JPH0453098B2 - - Google Patents
Info
- Publication number
- JPH0453098B2 JPH0453098B2 JP17734785A JP17734785A JPH0453098B2 JP H0453098 B2 JPH0453098 B2 JP H0453098B2 JP 17734785 A JP17734785 A JP 17734785A JP 17734785 A JP17734785 A JP 17734785A JP H0453098 B2 JPH0453098 B2 JP H0453098B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- substrate storage
- storage box
- long groove
- feeding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 7
- 239000011295 pitch Substances 0.000 claims description 5
- 239000000969 carrier Substances 0.000 description 9
- 230000032258 transport Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Reciprocating Conveyors (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体基板製造行程において、半導
体基板を収納した半導体基板収納箱（以下キヤリ
アと称する）を半導体基板の処理装置に供給する
搬送方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a transportation method for supplying a semiconductor substrate storage box (hereinafter referred to as a carrier) containing semiconductor substrates to a semiconductor substrate processing apparatus in a semiconductor substrate manufacturing process. It is related to.
従来、この種の搬送装置は第３図に示す様にガ
イド１の両側に２条の駆動チエーン２，２を平行
に張設し、両チエーン２，２に送りバー３，……
を所定のピツチで懸け渡してあり、ガイド１上に
移送されたキヤリア４を後方から送りバー３にて
押し、該キヤリア４に送りを与えてこれを半導体
基板の処理装置まで搬送させていた。
Conventionally, this type of conveying device has two drive chains 2, 2 stretched in parallel on both sides of a guide 1, as shown in FIG. 3, and feed bars 3, . . .
are suspended at a predetermined pitch, and a carrier 4 transferred onto a guide 1 is pushed from behind by a feed bar 3 to feed the carrier 4 to transport it to a semiconductor substrate processing apparatus.
このため、キヤリアの搬送装置のセツトに空き
ができると、そのままの状態で送られていくた
め、搬送装置に収納できるキヤリアの数が減少す
る。又、空きができると、半導体基板処理装置へ
キヤリアが間欠的に送られるため、半導体基板処
理装置を有効に使用できるという欠点があつた。
For this reason, when a set of carriers becomes available in a conveying device, the carriers are sent as they are, reducing the number of carriers that can be stored in the conveying device. Further, when a space becomes available, the carrier is intermittently sent to the semiconductor substrate processing apparatus, which has the disadvantage that the semiconductor substrate processing apparatus cannot be used effectively.
本発明は空きピツチをなくし、連続的に半導体
基板の収納箱を処理装置に搬送する搬送方法を提
供するものである。 The present invention provides a transport method that eliminates empty pitches and continuously transports storage boxes of semiconductor substrates to a processing device.
本発明は、半導体基板を収納したキヤリアを搬
送装置によつて処理装置に供給する搬送方法にお
いて、前記搬送装置は前記キヤリアを自動的にピ
ツチ送りする送り機構を具備し、前記送り機構は
搬送路を長手方向に沿つて複数に区切された各区
間毎に独立に設けられそれぞれガイドと送り棒を
有し、該ガイドは各区間毎に搬送路の長手方向に
開口された長溝であり、該送り棒は長溝の始端と
末端間を往復動し往行程では長溝内より搬送路上
に突出し、復行程では長溝内に退避するものであ
り、上記搬送装置にキヤリアをセツトした場合、
送り先に他のキヤリアが見つかる迄各送り機構を
駆動して送りを繰り返えし複数のキヤリアをつめ
て空きをなくし、これにより連続してキヤリアを
前記処理装置に搬送させることを特長とする半導
体基板収納箱の搬送方法である。
The present invention provides a transportation method for supplying a carrier containing a semiconductor substrate to a processing device using a transportation device, wherein the transportation device is equipped with a feeding mechanism that automatically pitches the carrier, and the feeding mechanism is arranged along a transportation path. is divided into a plurality of sections along the longitudinal direction, and each section is provided independently and has a guide and a feed rod, and the guide is a long groove opened in the longitudinal direction of the conveyance path for each section, and the feed rod is provided independently for each section. The rod reciprocates between the starting end and the end of the long groove, protrudes from inside the long groove onto the conveying path in the forward stroke, and retreats into the long groove in the backward stroke.When the carrier is set in the above-mentioned conveying device,
A semiconductor characterized in that each feeding mechanism is driven to repeat feeding until another carrier is found at the destination, and a plurality of carriers are packed together to eliminate empty spaces, thereby continuously conveying the carriers to the processing device. This is a method of transporting a board storage box.
以下、本発明の一実施例を図によつて説明す
る。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図において、本発明はガイド（搬送路）１
を長さ方向に複数の区間１ａ，１ｂ，１ｃに区切
り、各区間１ａ，１ｂ，１ｃ毎にキヤリア４の送
り機構を個々に独立させて設置し、各区関で１キ
ヤリア分の送りを行わせ、キヤリアの空きをなく
したものである。 In FIG. 1, the present invention includes a guide (transport path) 1
is divided into a plurality of sections 1a, 1b, and 1c in the length direction, and a feeding mechanism for the carrier 4 is installed independently for each section 1a, 1b, and 1c, so that one carrier's worth of feeding is performed at each section. , which eliminates carrier space.
前記送り機構は第１図、第２図に示すように構
成される。すなわち、各区間毎のガイド１には長
溝５がそれぞれ設けられ、各長溝５に沿つて送り
棒６が往復動可能に設けられ、かつ該送り棒６は
長溝５の始端５ａと末端５ｂ位置で昇降させられ
る。 The feeding mechanism is constructed as shown in FIGS. 1 and 2. That is, the guide 1 for each section is provided with a long groove 5, and a feed rod 6 is provided so as to be able to reciprocate along each long groove 5. be raised and lowered.
