JPH0454011U - - Google Patents
Info
- Publication number
- JPH0454011U JPH0454011U JP9255290U JP9255290U JPH0454011U JP H0454011 U JPH0454011 U JP H0454011U JP 9255290 U JP9255290 U JP 9255290U JP 9255290 U JP9255290 U JP 9255290U JP H0454011 U JPH0454011 U JP H0454011U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- bottom plate
- periphery
- rubber
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims 7
Landscapes
- Magnetic Heads (AREA)
Description
第1図はこの考案のウエフアー選択メツキ治具
の一実施例にかかる断面図である。第2図はこの
考案のウエフアー選択メツキ治具の一実施例にか
かる一部分を抽出した斜視図である。第3図及び
第4図はそれぞれ従来のウエフアー選択メツキ治
具の分解斜視図である。
20……ウエフアー選択メツキ治具、21……
裏当ゴム、22……下当て板、25……ウエフア
ー押え枠、27……導電膜、28……突出枠、3
1……側面押え板、32……絶縁ゴム、33……
押えネジ、34……導電ゴム、35……ネジ、U
……ウエフアー。
FIG. 1 is a sectional view of one embodiment of the wafer selection plating jig of this invention. FIG. 2 is a perspective view showing a portion of an embodiment of the wafer selection plating jig of this invention. 3 and 4 are exploded perspective views of conventional wafer selection plating jigs, respectively. 20...Wafer selection plating jig, 21...
Backing rubber, 22... Lower backing plate, 25... Wafer presser frame, 27... Conductive film, 28... Projection frame, 3
1...Side pressure plate, 32...Insulating rubber, 33...
Holding screw, 34... Conductive rubber, 35... Screw, U
...Wafer.
Claims (1)
される下当て板と、この下当て板と連結されウエ
フアーの表面周囲を導電ゴムを介して押えるウエ
フアー押え枠と、これら下当て板とウエフアー押
え枠との間に設けられ先端に絶縁ゴムが取付られ
てウエフアー側面周囲に押し当てられる側面押え
板とでなることを特徴とするウエフアー選択メツ
キ治具。 A bottom plate to which a backing rubber applied to the back side of the wafer is attached; a wafer press frame connected to the bottom plate to press the periphery of the surface of the wafer via conductive rubber; and the bottom plate and the wafer press frame. A wafer selection plating jig characterized by comprising a side presser plate provided between the wafers and a side presser plate having an insulating rubber attached to the tip thereof and pressed against the periphery of the side surface of the wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9255290U JPH0454011U (en) | 1990-09-03 | 1990-09-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9255290U JPH0454011U (en) | 1990-09-03 | 1990-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0454011U true JPH0454011U (en) | 1992-05-08 |
Family
ID=31829106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9255290U Pending JPH0454011U (en) | 1990-09-03 | 1990-09-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0454011U (en) |
-
1990
- 1990-09-03 JP JP9255290U patent/JPH0454011U/ja active Pending
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