JPH0453250B2 - - Google Patents

Info

Publication number
JPH0453250B2
JPH0453250B2 JP59175109A JP17510984A JPH0453250B2 JP H0453250 B2 JPH0453250 B2 JP H0453250B2 JP 59175109 A JP59175109 A JP 59175109A JP 17510984 A JP17510984 A JP 17510984A JP H0453250 B2 JPH0453250 B2 JP H0453250B2
Authority
JP
Japan
Prior art keywords
temperature
test piece
target
deviation
thermal fatigue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59175109A
Other languages
Japanese (ja)
Other versions
JPS6153546A (en
Inventor
Hiroshi Uno
Kazuhiko Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saginomiya Seisakusho Inc
Original Assignee
Saginomiya Seisakusho Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saginomiya Seisakusho Inc filed Critical Saginomiya Seisakusho Inc
Priority to JP17510984A priority Critical patent/JPS6153546A/en
Publication of JPS6153546A publication Critical patent/JPS6153546A/en
Publication of JPH0453250B2 publication Critical patent/JPH0453250B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/60Investigating resistance of materials, e.g. refractory materials, to rapid heat changes

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、テストピースに所定の温度変化を与
えて熱疲労を試験する熱疲労試験装置に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal fatigue testing device that tests thermal fatigue by applying a predetermined temperature change to a test piece.

〔従来の技術〕[Conventional technology]

この種の熱疲労試験装置は、通常の引張圧縮疲
労試験等に使用される試験機のテストピース取付
部に温度調節機構を有した加熱装置を装備して構
成されている。この加熱装置としては、普通、高
周波加熱方式のものが使用されている。この方式
のものは、高周波電流により温度調節して簡単に
所定の温度変化をテストピースに与えることがで
きる。
This type of thermal fatigue testing apparatus is constructed by equipping a test piece attachment part of a testing machine used for ordinary tension-compression fatigue testing with a heating device having a temperature control mechanism. As this heating device, a high frequency heating type is normally used. With this method, the temperature can be adjusted using a high-frequency current and a predetermined temperature change can be easily applied to the test piece.

蒸気タービン等のように機械的な衝撃とともに
温度変化による熱衝撃を受けるものに使用される
材料の疲労試験では、テストピースに作用する荷
重と温度変化との間に所定の相関関係をもたせて
試験を行う必要があるが、上述の高周波加熱方式
のものではこのような温度変化を与えることは非
常に困難である。
In fatigue testing of materials used in items such as steam turbines, which are subject to both mechanical shock and thermal shock due to temperature changes, the test is performed with a predetermined correlation between the load acting on the test piece and temperature changes. However, it is extremely difficult to provide such a temperature change with the above-mentioned high-frequency heating method.

すなわち、テストピースに作用する荷重変化に
追従させて温度変化を与えるとき、荷重変化が急
激であるため、温度変化がこれに追従できず、温
度変化に遅れを生じてしまう。特に、温度下降時
では自然冷却によるため、所望の温度下降速度を
得ることができない。
That is, when a temperature change is applied to follow a change in the load acting on the test piece, the change in load is so rapid that the change in temperature cannot follow it, resulting in a delay in the change in temperature. In particular, when the temperature drops, natural cooling is used, making it impossible to obtain the desired temperature drop rate.

そこで、上述のような疲労試験を行う場合に
は、温度下降時に冷却用空気をテストピースに吹
き付けていた。このとき、複数の電磁弁を使用
し、該電磁弁の開く個数により冷却用空気の流量
調節を行つていた。
Therefore, when performing a fatigue test as described above, cooling air was blown onto the test piece when the temperature decreased. At this time, a plurality of solenoid valves are used, and the flow rate of the cooling air is adjusted by the number of solenoid valves that are opened.

