion chic that changes by 0 degrees, and the optical i3 excess area 3
1, the light transmission region 3 of the part where the phase conversion shifter 34 is located
The phase of the i3 transmitted light of 1A and the phase of the 3 transmitted light of the light transmission area 31B in the part without the thick 33.34 are changed by 90 degrees, and the phase of the transmitted light of the light transmission area 31B and the phase of the phase conversion shifter 33 The phase of the transmitted light in a certain portion of the light transmitting region 31C is 9
0 degree change, the phase of the transmitted light in the light transmission area 31A and the phase of the i3 transmitted light in the light transmission area 31C are 180 degrees different l6° In this embodiment, a phase conversion shifter that changes the phase by 180 degrees is not used. Two types of phase conversion filters, a phase conversion shifter that changes the phase by 90 degrees and a phase conversion softer that changes the phase by 190 degrees, improve the contrast and convert the transmitted light (0 phase shift) without a phase conversion shifter into a sofa. I am using it.

この例のように位相差が180度の境界にバッフアを置
くという概念が重要であって、位相変換シフタをどのよ
うに配置するかは重要でないことは言うまでもない。
It goes without saying that the concept of placing the buffer at the boundary where the phase difference is 180 degrees as in this example is important, and how the phase conversion shifter is placed is not important.

なお、第1.第2.第3の実施例において、90度、1
80度、−90度等の位相変換シフタは、クロムの上に
形成しても、エツチングによ、て透過光遮断領域を構成
するクロムの下に形成してもよい。また、異なる屈折率
を持ったもので180度と90度、270度の位相変換
シフタを作り分けてもよく、このようにすると、位相の
変化量の異なる位相変換シフタの高さを揃えることが可
能となり、フォトマスクの表面の段差を少なくすること
ができる。以上のように、レチクル上に異なる位相変換
シックを2つ以上作る方法は、どのようにしてもよい。
In addition, 1. Second. In a third embodiment, 90 degrees, 1
The 80 degree, -90 degree, etc. phase conversion shifter may be formed on the chrome or may be formed by etching under the chromium constituting the transmitted light blocking region. Additionally, phase conversion shifters of 180 degrees, 90 degrees, and 270 degrees may be made with different refractive indexes, and in this way, the heights of phase conversion shifters with different amounts of phase change can be made the same. This makes it possible to reduce the level difference on the surface of the photomask. As described above, any method may be used to create two or more different phase conversion chics on the reticle.

第81D(blにこの発明の第4の実施例のフォトマス
ク装置の平面図を示す。第8図(blは、光透過領域の
みから構成されるフォトマスク装置の構成を示すもので
ある。第8図において、93は透過光の位相を90度変
化させる位相変換シフタであり、位相変換シフタ92の
端縁部に配設されている。
FIG. 81D (bl shows a plan view of a photomask device according to the fourth embodiment of the present invention. FIG. 8D (bl shows the configuration of a photomask device consisting only of light-transmitting regions). In FIG. 8, 93 is a phase conversion shifter that changes the phase of transmitted light by 90 degrees, and is disposed at the edge of the phase conversion shifter 92.

位相変換シフタ92.93のない部分の光透過領域91
A(7)透過光の位相と位相変換シフタ92のある部分
の光透過領域91B17)透過光の位相は180度異l
6、光透過領域91Aのi3過光の位相と位相変換シフ
タ93のある部分の光透過領域91Cのy過充の位相は
90度変声り、光透過領域91Cの透過光の位相と光透
過領域91Bの透過光の位相も90度変声る。
Light transmission area 91 in the part without phase conversion shifters 92 and 93
A (7) Phase and phase conversion of transmitted light Light transmission area 91 in the part with shifter 92 B17) Phase of transmitted light differs by 180 degrees l
6. The phase of the i3 passing light in the light transmitting region 91A and the phase of the y filling in the light transmitting region 91C in the part where the shifter 93 is located are changed by 90 degrees, and the phase of the transmitted light in the light transmitting region 91C and the light transmission The phase of the transmitted light in the region 91B is also changed by 90 degrees.

以上のように構成されたこの実施例のフォトマスク装置
において、以下その動作を説明する。
The operation of the photomask apparatus of this embodiment configured as described above will be explained below.

透過光の位相を180度変化させる位相変換シフタ92
の境界が光透過領域91に存在するとき、その境界部に
透過光の位相を90度変化させる位相変換シフタ93を
配置する。光透過領域91A。
Phase conversion shifter 92 that changes the phase of transmitted light by 180 degrees
When a boundary exists in the light transmission region 91, a phase conversion shifter 93 that changes the phase of transmitted light by 90 degrees is arranged at the boundary. Light transmission area 91A.

