JPH0453050U - - Google Patents
Info
- Publication number
- JPH0453050U JPH0453050U JP9603390U JP9603390U JPH0453050U JP H0453050 U JPH0453050 U JP H0453050U JP 9603390 U JP9603390 U JP 9603390U JP 9603390 U JP9603390 U JP 9603390U JP H0453050 U JPH0453050 U JP H0453050U
- Authority
- JP
- Japan
- Prior art keywords
- plating tank
- plating
- conductor
- center
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims 2
Landscapes
- Coating With Molten Metal (AREA)
Description
第１図は本考案によるメツキ装置の一実施例を
示す概略正面図、第２図Ａ及びＢはパスラインが
メツキ槽の中心軸線の真下にあるときのメツキ槽
の上面図及び正面図、第３図は従来のメツキ装置
の一例を示す概略正面図、第４図Ａ及びＢは第３
図のメツキ装置の非運転時及び運転時におけるそ
れぞれ右側面図である。
１０……メツキ槽、１１……支持台、１３……
パスライン、１４……メツキ浴、１５……ダイス
、Ｅ１〜Ｅ７……電極棒体。
FIG. 1 is a schematic front view showing an embodiment of the plating device according to the present invention, FIGS. 2A and 2B are top and front views of the plating tank when the pass line is directly below the central axis of the plating tank, and FIG. Fig. 3 is a schematic front view showing an example of a conventional plating device, and Fig. 4 A and B are the third plating device.
FIG. 3 is a right side view of the plating device shown in the figure when it is not in operation and when it is in operation, respectively. 10... plating tank, 11... support stand, 13...
Pass line, 14... Plating bath, 15... Dice, E1 to E7... Electrode rod body.
Claims (1)
ツキされるべき導体の入口側を高くした傾斜状態
でかつ中心からはずれた位置において回転可能に
支承する支承手段と、前記メツキ槽を回転駆動す
る位置調節手段と、前記メツキ槽内に配置され、
前記メツキ槽の回転動作を制御する複数の長さの
異なる電極とを具備し、前記メツキ槽の中心から
はずれた回転軸線を導体のパスラインとすること
を特徴とするメツキ装置。 A plating tank having a hollow cylindrical shape, a support means for rotatably supporting the plating tank in an inclined state with the inlet side of the conductor to be plated elevated and at a position offset from the center, and rotationally driving the plating tank. a position adjusting means arranged in the plating tank,
A plating device comprising a plurality of electrodes of different lengths for controlling the rotational operation of the plating tank, the plating device having a rotational axis deviated from the center of the plating tank as a pass line of the conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9603390U JPH0453050U (en) | 1990-09-14 | 1990-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9603390U JPH0453050U (en) | 1990-09-14 | 1990-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0453050U true JPH0453050U (en) | 1992-05-06 |
Family
ID=31835249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9603390U Pending JPH0453050U (en) | 1990-09-14 | 1990-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453050U (en) |
-
1990
- 1990-09-14 JP JP9603390U patent/JPH0453050U/ja active Pending