JPH0454815U - - Google Patents

Info

Publication number
JPH0454815U
JPH0454815U JP9687490U JP9687490U JPH0454815U JP H0454815 U JPH0454815 U JP H0454815U JP 9687490 U JP9687490 U JP 9687490U JP 9687490 U JP9687490 U JP 9687490U JP H0454815 U JPH0454815 U JP H0454815U
Authority
JP
Japan
Prior art keywords
gas supply
supply passage
gas
cavity
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9687490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9687490U priority Critical patent/JPH0454815U/ja
Publication of JPH0454815U publication Critical patent/JPH0454815U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、この考案の射出成形金型の概略構成
を示す断面図、第2図は第1図の射出成形金型に
用いられたガス供給ピンの要部拡大断面図、第3
図〜第5図は、それぞれ、この考案の射出成形金
型に用いられるガス供給ピンの他の実施例の要部
拡大断面図である。 3……金型、31……固定型、32……移動型
、4……キヤビテイ、41……ボス形成部、7…
…ガス供給ピン、71……筒状体、72……芯棒
、73……ガス供給通路。
Fig. 1 is a sectional view showing the schematic structure of the injection mold of this invention, Fig. 2 is an enlarged sectional view of the main part of the gas supply pin used in the injection mold of Fig. 1, and Fig.
5 to 5 are enlarged sectional views of main parts of other embodiments of the gas supply pin used in the injection mold of this invention. 3... Mold, 31... Fixed mold, 32... Movable mold, 4... Cavity, 41... Boss forming part, 7...
... Gas supply pin, 71 ... Cylindrical body, 72 ... Core rod, 73 ... Gas supply passage.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 先端面がキヤビテイの厚肉成形部に臨んでガス
供給用ピンが備えられた射出成形金型であつて、
前記ガス供給用ピンは、筒状体と該筒状体に挿入
された芯棒とからなり、該芯棒の周囲にガス供給
通路が形成され、該ガス供給通路の少なくとも開
口部分はガスは通るが溶融樹脂は入り込まない間
隙とされ、該ガス供給通路を経てガスがキヤビテ
イ内に供給されるように構成されていることを特
徴とする射出成形金型。
An injection mold with a gas supply pin facing the thick-walled molded part of the cavity at its tip end,
The gas supply pin includes a cylindrical body and a core rod inserted into the cylindrical body, and a gas supply passage is formed around the core rod, and gas passes through at least an opening portion of the gas supply passage. 1. An injection molding mold characterized in that the gap is such that molten resin does not enter therein, and gas is supplied into the cavity through the gas supply passage.
JP9687490U 1990-09-14 1990-09-14 Pending JPH0454815U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9687490U JPH0454815U (en) 1990-09-14 1990-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9687490U JPH0454815U (en) 1990-09-14 1990-09-14

Publications (1)

Publication Number Publication Date
JPH0454815U true JPH0454815U (en) 1992-05-11

Family

ID=31836763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9687490U Pending JPH0454815U (en) 1990-09-14 1990-09-14

Country Status (1)

Country Link
JP (1) JPH0454815U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63281813A (en) * 1987-05-14 1988-11-18 Matsushita Electric Ind Co Ltd Injection mold assembly
JPH02156644A (en) * 1988-12-09 1990-06-15 Nec Corp Transfer molding apparatus for sealing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63281813A (en) * 1987-05-14 1988-11-18 Matsushita Electric Ind Co Ltd Injection mold assembly
JPH02156644A (en) * 1988-12-09 1990-06-15 Nec Corp Transfer molding apparatus for sealing semiconductor device

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