JPH0454815U - - Google Patents
Info
- Publication number
- JPH0454815U JPH0454815U JP9687490U JP9687490U JPH0454815U JP H0454815 U JPH0454815 U JP H0454815U JP 9687490 U JP9687490 U JP 9687490U JP 9687490 U JP9687490 U JP 9687490U JP H0454815 U JPH0454815 U JP H0454815U
- Authority
- JP
- Japan
- Prior art keywords
- gas supply
- supply passage
- gas
- cavity
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第1図は、この考案の射出成形金型の概略構成
を示す断面図、第2図は第1図の射出成形金型に
用いられたガス供給ピンの要部拡大断面図、第3
図〜第5図は、それぞれ、この考案の射出成形金
型に用いられるガス供給ピンの他の実施例の要部
拡大断面図である。
3……金型、31……固定型、32……移動型
、4……キヤビテイ、41……ボス形成部、7…
…ガス供給ピン、71……筒状体、72……芯棒
、73……ガス供給通路。
Fig. 1 is a sectional view showing the schematic structure of the injection mold of this invention, Fig. 2 is an enlarged sectional view of the main part of the gas supply pin used in the injection mold of Fig. 1, and Fig.
5 to 5 are enlarged sectional views of main parts of other embodiments of the gas supply pin used in the injection mold of this invention. 3... Mold, 31... Fixed mold, 32... Movable mold, 4... Cavity, 41... Boss forming part, 7...
... Gas supply pin, 71 ... Cylindrical body, 72 ... Core rod, 73 ... Gas supply passage.
Claims (1)
供給用ピンが備えられた射出成形金型であつて、
前記ガス供給用ピンは、筒状体と該筒状体に挿入
された芯棒とからなり、該芯棒の周囲にガス供給
通路が形成され、該ガス供給通路の少なくとも開
口部分はガスは通るが溶融樹脂は入り込まない間
隙とされ、該ガス供給通路を経てガスがキヤビテ
イ内に供給されるように構成されていることを特
徴とする射出成形金型。 An injection mold with a gas supply pin facing the thick-walled molded part of the cavity at its tip end,
The gas supply pin includes a cylindrical body and a core rod inserted into the cylindrical body, and a gas supply passage is formed around the core rod, and gas passes through at least an opening portion of the gas supply passage. 1. An injection molding mold characterized in that the gap is such that molten resin does not enter therein, and gas is supplied into the cavity through the gas supply passage.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9687490U JPH0454815U (en) | 1990-09-14 | 1990-09-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9687490U JPH0454815U (en) | 1990-09-14 | 1990-09-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0454815U true JPH0454815U (en) | 1992-05-11 |
Family
ID=31836763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9687490U Pending JPH0454815U (en) | 1990-09-14 | 1990-09-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0454815U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63281813A (en) * | 1987-05-14 | 1988-11-18 | Matsushita Electric Ind Co Ltd | Injection mold assembly |
JPH02156644A (en) * | 1988-12-09 | 1990-06-15 | Nec Corp | Transfer molding apparatus for sealing semiconductor device |
-
1990
- 1990-09-14 JP JP9687490U patent/JPH0454815U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63281813A (en) * | 1987-05-14 | 1988-11-18 | Matsushita Electric Ind Co Ltd | Injection mold assembly |
JPH02156644A (en) * | 1988-12-09 | 1990-06-15 | Nec Corp | Transfer molding apparatus for sealing semiconductor device |