JPH0452081A - Projection welding method and its electrode - Google Patents

Projection welding method and its electrode

Info

Publication number
JPH0452081A
JPH0452081A JP2157024A JP15702490A JPH0452081A JP H0452081 A JPH0452081 A JP H0452081A JP 2157024 A JP2157024 A JP 2157024A JP 15702490 A JP15702490 A JP 15702490A JP H0452081 A JPH0452081 A JP H0452081A
Authority
JP
Japan
Prior art keywords
welding
wire
metal wire
protrusion
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2157024A
Other languages
Japanese (ja)
Inventor
Hidetoshi Oishi
英俊 大石
Noboru Sugiura
登 杉浦
Ryoichi Kobayashi
良一 小林
Katsuyoshi Izawa
井沢 勝嘉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2157024A priority Critical patent/JPH0452081A/en
Publication of JPH0452081A publication Critical patent/JPH0452081A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Abstract

PURPOSE:To obviate positional deviation at the time of welding a metallic plate to a metallic wire which are elements to be welded and to improve positioning accuracy by forming crossing positioning grooves to satisfy specified conditions on the welding side end face of one electrode of welding electrodes. CONSTITUTION:The positioning grooves 23 to orthogonally cross groove parts A and B are formed on one end face of the upper electrode 10 and the groove part A and the groove part B position a projection 2 and a Ni wire 3, respectively. The groove part A and the groove part B have a width W1 capable of fitting the projection 2 and a width W2 capable of fitting the Ni wire 3, respectively and the relation among a depth d1 of the groove part A and a depth d2 of the groove part B of the positioning grooves 23, a height (h) of the projection 2 and a diameter phil of the Ni wire 3 is set so as to satisfy the conditions of d1<d2, phil<d2<phil+(h). After setting as mentioned above is carried out, a welding current is applied between the projection 2 and the Ni wire 3 by the electrodes 10 and 11 and the projection 2 and the Ni wire 3 are subjected to resistance welding together.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えば板状端子等のような金属板とNiワイ
ヤ等の金属線との接合を行う場合のプロジェクション溶
接法及びこれに用いる電極に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a projection welding method for joining a metal plate such as a plate-shaped terminal and a metal wire such as a Ni wire, and an electrode used therefor. Regarding.

〔従来の技術〕 従来の電子装置には1例えば特開昭57−131031
号公報に開示されるように、電子回路を合成樹脂のモー
ルドケースに収納し、また、電子回路に電力を供給した
り外部に電気信号を取り出すために、モールドケースに
配設された端子(金属板)と電子回路とをNiワイヤ等
の金属線を介して電気的に接続したものがある。
[Prior art] Conventional electronic devices include 1, for example, Japanese Patent Application Laid-Open No. 57-131031.
As disclosed in the publication, an electronic circuit is housed in a synthetic resin molded case, and terminals (metallic There is one in which the electronic circuit is electrically connected to the electronic circuit via a metal wire such as a Ni wire.

このような金属板と金属線とを接合する場合には、接続
の信頼性を高めるために電気抵抗溶接法が採用されてい
るが、最近では、溶接電流及び加圧力の集中を図るため
に、金属板の溶接側表面に突起を形成し、この突起に金
属線を交差接触させてプロジェクション溶接を行ってい
る。
When joining such metal plates and metal wires, electric resistance welding is used to improve the reliability of the connection, but recently, in order to concentrate the welding current and pressure, Projections are formed on the surface of the metal plate on the welding side, and a metal wire is brought into cross-contact with the projections to perform projection welding.

また、従来の電気抵抗溶接法には、特開昭63−201
86号公報に開示されるように、線材同士を縦、横に格
子状に配列するものにおいて、これらの線材同士の交差
部を加圧して抵抗溶接を行う場合に、予め双方の溶接電
極の対向面にそれぞれ交差状の位置決め溝を形成したも
のが提案されている。
In addition, the conventional electric resistance welding method includes JP-A-63-201
As disclosed in Publication No. 86, when wires are arranged vertically and horizontally in a lattice pattern and resistance welding is performed by pressurizing the intersections of these wires, both welding electrodes must be aligned in advance to face each other. One in which intersecting positioning grooves are formed on each surface has been proposed.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、上記従来技術のうち前者のように金属板と金
属線とをプロジェクション溶接する場合には、金属板側
の突起に対して金属線が位置ずれしたり、金属線が望む
方向に向かないで溶接されることがある。
By the way, when projection welding a metal plate and a metal wire as in the former of the above conventional techniques, the metal wire may be misaligned with respect to the protrusion on the metal plate side, or the metal wire may not be directed in the desired direction. May be welded.