しかし、流量調節は階段状に行われるため、温
度変化の遅れを可及的に少なくして試験精度を向
上することは困難で、仮りに実施しようとすれば
多数の電磁弁が必要となつたり、その制御が複雑
となつたりしてコスト高となる問題があつた。
However, since the flow rate is adjusted stepwise, it is difficult to minimize the delay in temperature change and improve test accuracy, and if this was attempted, a large number of solenoid valves would be required. However, there was a problem in that the control became complicated and the cost increased.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明は上記事情に鑑みてなされたもので、そ
の目的とするところは、コスト高とならずに試験
精度を向上させることができる熱疲労試験装置を
提供することである。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thermal fatigue testing device that can improve test accuracy without increasing costs.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は上記目的を達成するため、温度調節手
段を具備した加熱装置を有し、テストピースに作
用する荷重と、テストピースの温度変化との間に
所定の相関関係を持たせて前記加熱装置で温度制
御を行い熱疲労を試験する熱疲労試験装置におい
て、前記テストピースを冷却する冷却用流体の流
量調節を行うサーボ弁と、前記テストピースの温
度を検出する温度センサと、前記テストピースに
作用させる引張・圧縮荷重と所定の相関関係をも
つ目標温度波形を前記加熱装置に出力する目標波
形設定器と、該目標波形設定器よりの出力と前記
温度センサからの検出出力とを比較して前記テス
トピースの温度降下時における目標温度との偏差
量を得る手段と、該偏差量に応じて前記サーボ弁
を制御すると共に前記温度センサよりの検出出力
が低下するに従つて、冷却用流体の流量を多くし
て目標温度と一致させるべく前記偏差量を補償す
る補償回路とを具備したものである。
In order to achieve the above object, the present invention includes a heating device equipped with a temperature adjustment means, and the heating device A thermal fatigue test device that tests thermal fatigue by controlling temperature with a servo valve that adjusts the flow rate of a cooling fluid that cools the test piece, a temperature sensor that detects the temperature of the test piece, and a temperature sensor that controls the temperature of the test piece. a target waveform setter that outputs a target temperature waveform having a predetermined correlation with the applied tensile/compressive load to the heating device; and a comparison between the output from the target waveform setter and the detected output from the temperature sensor. means for obtaining the amount of deviation from the target temperature when the temperature of the test piece decreases; controlling the servo valve according to the amount of deviation; and controlling the amount of cooling fluid as the detected output from the temperature sensor decreases. The device is equipped with a compensation circuit that compensates for the amount of deviation in order to increase the flow rate and make it match the target temperature.

〔実施例〕〔Example〕

以下本発明の一実施例を図面に参照して説明す
る。
An embodiment of the present invention will be described below with reference to the drawings.

第1図は本発明の熱疲労試験装置の一例を示し
ている。図中符号Tはテストピースで、その一端
が油圧シリンダ1のピストン2にチヤツク3aを
介して連結されていると共に、その他端がロード
セル4にチヤツク3bを介して連結されている。
油圧シリンダ1を動作させてピストン2を第1図
に示す矢印A,B方向に移動させることにより、
テストピースTに引張・圧縮荷重が作用する。
FIG. 1 shows an example of a thermal fatigue testing apparatus of the present invention. Reference numeral T in the figure is a test piece, one end of which is connected to the piston 2 of the hydraulic cylinder 1 through a chuck 3a, and the other end connected to a load cell 4 through a chuck 3b.
By operating the hydraulic cylinder 1 and moving the piston 2 in the directions of arrows A and B shown in FIG.
A tensile/compressive load is applied to the test piece T.

テストピースTの周囲には、これを囲繞するよ
うにして高周波コイル5が巻回されている。この
高周波コイル5には、高周波電流を制御して加熱
温度を調節する温度調節器5aが設けられてい
る。
A high frequency coil 5 is wound around the test piece T so as to surround it. This high frequency coil 5 is provided with a temperature regulator 5a that controls the high frequency current and adjusts the heating temperature.

高周波コイル5の周囲には、第2図に示すよう
に、該高周波コイル5及びテストピースTに冷却
用空気を吹き付けるノズル6が配置されている。
このノズル6に冷却用空気を送る流路7には流量
を連続的に調節するサーボ弁8が設けられてい
る。
As shown in FIG. 2, a nozzle 6 is arranged around the high-frequency coil 5 to blow cooling air onto the high-frequency coil 5 and the test piece T.
A servo valve 8 that continuously adjusts the flow rate is provided in a flow path 7 that sends cooling air to the nozzle 6.

テストピースTには、熱電対からなる温度セン
サ9が取付けられる。この温度センサ9の出力は
アンプ10で増幅されて制御手段11に入力され
る。
A temperature sensor 9 made of a thermocouple is attached to the test piece T. The output of this temperature sensor 9 is amplified by an amplifier 10 and input to a control means 11.

制御手段11は、温度波形設定器12で設定し
た目標温度波形と温度センサ9から入力した検出
信号とから温度下降時における温度偏差量を求め
る手段と、サーボアンプ13とを具備し、温度偏
差量に応じて該サーボアンプ13からサーボ弁8
に制御信号を出力する。すなわち、目標温度との
偏差が大きい場合には冷却用空気の流量を多くす
るようにサーボ弁8に制御信号を出力し、偏差が
小さい場合には冷却用空気の流量を少なくするよ
うにサーボ弁8に制御信号を出力する。
The control means 11 includes means for determining the temperature deviation amount at the time of temperature drop from the target temperature waveform set by the temperature waveform setting device 12 and the detection signal input from the temperature sensor 9, and a servo amplifier 13, and a servo amplifier 13. From the servo amplifier 13 to the servo valve 8 according to
Outputs a control signal to. In other words, if the deviation from the target temperature is large, a control signal is output to the servo valve 8 to increase the flow rate of cooling air, and if the deviation is small, the servo valve 8 is output to the servo valve 8 to decrease the flow rate of cooling air. A control signal is output to 8.