91Bの透過光に対して90度の位相差をもつ光を透過
させる位相変換シフタ93は、透過光が180度から0
度の位相へ移り変わる時のバッフアの役割を果たし、そ
の光強度が光透過領域91A、 91Bの接合部分でO
になることを避ける作用をもつ。
A phase conversion shifter 93 that transmits light having a phase difference of 90 degrees with respect to the transmitted light of 91B changes the transmitted light from 180 degrees to 0.
It plays the role of a buffer when the phase changes, and the light intensity becomes O
It has the effect of preventing

この実施例では、位相変換シフタ93によって、位相変
換シフタ92と位相変換シフタ93との境界部分でのパ
ターン(暗部)形成が阻止される。
In this embodiment, the phase conversion shifter 93 prevents the formation of a pattern (dark area) at the boundary between the phase conversion shifter 92 and the phase conversion shifter 93.

第9図中)に第8図中3に示すフォトマスク装置による
転写像のうち一点鎖線99Bで囲んだ領域の部分での相
対光強度分布のシミュレーンヨン結果を示す。この図に
よれば、パターン101とパターン102とが独立して
形成されることが判る。
9) shows the simulation results of the relative light intensity distribution in the region surrounded by the dashed line 99B of the image transferred by the photomask device shown in 3 in FIG. 8. According to this figure, it can be seen that the pattern 101 and the pattern 102 are formed independently.

〔発 明 の 効 果〕〔Effect of the invention〕

この発明によれば、透過光の位相で180度異l6第1
および第2の光透過領域の間にそれらの透過光の位相の
中間の位相で光を透過させる第3の光透過領域を介在さ
せたので、第1および第2の光透過領域の接合による不
要暗部の形成を防止することができ、あらゆるパターン
においても位相シフトマスク法を適応することができる
。例えば、露光光源に従来のg線、i線を用いて64M
ビ・2トのDRAM等の0.3〜0.4 p mルール
のパターニングが可能となる。またKrFエキシマレー
ザ−(248nm)では0.2μmルールのバターニン
グが可能となり、フォトリソグラフィの限界をより伸ば
すことができ、その実用的効果は大きい。
According to this invention, there is a 180 degree difference in the phase of transmitted light.
Since a third light transmitting region that transmits light at an intermediate phase between the transmitted light and the second light transmitting region is interposed between the second light transmitting region and the third light transmitting region, there is no need to join the first and second light transmitting regions. The formation of dark areas can be prevented, and the phase shift mask method can be applied to any pattern. For example, using conventional g-line and i-line as the exposure light source, 64M
Patterning of 0.3 to 0.4 pm rule for bit-2 bit DRAM etc. is possible. Furthermore, KrF excimer laser (248 nm) enables patterning with a 0.2 μm rule, further extending the limits of photolithography, and has great practical effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(alはこの発明の第1の実施例のフォトマスフ
装置の平面図、第1図(blは第1図+81のフォトマ
スク装置の透過光のソミュレーソヨンによる光強度分布
図、第2図fatは第1図(alのB、−82線でのマ
スク断面図、第2図fblは第1図ta+0B1B2線
での透過光の光強度分布図、第2図fclは第1図(a
lのフォトマスク装置を通して露光して得られたレジス
トパターンのB、−82線での断面図、第3図はこの発
明の第2の実施例のフォトマスク装置の平面図、第4図
はこの発明の第3の実施例のフォトマスク装置の平面図
、第5図(alはフォトマスク装置の従来例の平面図、
第5図中)は第5図(alのフォトマスク装置の透過光
のシミュレーションによる光強度分布図、第1図+81
は第5図(alのD1D2線でのフォトマスク断面図、
第6図(b)は第5図talのり、−D2線でのi3過
光の光強度分布図、第6図telは第5図ta+のフォ
トマスク装置を通して露光して得られたレジストパター
ンのり、−D2線での断面図、第7図(alは補助型位
相シフト法によるフォトマスク装置の従来例の平面図、
第7図(blは第7図(alのフォトマスク装置を通っ
た光の振幅分布図、第7図fclは同しくその光強度分
布図、第1図+81はフォトマスク装置の他の従来例の
平面図、第8図fblはこの発明の第4の実施例におけ
るフォトマスク装置の平面図、第9図(alは第8図(
alにおけるフォトマスク装置による転写光のシミュレ
ーション結果を示す光強度分布図、第1図+81は第8
図(blに示すフォトマスク装置による転写光のシミュ
レーション結果を示す光強度分布図である。 (1)(1)A〜IIC,21,21A〜21D、31
゜31A〜31C,91,91A〜91C・・・光透過
領域、12.22.32・・・i3過光遮断領域、13
,1423.25.26,33.34・・・位相変換シ
ック(1)C・・t3のt遠湯優成 (1)1図 (a) (b) 第 第 図 (b) 図 第 第 (b) 図 図 区 lj’)tv の 田 区 Cす
Figure 1 (al is a plan view of the photomask device according to the first embodiment of the present invention, Figure 1 (bl is a light intensity distribution diagram of the transmitted light of the photomask device of Figure 1 + 81 due to SOMULAI SOON, and Figure 2 is fat is a cross-sectional view of the mask taken along line B, -82 in Figure 1 (al), Figure 2 fbl is a light intensity distribution diagram of the transmitted light along line ta+0B1B2 in Figure 1, and Figure 2 fcl is a cross-sectional view of the mask taken along line B and -82 in Figure 1 (a).
FIG. 3 is a plan view of the photomask device according to the second embodiment of the present invention, and FIG. FIG. 5 is a plan view of a photomask device according to a third embodiment of the invention (al is a plan view of a conventional example of a photomask device;
Figure 5 (in Figure 5) is a light intensity distribution diagram based on a simulation of the transmitted light of the photomask device in Figure 5 (al);
is a cross-sectional view of the photomask along the D1D2 line of al.
Figure 6(b) is a light intensity distribution diagram of i3 transmitted light on the -D2 line for the tal paste in Figure 5, and tel in Figure 6 is for the resist pattern paste obtained by exposure through the photomask device of Figure 5 ta+. , a sectional view taken along the line -D2, and FIG. 7 (al is a plan view of a conventional example of a photomask device using the auxiliary phase shift method;
Figure 7 (bl is an amplitude distribution diagram of light passing through the photomask device in Figure 7 (al), Figure 7 fcl is a diagram of its light intensity distribution, and Figure 1 +81 is another conventional example of a photomask device. FIG. 8 fbl is a plan view of a photomask apparatus according to a fourth embodiment of the present invention, and FIG. 9 (al is a plan view of FIG. 8 (
A light intensity distribution diagram showing the simulation results of transfer light by the photomask device in al.
It is a light intensity distribution diagram showing simulation results of transfer light by the photomask device shown in Figure (bl). (1) (1) A to IIC, 21, 21A to 21D, 31
゜31A to 31C, 91, 91A to 91C...Light transmission area, 12.22.32...i3 Excessive light blocking area, 13
, 1423.25.26, 33.34... Phase conversion sick (1) C...t3 Yusei Toyu (1) Figure 1 (a) (b) Figure 1 (b) Figure 1 ( b) Map area lj') tv's area C