また、金属線が突起を支点として上下方向に傾く場合が
ある。このような傾きがある程度以上に大きくなると、
金属線が接合箇所となる金属板側の突起の他に端子表面
に接触し、この状態でプロジェクション溶接を行うと、
その溶接電流が分流して溶接に不具合が生じる。
Further, the metal wire may tilt in the vertical direction using the protrusion as a fulcrum. When this slope becomes larger than a certain level,
If the metal wire comes into contact with the surface of the terminal as well as the protrusion on the metal plate side where it will be joined, and projection welding is performed in this state,
The welding current shunts, causing problems in welding.

また、後者の場合には、両方の溶接電極の端面に交差す
る線材(被溶接物)を嵌合させる線材位置決め用の溝が
形成しである。しかし、この従来技術は、線材同士の位
置決めの場合は良いが、金属板と金属線との溶接の位置
決めに対しては構造的な配慮がなされていない。
In the latter case, grooves for positioning wire rods into which intersecting wire rods (workpieces to be welded) are fitted are formed on the end faces of both welding electrodes. However, although this prior art is good for positioning wires together, no structural consideration is given to positioning when welding a metal plate and a metal wire.

本発明は以上の点に鑑みてなされたもので、その目的と
するところは、金属板と金属線とをプロジェクション溶
接する場合の位置決め精度及び溶接電流の分流防止の少
なくとも一つについては満足させることで、溶接の強度
確保及び生産性を向上させることにある。
The present invention has been made in view of the above points, and its purpose is to satisfy at least one of positioning accuracy and prevention of welding current shunt when projection welding a metal plate and a metal wire. The aim is to ensure welding strength and improve productivity.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、大別して次のような基本的な課題解決手段を
提案する。
The present invention proposes the following basic problem solving means.

その一つ(第1の課題解決手段とする)は、金属板と金
属線とを溶接する場合に、前記金属板の表面に突起を形
成し、この突起と前記金属線とを交差接触させ、前記金
属板・金属線を対の電極により加圧挾持して電流を流し
電気抵抗溶接を行う溶接法において、 前記電極のうち前記突起及び金属線に対面する一方の電
極の溶接側端面に、溝部A、Bを交差させた位置決め溝
を形成し、このうち溝部Aは前記突起に嵌合可能な@W
1、溝部Bは前記金属線に嵌合可能な幅W2とし、且つ
前記位置決め溝のうち溝部Bの深さd2、前記突起の高
さh及び前記金属線の直径Φlの関係を、ΦR(d2<
Φl+hの条件を満足するように設定して、この一方の
電極に設けた溝部A、Hにより前記突起及び金属線を嵌
合させつつ、前記溶接電極を介して電気抵抗溶接を行う
One of them (referred to as the first problem solving means) is that when welding a metal plate and a metal wire, a protrusion is formed on the surface of the metal plate, and the protrusion and the metal wire are brought into cross contact. In the welding method in which the metal plate/metal wire is held under pressure by a pair of electrodes and electric current is applied to perform electric resistance welding, a groove is formed on the welding side end face of one of the electrodes facing the protrusion and the metal wire. A positioning groove is formed in which A and B intersect, and groove part A is @W that can fit into the protrusion.
1. The groove B has a width W2 that can fit the metal wire, and the relationship among the depth d2 of the groove B of the positioning groove, the height h of the protrusion, and the diameter Φl of the metal wire is ΦR(d2 <
Electric resistance welding is performed through the welding electrode while the protrusion and metal wire are fitted into the grooves A and H provided in one of the electrodes by setting the condition of Φl+h to be satisfied.