実施例において、第１図に示すようにキヤリア
４がセツトされた場合、送り先にキヤリアが見つ
かる迄、各送り機構を駆動して送りを繰り返しキ
ヤリア間をつめて空きをなくし、連続してキヤリ
ア４を処理装置に搬送させる。キヤリアの送りは
第２図に示すように送り棒６が定位置７ａより上
端位置７ｂへ上昇後、送り位置７ｃへ水平移動
し、キヤリア４を送る。その後、送り下端７ｄへ
下降し定位置へ戻る動作を１つのサイクルとす
る。 In the embodiment, when the carriers 4 are set as shown in FIG. 1, each feeding mechanism is driven to repeatedly feed the carriers until a carrier is found at the destination, closing the spaces between the carriers to eliminate any empty spaces, and continuously setting the carriers 4. is transported to a processing device. To feed the carrier, as shown in FIG. 2, the feed rod 6 rises from the home position 7a to the upper end position 7b, and then horizontally moves to the feed position 7c to feed the carrier 4. Thereafter, the operation of descending to the lower feed end 7d and returning to the home position constitutes one cycle.
このように、本発明に用いる搬送装置は、各区
間毎の送り機構はそれぞれが個々に独立している
から、個々に駆動して送りを繰り返し行うことに
よつて空きピツチがなくなり、連続搬送が可能と
なる。 As described above, in the conveying device used in the present invention, since the feeding mechanism for each section is individually independent, empty pitches are eliminated by repeatedly driving and feeding individually, and continuous conveyance is possible. It becomes possible.
以上説明したように本発明は単独の送り機構を
各キヤリア定位置毎に取り付けることにより、各
定位置でのあきをなくすことができ、搬送装置及
び半導体基板処理装置を有効に使用することがで
きる効果を有するものである。
As explained above, in the present invention, by attaching a single feeding mechanism to each fixed position of the carrier, it is possible to eliminate gaps at each fixed position, and it is possible to effectively use the transport device and the semiconductor substrate processing device. It is effective.
第１図は本発明の一実施例を示す全体図、第２
図は第１図の搬送システム図、第３図は従来の搬
送装置の全体図である。
１……ガイド、４……キヤリア、（５……長溝、
６……送り棒）送り機構。
FIG. 1 is an overall view showing one embodiment of the present invention, and FIG.
The figure is a diagram of the conveyance system shown in FIG. 1, and FIG. 3 is an overall view of the conventional conveyance device. 1... Guide, 4... Carrier, (5... Long groove,
6...Feeding rod) Feeding mechanism.
Claims (1)
送装置によつて処理装置に供給する搬送方法にお
いて、前記搬送装置は前記半導体基板収納箱を自
動的にピツチ送りする送り機構を具備し、前記送
り機構は搬送路を長手方向に沿つて複数に区切ら
れた各区間毎に独立に設けられたそれぞれガイド
と送り棒を有し、該ガイドは各区間毎に搬送路の
長手方向に開口された長溝であり、該送り棒は長
溝の始端と末端間を往復動し往行程では長溝内よ
り搬送路上に突出し、復行程では長溝内に退避す
るものであり、上記搬送装置に半導体基板収納箱
をセツトした場合、送り先に他の半導体基板収納
箱が見つかる迄各送り機構を駆動して送りを繰り
返し複数の半導体基板収納箱間をつめて空きをな
くし、これにより連続して半導体基板収納箱を前
記処理装置に搬送させることを特徴とする半導体
基板収納箱の搬送方法。1. In a transport method for supplying a semiconductor substrate storage box containing semiconductor substrates to a processing device by a transport device, the transport device includes a feeding mechanism that automatically pitches the semiconductor substrate storage box, and the feeding mechanism The conveyance path is divided into a plurality of sections along the longitudinal direction, and each section has a guide and a feed rod provided independently, and the guide is a long groove opened in the longitudinal direction of the conveyance path for each section. The feed rod reciprocates between the starting end and the end of the long groove, protrudes from inside the long groove onto the conveying path in the forward stroke, and retreats into the long groove in the backward stroke. In such a case, each sending mechanism is driven to repeatedly feed the semiconductor substrate storage boxes until another semiconductor substrate storage box is found at the destination, so that there is no space between the multiple semiconductor substrate storage boxes. 1. A method for transporting a semiconductor substrate storage box, the method comprising: transporting a semiconductor substrate storage box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17734785A JPS6237941A (en) | 1985-08-12 | 1985-08-12 | Conveying apparatus of semiconductor-substrate container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17734785A JPS6237941A (en) | 1985-08-12 | 1985-08-12 | Conveying apparatus of semiconductor-substrate container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237941A JPS6237941A (en) | 1987-02-18 |
| JPH0453098B2 true JPH0453098B2 (en) | 1992-08-25 |
Family
ID=16029378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17734785A Granted JPS6237941A (en) | 1985-08-12 | 1985-08-12 | Conveying apparatus of semiconductor-substrate container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237941A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2007269203B2 (en) | 2006-06-30 | 2014-03-06 | Smith & Nephew, Inc. | Anatomical motion hinged prosthesis |
| JP7376349B2 (en) * | 2019-12-26 | 2023-11-08 | 株式会社安川電機 | Work processing system |
-
1985
- 1985-08-12 JP JP17734785A patent/JPS6237941A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6237941A (en) | 1987-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |