JPH0454817U - - Google Patents
Info
- Publication number
- JPH0454817U JPH0454817U JP9786890U JP9786890U JPH0454817U JP H0454817 U JPH0454817 U JP H0454817U JP 9786890 U JP9786890 U JP 9786890U JP 9786890 U JP9786890 U JP 9786890U JP H0454817 U JPH0454817 U JP H0454817U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- female
- male
- molds
- opposing surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990097868U JP2527970Y2 (ja) | 1990-09-17 | 1990-09-17 | 射出成形用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990097868U JP2527970Y2 (ja) | 1990-09-17 | 1990-09-17 | 射出成形用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0454817U true JPH0454817U (enExample) | 1992-05-11 |
| JP2527970Y2 JP2527970Y2 (ja) | 1997-03-05 |
Family
ID=31838608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990097868U Expired - Lifetime JP2527970Y2 (ja) | 1990-09-17 | 1990-09-17 | 射出成形用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527970Y2 (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6316630A (ja) * | 1986-07-08 | 1988-01-23 | Mitsubishi Electric Corp | 半導体製造装置の樹脂封止用金型 |
| JPS6436123U (enExample) * | 1987-08-27 | 1989-03-06 |
-
1990
- 1990-09-17 JP JP1990097868U patent/JP2527970Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6316630A (ja) * | 1986-07-08 | 1988-01-23 | Mitsubishi Electric Corp | 半導体製造装置の樹脂封止用金型 |
| JPS6436123U (enExample) * | 1987-08-27 | 1989-03-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527970Y2 (ja) | 1997-03-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |