JPH0455140U - - Google Patents

Info

Publication number
JPH0455140U
JPH0455140U JP9611990U JP9611990U JPH0455140U JP H0455140 U JPH0455140 U JP H0455140U JP 9611990 U JP9611990 U JP 9611990U JP 9611990 U JP9611990 U JP 9611990U JP H0455140 U JPH0455140 U JP H0455140U
Authority
JP
Japan
Prior art keywords
strip
loop
shaped body
shaped
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9611990U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9611990U priority Critical patent/JPH0455140U/ja
Publication of JPH0455140U publication Critical patent/JPH0455140U/ja
Pending legal-status Critical Current

Links

JP9611990U 1990-09-14 1990-09-14 Pending JPH0455140U (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9611990U JPH0455140U (en, 2012) 1990-09-14 1990-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9611990U JPH0455140U (en, 2012) 1990-09-14 1990-09-14

Publications (1)

Publication Number Publication Date
JPH0455140U true JPH0455140U (en, 2012) 1992-05-12

Family

ID=31835393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9611990U Pending JPH0455140U (en, 2012) 1990-09-14 1990-09-14

Country Status (1)

Country Link
JP (1) JPH0455140U (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020025997A (ja) * 2018-08-09 2020-02-20 日清工業株式会社 両頭平面研削盤
JP2023049756A (ja) * 2021-09-29 2023-04-10 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置、並びに基板交換方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020025997A (ja) * 2018-08-09 2020-02-20 日清工業株式会社 両頭平面研削盤
JP2023049756A (ja) * 2021-09-29 2023-04-10 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置、並びに基板交換方法

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