もう一つ(第2の課題解決手段とする)は、金属板と金
属線とを溶接する場合に、前記金属板の表面に突起を形
成し、この突起と前記金属線とを交差接触させ、前記金
属板・金属線を溶接用の対の電極により加圧挾持して電
流を流し電気抵抗溶接を行う溶接法において、 前記金属板の表面に予め該金属板表面を覆う絶縁層を形
成し、この絶縁層により溶接時の金属線が前記金属板の
溶接部以外の所に接触した場合の溶接電流の分流を防止
して、プロジェクション溶接を行うことを提案する。
Another method (second problem solving means) is that when welding a metal plate and a metal wire, a protrusion is formed on the surface of the metal plate, and the protrusion and the metal wire are brought into cross contact. In the welding method in which the metal plate/metal wire is held under pressure by a pair of welding electrodes and electric current is applied to perform electric resistance welding, an insulating layer covering the surface of the metal plate is formed in advance on the surface of the metal plate, It is proposed that this insulating layer prevents the welding current from being shunted when the metal wire during welding comes into contact with a part other than the welded part of the metal plate, thereby performing projection welding.

〔作用〕[Effect]

第1の課題解決手段の作用・・・本課題解決手段では、
プロジェクション溶接を行う場合に、溶接用電極のうち
一方の電極の溶接側端面に形成した位置決め溝の溝部A
と溝部Bとの幅を突起及び金属線対応の幅W1及びW2
とし、且つこれらの溝部のうち金属線を嵌め込む側の溝
部Bの深さd2を金属線の径Φlに対しΦR<d2の関
係を満足させることで、立体交差する突起及び金属線に
、これと対応の溝部A及び溝部Bを支障なく一方側から
嵌め込むことができる。換言すれば、一方の電極の位置
決め溝(交差溝)だけで、突起及び金属線の双方の位置
を拘束し適正な位置決めを可能にする。
Effects of the first problem solving means... In this problem solving means,
Groove A of the positioning groove formed on the welding side end face of one of the welding electrodes when performing projection welding.
and groove B are widths W1 and W2 corresponding to protrusions and metal wires.
By making the depth d2 of the groove B on the side into which the metal wire is fitted satisfy the relationship ΦR<d2 with respect to the diameter Φl of the metal wire, this The corresponding grooves A and B can be fitted from one side without any problem. In other words, only the positioning groove (intersecting groove) of one electrode restricts the positions of both the protrusion and the metal wire, allowing proper positioning.

ちなみに、上記関係を満足しない場合、例えば前述の特
開昭63−20186号のように電極に交差する各溝部
の深さが線材の直径ΦΩより小さい場合には、一方の電
極の交差溝だけで、立体交差する突起と金属線の双方を
嵌め込むこと(位置合わせすること)ができない。
By the way, if the above relationship is not satisfied, for example, if the depth of each groove intersecting the electrode is smaller than the diameter ΦΩ of the wire as in the above-mentioned Japanese Patent Application Laid-open No. 63-20186, only the intersecting grooves of one electrode , it is not possible to fit (align) both the three-dimensionally intersecting protrusion and the metal wire.

さらに本課題解決手段では、交差溝のうち金属線に対応
の位置決め溝部Bの深さd2を突起の高さh及び金属線
の径Φlの和よりも小さくしであるので(d2〈Φu+
h) 、この溝付き電極が突起以外の金属板表面に接触
することがない。また、上記寸法関係から溝部Bの内壁
上部が金属線と当接することで、金属線の傾きを規制す
る。従って。
Furthermore, in this problem solving means, the depth d2 of the positioning groove part B corresponding to the metal wire among the intersecting grooves is made smaller than the sum of the height h of the protrusion and the diameter Φl of the metal wire (d2<Φu+
h) This grooved electrode does not come into contact with the surface of the metal plate other than the protrusion. Further, due to the above-mentioned dimensional relationship, the upper part of the inner wall of the groove B comes into contact with the metal wire, thereby regulating the inclination of the metal wire. Therefore.

溶接時に金属線が金属板の表面(突起以外の表面)に接
触するのを防止し、プロジェクション溶接時に溶接電流
が分流するような事態を防止する。
To prevent a metal wire from coming into contact with the surface of a metal plate (a surface other than a projection) during welding, and to prevent a situation where welding current is shunted during projection welding.