Claims (2)

【特許請求の範囲】[Claims] (1)透過光の位相が互いに略180度異なる暗部形成
用の第1および第2の光透過領域を直接もしくは透過光
遮断領域を介して接合し、前記第1および第2の光透過
領域の接合部の暗部形成不要部分に前記第1および第2
の光透過領域の透過光の位相の中間の位相で光を透過さ
せる第3の光透過領域を介在させたフォトマスク装置。
(1) The first and second light transmitting regions for forming a dark area, in which the phases of transmitted light are different from each other by approximately 180 degrees, are joined directly or through a transmitted light blocking region, and the first and second light transmitting regions are The first and second
A photomask device including a third light transmitting region that transmits light at a phase intermediate between the phase of the light transmitted through the light transmitting region.
(2)請求項(1)記載のフォトマスク装置を基板上に
形成されたレジスト上に設置し、前記フォトマスク装置
の第1、第2および第3の光透過領域を通して露光光を
前記レジスト上に照射することを特徴とするパターン形
成方法。
(2) The photomask device according to claim (1) is installed on a resist formed on a substrate, and exposure light is directed onto the resist through the first, second, and third light transmitting regions of the photomask device. A pattern forming method characterized by irradiating.
JP2167951A 1990-06-25 1990-06-25 Photomask device and pattern forming method using this device Pending JPH0455854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2167951A JPH0455854A (en) 1990-06-25 1990-06-25 Photomask device and pattern forming method using this device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2167951A JPH0455854A (en) 1990-06-25 1990-06-25 Photomask device and pattern forming method using this device

Publications (1)

Publication Number Publication Date
JPH0455854A true JPH0455854A (en) 1992-02-24

Family

ID=15859073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2167951A Pending JPH0455854A (en) 1990-06-25 1990-06-25 Photomask device and pattern forming method using this device

Country Status (1)

Country Link
JP (1) JPH0455854A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611826A (en) * 1992-04-28 1994-01-21 Mitsubishi Electric Corp Photomask and its production
US5368963A (en) * 1991-07-30 1994-11-29 Fujitsu Limited Photomask and method of fabricating the same
JP2010050420A (en) * 2008-08-25 2010-03-04 Mitsumi Electric Co Ltd Electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368963A (en) * 1991-07-30 1994-11-29 Fujitsu Limited Photomask and method of fabricating the same
JPH0611826A (en) * 1992-04-28 1994-01-21 Mitsubishi Electric Corp Photomask and its production
JP2010050420A (en) * 2008-08-25 2010-03-04 Mitsumi Electric Co Ltd Electronic apparatus

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