JPH0452754U - - Google Patents
Info
- Publication number
- JPH0452754U JPH0452754U JP9477590U JP9477590U JPH0452754U JP H0452754 U JPH0452754 U JP H0452754U JP 9477590 U JP9477590 U JP 9477590U JP 9477590 U JP9477590 U JP 9477590U JP H0452754 U JPH0452754 U JP H0452754U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9477590U JPH0452754U (en) | 1990-09-11 | 1990-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9477590U JPH0452754U (en) | 1990-09-11 | 1990-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452754U true JPH0452754U (en) | 1992-05-06 |
Family
ID=31832983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9477590U Pending JPH0452754U (en) | 1990-09-11 | 1990-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452754U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016107594A (en) * | 2014-12-10 | 2016-06-20 | エスアイアイ・セミコンダクタ株式会社 | Resin sealing mold and manufacturing method thereof, and semiconductor device |
-
1990
- 1990-09-11 JP JP9477590U patent/JPH0452754U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016107594A (en) * | 2014-12-10 | 2016-06-20 | エスアイアイ・セミコンダクタ株式会社 | Resin sealing mold and manufacturing method thereof, and semiconductor device |