第2の課題解決手段の作用・・・本課題解決手段によれ
ば、金属板の溶接側表面に絶縁層が形成しであるので、
プロジェクション溶接時に金属線が傾いて金属板に接し
ても、絶縁層の存在により溶接電流の分流を防止する。
Effect of the second problem-solving means...According to the present problem-solving means, since an insulating layer is formed on the welding side surface of the metal plate,
Even if the metal wire tilts and contacts the metal plate during projection welding, the presence of the insulating layer prevents the welding current from splitting.

このような絶縁層は被溶接箇所たる突起表面に形成した
場合でも、プロジェクション溶接は支障なく行われる。
Even when such an insulating layer is formed on the surface of a protrusion that is a welded part, projection welding can be performed without any problem.

その理由は、(イ)溶接電流が大電流(例えば約100
0A程度)であり、(ロ)しかもプロジェクション溶接
は、加圧力を与えて行うので、突起・金属線の接触圧が
強く、この接触抵抗が被溶接部以外の金属板表面・金属
線の絶縁層を介した接触抵抗よりも充分に小さいので、
突起・金属線間に絶縁破壊を起こして集中した溶接電流
を流せるためである。
The reason for this is (a) the welding current is a large current (for example, about 100%
(approximately 0A) and (b) Moreover, since projection welding is performed by applying pressure, the contact pressure between the protrusion and the metal wire is strong, and this contact resistance causes damage to the surface of the metal plate other than the part to be welded and the insulation layer of the metal wire. Since it is sufficiently smaller than the contact resistance via
This is because dielectric breakdown occurs between the protrusion and the metal wire, allowing a concentrated welding current to flow.

〔実施例〕〔Example〕

本発明の実施例を図面により説明する。 Embodiments of the present invention will be described with reference to the drawings.

第1図は1本発明の第1実施例に係るプロジェクション
溶接の説明図、第2図は、その一部を取り出した説明図
、第3図は溶接用電極の一方の電極構造を示す説明図で
、これらの説明に先立ち、第5図によりプロジェクショ
ン溶接の対象たる電子装置の具体例及び第6図によりプ
ロジェクション溶接を行う装置について説明する。
Fig. 1 is an explanatory diagram of projection welding according to the first embodiment of the present invention, Fig. 2 is an explanatory diagram of a part thereof, and Fig. 3 is an explanatory diagram showing the structure of one of the welding electrodes. Prior to these descriptions, a specific example of an electronic device to be subjected to projection welding will be described with reference to FIG. 5, and an apparatus for performing projection welding will be described with reference to FIG. 6.

第5図は、電子装置として自動車用点火制御に用いるパ
ワースイッチングモジュールを示した平面図で、合成樹
脂のモールドケース5内にパワートランジスタを備えた
電子回路4が組み込まれる。
FIG. 5 is a plan view showing a power switching module used for automobile ignition control as an electronic device, in which an electronic circuit 4 including a power transistor is built into a synthetic resin molded case 5.

また、ケース5内には、ケース5に半ば埋設されて支持
された板状の金属端子(例えば銅板)1が配設され、端
子1と電子回路4とがNiワイヤ3を介して電気的に接
続される。
Further, a plate-shaped metal terminal (for example, a copper plate) 1 is disposed inside the case 5 and supported by being partially buried in the case 5, and the terminal 1 and the electronic circuit 4 are electrically connected via the Ni wire 3. Connected.

端子1とNiワイヤ3とは、端子1側にNiワイヤ3と
直交する突起2をプレス加工により設けてプロジェクシ
ョン溶接により接合される。
The terminal 1 and the Ni wire 3 are joined by projection welding, with a protrusion 2 orthogonal to the Ni wire 3 provided on the terminal 1 side by press working.

プロジェクション溶接装置は、第6図に示すように、溶
接機の本体6に、溶接ヘッド7、一対の上下ホルダー8
,9等を備える。
As shown in FIG. 6, the projection welding device includes a welding machine main body 6, a welding head 7, and a pair of upper and lower holders 8.
, 9 etc.