制御手段11には補償回路14が設けられてい
る。この補償回路14は、温度下降開始時(高温
時)と温度下降終了時(低温時)とでは同じ温度
偏差量でも該偏差量を是正する冷却用空気の流量
が異なるため、温度に従つて偏差量信号を補償し
て目標温度と一致させる。すなわち、温度下降開
始時には高周波コイル5、テストピースTと冷却
用空気との温度差が大きく温度偏差量を是正する
のに少量の空気ですむが、温度が下降するに従つ
て高周波コイル5、テストピースTと冷却用空気
との温度差が小さく温度偏差量を是正するのに多
量の空気を必要とするため、温度の下降に従つて
冷却用空気の流量が多くなるように偏差量信号を
補償して目標温度と一致させる。
The control means 11 is provided with a compensation circuit 14 . This compensation circuit 14 compensates for the deviation according to the temperature because the flow rate of the cooling air to correct the deviation is different between the start of the temperature drop (high temperature) and the end of the temperature fall (low temperature) even if the temperature deviation is the same. Compensate the quantity signal to match the target temperature. That is, when the temperature starts to fall, there is a large temperature difference between the high-frequency coil 5, the test piece T, and the cooling air, and a small amount of air is required to correct the temperature deviation, but as the temperature starts to fall, the high-frequency coil 5, the test piece Since the temperature difference between the piece T and the cooling air is small and a large amount of air is required to correct the temperature deviation, the deviation signal is compensated so that the flow rate of cooling air increases as the temperature decreases. to match the target temperature.

次に上記実施例の作用を説明する。 Next, the operation of the above embodiment will be explained.

テストピースTに作用させる引張・圧縮荷重と
所定の相関関係をもつ温度波形を温度波形設定器
12に設定して、油圧シリンダ1、高周波コイル
5を運転する。この運転に際し、温度波形設定器
12の目標温度波形信号を温度調節器5aに出力
して、該信号に応じて高周波コイル5に通電され
る高周波電流を制御する。また、該目標温度波形
信号を制御手段11に出力し、該制御手段11で
温度センサ6からの検出信号と比較して、温度下
降時における目標温度との偏差量を求め、該偏差
量を補償回路14で補償してサーボ弁8を制御す
る。
A temperature waveform having a predetermined correlation with the tensile/compressive load applied to the test piece T is set in the temperature waveform setting device 12, and the hydraulic cylinder 1 and high frequency coil 5 are operated. During this operation, a target temperature waveform signal from the temperature waveform setting device 12 is output to the temperature controller 5a, and the high frequency current supplied to the high frequency coil 5 is controlled in accordance with the signal. Further, the target temperature waveform signal is output to the control means 11, and the control means 11 compares it with the detection signal from the temperature sensor 6 to determine the amount of deviation from the target temperature when the temperature decreases, and compensates for the amount of deviation. A circuit 14 compensates and controls the servo valve 8.

これにより、テストピースTは油圧シリンダ1
から機械的な衝撃を受けると同時に、高周波コイ
ル5、ノズル6から温度変化による熱衝撃を受け
る。このとき、補償回路14で温度偏差量が補償
されるため、目標温度波形とほぼ等しい温度変化
をテストピースTに与えることができる。この補
償回路14がないときには、第3図の点線で示す
ように、温度下降開始時付近では目標温度よりも
下がりすぎ、温度下降終了時付近では目標温度よ
りも高く、目標温度まで下がるのに時間遅れを生
ずる。
As a result, the test piece T is attached to the hydraulic cylinder 1.
At the same time, the high frequency coil 5 and the nozzle 6 receive a thermal shock due to temperature changes. At this time, since the temperature deviation amount is compensated by the compensation circuit 14, it is possible to give the test piece T a temperature change that is approximately equal to the target temperature waveform. Without this compensation circuit 14, as shown by the dotted line in Figure 3, the temperature drops too much below the target temperature near the start of the temperature drop, becomes higher than the target temperature near the end of the temperature drop, and it takes a long time for the temperature to drop to the target temperature. causing delays.