上部電極10及び下部電極11は、それぞれのホルダー
8及び9に支持されて対向配置される。
The upper electrode 10 and the lower electrode 11 are supported by respective holders 8 and 9 and are arranged to face each other.

このうち、上部電極10は、ホルダー8及び溶接機本体
6に組み込まれる昇降機構を介して上下方向に移動可能
としである。12は、電極10,11が被溶接部材を加
圧挾持した時の加圧力を調整する機構である。
Among these, the upper electrode 10 is movable in the vertical direction via a lifting mechanism built into the holder 8 and the welding machine main body 6. Reference numeral 12 is a mechanism for adjusting the pressing force when the electrodes 10 and 11 pressurize and clamp the member to be welded.

13は溶接ケーブル、14はジャンパケーブル、15は
溶接トランス、16は溶接に必要な動作や電流制御等を
行うコントロールユニットである。
13 is a welding cable, 14 is a jumper cable, 15 is a welding transformer, and 16 is a control unit that performs operations necessary for welding, current control, etc.

本実施例では、電極10.11により前記電子装置の板
状端子1とNiワイヤ3とを加圧挾持してプロジェクシ
ョン溶接を行うが、その溶接は次のようにして行われる
In this embodiment, projection welding is performed by pressing and clamping the plate terminal 1 of the electronic device and the Ni wire 3 using the electrodes 10.11, and the welding is performed as follows.

第3図の(a)、(b)には、上部電極10の溶接側(
加圧挾持側)一端面の側面を角度を変えて表し、第3図
(c)は、その下面図を示す。
3(a) and (b) show the welding side of the upper electrode 10 (
The side surface of one end surface (pressure clamping side) is shown at a different angle, and FIG. 3(c) shows a bottom view thereof.

これらの図から明らかなように、上部電極1゜の一端面
には、溝部A、Bを直角に交差させた位置決め溝23が
形成され、溝部Aが突起2に対する位置決め、溝部Bが
Niワイヤ3に対する位置決めを行う。
As is clear from these figures, a positioning groove 23 in which grooves A and B intersect at right angles is formed on one end surface of the upper electrode 1°, groove A is used for positioning the protrusion 2, and groove B is used for positioning the Ni wire 3. Perform positioning against.

本実施例では、溝部Aは突起2に嵌合可能な幅W1、溝
部BはNiワイヤ3に嵌合可能な幅w2とし、位置決め
溝23のうち溝部Aの深さdl、溝部Bの深さd2.突
起2の高さh及びNiワイヤ3の直径Φlの関係を、d
 1<d 2、Φfind2くΦn+hの条件を満足す
るように設定する。
In this embodiment, the groove A has a width W1 that can fit into the projection 2, the groove B has a width W2 that can fit the Ni wire 3, and the depth dl of the groove A and the depth of the groove B of the positioning groove 23. d2. The relationship between the height h of the protrusion 2 and the diameter Φl of the Ni wire 3 is expressed as d
The setting is made to satisfy the following conditions: 1<d2, Φfind2×Φn+h.

dlとd2は、d1≧d2でもよい。dl and d2 may be d1≧d2.

次に第1図及び第2図により本実施例におけるプロジェ
クション溶接を説明する。
Next, projection welding in this embodiment will be explained with reference to FIGS. 1 and 2.

溶接を行う場合には、第1図に示すように予めパワース
イッチング装置のモールドケース5に端子1を組み込み
、ケース5の上下を開放状態とする。
When welding is to be performed, the terminals 1 are assembled in advance into a molded case 5 of a power switching device, as shown in FIG. 1, and the upper and lower sides of the case 5 are left open.

ケース5を溶接作業位置にセットし、被溶接要素たる端
子1の突起2とNiワイヤ3とを交差させ、この状態で
ケース5の上下開口から電極10゜11を導入する。
The case 5 is set at the welding work position, the protrusion 2 of the terminal 1, which is the element to be welded, and the Ni wire 3 are crossed, and in this state, the electrodes 10° 11 are introduced from the upper and lower openings of the case 5.

電極10の溝部Aに突起2を、電極10の溝部BにNi
ワイヤ3を嵌め込み、この状態で上部電極10を下降さ
せて、突起2及びNiワイヤ3を電極10.11により
加圧挾持する。この加圧挾持状態では、前述したように
溝部Bの深さd2が。
The protrusion 2 is placed in the groove A of the electrode 10, and the Ni is placed in the groove B of the electrode 10.
The wire 3 is fitted, and in this state, the upper electrode 10 is lowered, and the protrusion 2 and the Ni wire 3 are held under pressure by the electrodes 10.11. In this pressurized clamping state, the depth d2 of the groove B is as described above.

Niワイヤ3の直径Φρ及び端子2の高さhの和より小
さくしであるので、溝部BがNiワイヤ3上面に支持さ
れて浮いた状態となり、従って電極10が端子2の表面
に接触することはない。
Since it is smaller than the sum of the diameter Φρ of the Ni wire 3 and the height h of the terminal 2, the groove B is supported by the upper surface of the Ni wire 3 and is in a floating state, so that the electrode 10 does not come into contact with the surface of the terminal 2. There isn't.

また、Niワイヤ3は溝部B内壁からの規制を受けるた
め、上下方向の傾きが抑制される。この傾き抑制により
、Niワイヤ3が端子1の表面に接触しない角度(10
度以内)を維持される。
Furthermore, since the Ni wire 3 is regulated by the inner wall of the groove B, vertical inclination is suppressed. By suppressing this inclination, the Ni wire 3 is kept at an angle (10
(within 30 degrees).

以上のようなセツティングの後に、電極10゜11によ
り突起2・Niワイヤ3間に溶接電流を通電させて、突
起2・Niワイヤ3を抵抗溶接する6第4図は、端子1
(突起2)とNiワイヤ3との溶接後の状態を示し、こ
の溶接後に第5図に示すようにモールドケース5内に電
子回路4が組み込まれ、今度は電子回路4側でNiワイ
ヤ3とパッド22とが接続される。
After the above settings, a welding current is passed between the protrusion 2 and the Ni wire 3 using the electrodes 10 and 11, and the protrusion 2 and the Ni wire 3 are resistance welded.6 Figure 4 shows the terminal 1.
(Protrusion 2) and the Ni wire 3 are welded together. After this welding, the electronic circuit 4 is built into the mold case 5 as shown in FIG. The pad 22 is connected.

しかして本実施例によれば、上部電極1oに形成した溝
部A、Bにより、端子1(突起2)とNiワイヤ3との
相対位置関係を精度良く決定できる。ここで、溝部A、
Bの交差する角度を任意に設定すれば、Niワイヤ3と
端子1との交差角を任意に設定できる。
According to this embodiment, the relative positional relationship between the terminal 1 (protrusion 2) and the Ni wire 3 can be determined with high precision by the grooves A and B formed in the upper electrode 1o. Here, groove part A,
By arbitrarily setting the crossing angle of B, the crossing angle of the Ni wire 3 and the terminal 1 can be set arbitrarily.

また、Niワイヤ3は傾き規制により端子1の突起2以
外の箇所に接触するのを防止されるので、溶接電流が分
流する事態が生ぜず、溶接電流の集中化を図って溶接強
度が高められる。
In addition, since the Ni wire 3 is prevented from coming into contact with any part of the terminal 1 other than the protrusion 2 due to the inclination regulation, the welding current is not divided, and the welding strength is increased by concentrating the welding current. .

以上のようにして、この種電子装置の製品品質を向上さ
せ、しかも歩留まりを高めて生産性の向上を図ることが
できる。なお、溝部A、Bよりなる交差溝23は、上部
電極10のほかに下部電極11側に設けてあっても、支
障はない。
As described above, it is possible to improve the product quality of this type of electronic device, and also to increase the yield and productivity. Note that there is no problem even if the intersecting groove 23 consisting of the grooves A and B is provided on the lower electrode 11 side in addition to the upper electrode 10.

次に第7図から第9図により本発明の第2実施例を説明
する。
Next, a second embodiment of the present invention will be described with reference to FIGS. 7 to 9.

第7図は第2実施例の溶接作業状態を示す説明図、第8
図はその上面図、第9図は溶接後の状態を示す説明図で
ある。これらの図において、既述の実施例と同一符号は
同−或いは共通する要素を示す。
FIG. 7 is an explanatory diagram showing the welding work state of the second embodiment;
The figure is a top view, and FIG. 9 is an explanatory view showing the state after welding. In these figures, the same reference numerals as in the previously described embodiments indicate the same or common elements.