〔発明の効果〕〔Effect of the invention〕

本発明は前記したように、テストピースに作用
する荷重と、テストピースの温度変化との間に所
定の相関関係を持たせて加熱装置で温度制御を行
い熱疲労を試験する熱疲労試験装置において、冷
却用流体の流量を連続的に調整すると共に、補償
回路によつて温度下降時における目標温度と実際
の温度との温度偏差量を補償して、温度が下降す
るに従つて冷却用流体の流量を多くするように制
御したので、テストピースへの荷重変化に追従し
て温度制御を行うことができる等の効果を有する
ものである。
As described above, the present invention provides a thermal fatigue testing device that tests thermal fatigue by controlling the temperature with a heating device by establishing a predetermined correlation between the load acting on the test piece and the temperature change of the test piece. In addition to continuously adjusting the flow rate of the cooling fluid, the compensation circuit compensates for the temperature deviation between the target temperature and the actual temperature when the temperature decreases, so that the flow rate of the cooling fluid increases as the temperature decreases. Since the flow rate is controlled to be large, it is possible to control the temperature in accordance with changes in the load on the test piece.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示すもので、第1図
は全体のブロツク図、第2図は冷却用空気を吹き
付けるノズルの配置を示す説明図、第3図は温度
波形を示すグラフである。 T……テストピース、6……ノズル、8……サ
ーボ弁、9……温度センサ、11……制御手段、
13……サーボアンプ、12……温度波形設定
器、14……補償回路。
The drawings show one embodiment of the present invention; Fig. 1 is an overall block diagram, Fig. 2 is an explanatory diagram showing the arrangement of nozzles that spray cooling air, and Fig. 3 is a graph showing the temperature waveform. . T... Test piece, 6... Nozzle, 8... Servo valve, 9... Temperature sensor, 11... Control means,
13... Servo amplifier, 12... Temperature waveform setting device, 14... Compensation circuit.

Claims (1)

【特許請求の範囲】 1 温度調節手段を具備した加熱装置を有し、テ
ストピースに作用する荷重と、テストピースの温
度変化との間に所定の相関関係を持たせて前記加
熱装置で温度制御を行い熱疲労を試験する熱疲労
試験装置において、 前記テストピースを冷却する冷却用流体の流量
調節を行うサーボ弁と、 前記テストピースの温度を検出する温度センサ
と、 前記テストピースに作用させる引張・圧縮荷重
と所定の相関関係をもつ目標温度波形を前記加熱
装置に出力する目標波形設定器と、 該目標波形設定器よりの出力と前記温度センサ
からの検出出力とを比較して前記テストピースの
温度降下時における目標温度との偏差量を得る手
段と、 該偏差量に応じて前記サーボ弁を制御すると共
に前記温度センサよりの検出出力が低下するに従
つて、冷却用流体の流量を多くして目標温度と一
致させるべく前記偏差量を補償する補償回路と、 を具備したことを特徴とする熱疲労試験装置。
[Scope of Claims] 1. A heating device equipped with a temperature control means, the heating device controlling the temperature by establishing a predetermined correlation between the load acting on the test piece and the temperature change of the test piece. A thermal fatigue testing device for testing thermal fatigue by performing thermal fatigue testing, comprising: a servo valve that adjusts the flow rate of a cooling fluid that cools the test piece; a temperature sensor that detects the temperature of the test piece; and a tensile force that acts on the test piece. - A target waveform setter that outputs a target temperature waveform having a predetermined correlation with the compression load to the heating device; and a target waveform setter that compares the output from the target waveform setter with the detected output from the temperature sensor to determine the test piece. means for obtaining the amount of deviation from a target temperature when the temperature drops; and controlling the servo valve according to the amount of deviation, and increasing the flow rate of the cooling fluid as the detected output from the temperature sensor decreases. A thermal fatigue testing device comprising: a compensation circuit that compensates for the amount of deviation so as to match the target temperature.
JP17510984A 1984-08-24 1984-08-24 Apparatus for testing thermal fatigue Granted JPS6153546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17510984A JPS6153546A (en) 1984-08-24 1984-08-24 Apparatus for testing thermal fatigue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17510984A JPS6153546A (en) 1984-08-24 1984-08-24 Apparatus for testing thermal fatigue

Publications (2)

Publication Number Publication Date
JPS6153546A JPS6153546A (en) 1986-03-17
JPH0453250B2 true JPH0453250B2 (en) 1992-08-26

Family

ID=15990419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17510984A Granted JPS6153546A (en) 1984-08-24 1984-08-24 Apparatus for testing thermal fatigue

Country Status (1)

Country Link
JP (1) JPS6153546A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2550803Y2 (en) * 1989-08-31 1997-10-15 株式会社島津製作所 Material testing equipment
KR100801404B1 (en) 2006-06-26 2008-02-11 이보영 Apparatus for fomating a thermal-fatigue crack
CN103674753B (en) * 2013-12-09 2015-12-23 昆明理工大学 The test platform of a kind of thermal shock and heat fatigue
CN106855253B (en) * 2016-11-16 2019-08-13 中国北方发动机研究所(天津) A kind of novel three-dimensional freedom degree burner arm device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579723U (en) * 1980-06-17 1982-01-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579723U (en) * 1980-06-17 1982-01-19

Also Published As

Publication number Publication date
JPS6153546A (en) 1986-03-17

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