まず、第9図により溶接対象たる製品例(電子装置)に
ついて説明する。
First, an example of a product (electronic device) to be welded will be described with reference to FIG.

合成樹脂のモールドケース5内には、溶接用パッド22
付きの厚膜回路基板21が組み込まれ、モールドケース
5に配設された板状端子1と溶接パッド22間をNiワ
イヤ3を介して電気的に接続する。
A welding pad 22 is placed inside the synthetic resin molded case 5.
A thick film circuit board 21 with a thick film circuit board 21 is incorporated, and the plate terminal 1 disposed in the mold case 5 and the welding pad 22 are electrically connected via the Ni wire 3.

板状端子1の突起22とNiワイヤ3とを接合する場合
には、第7図に示すように板状端子1の全表面(第8図
のように端子1の表面1a及び突起2の表面2a)を強
制酸化させて、端子表面に数μm程度の酸化絶縁層を形
成する。
When joining the protrusion 22 of the plate terminal 1 and the Ni wire 3, the entire surface of the plate terminal 1 as shown in FIG. 7 (the surface 1a of the terminal 1 and the surface of the protrusion 2 as shown in FIG. 2a) is forcibly oxidized to form an oxide insulating layer of several micrometers on the terminal surface.

しかして、本実施例で突起2とNiワイヤ3とを交差さ
せて電極10.11によりプロジェクション溶接を行う
場合に、第7図の符号Pに示すようにN1ワイヤ3が傾
いて突起2(溶接部)の他に溶接部以外の箇所Pが接触
しても、端子1の表面に酸化絶縁層20が存在すること
で、溶接電流の分流を防止することができる。
In this embodiment, when the protrusion 2 and the Ni wire 3 are crossed and projection welding is performed using the electrode 10.11, the N1 wire 3 is tilted and the protrusion 2 (the welding Even if a part P other than the welded part comes into contact with the terminal 1, the presence of the oxide insulating layer 20 on the surface of the terminal 1 can prevent the welding current from being shunted.

また、この場合に、溶接部たる突起2の表面2aにも酸
化絶縁層20を形成した場合でも、接触部Pに比べ突起
2とNiワイヤ3との接触圧が極めて大きい(接触抵抗
が小さい)こと、及び溶接時の大電流が約1000Aな
ので、突起2・Niワイヤ3間の溶接部には、絶縁破壊
を起こして溶接電流が流れ、プロジェクション溶接が支
障なく行われる。
Further, in this case, even if the oxide insulating layer 20 is also formed on the surface 2a of the protrusion 2, which is the welding part, the contact pressure between the protrusion 2 and the Ni wire 3 is extremely large compared to the contact part P (the contact resistance is small). In addition, since the large current during welding is approximately 1000 A, dielectric breakdown occurs in the welded portion between the protrusion 2 and the Ni wire 3, and a welding current flows, allowing projection welding to be performed without any trouble.

本実施例によれば、溶接電流の分流を防止して、集中的
な溶接電流により適正な溶接を行うことができ、製品の
生産性を向上させることができる。
According to this embodiment, branching of the welding current can be prevented and proper welding can be performed using concentrated welding current, thereby improving product productivity.

なお、上記各実施例は、板状端子1とNiワイヤ3との
接合を例示したが、本発明はこれに限定するものではな
く、各種の金属板と金属線とを接続する場合にも適用可
能である。また、第2実施例のように端子1表面を強制
酸化する酸化絶縁層20に代わり絶縁膜をスパッタリン
グ、塗布等の適宜の手法を用いて形成してもよい。
In addition, although each of the above-mentioned embodiments illustrated the connection between the plate-shaped terminal 1 and the Ni wire 3, the present invention is not limited to this, and can also be applied to cases where various metal plates and metal wires are connected. It is possible. Further, instead of the oxidized insulating layer 20 that forcibly oxidizes the surface of the terminal 1 as in the second embodiment, an insulating film may be formed using an appropriate method such as sputtering or coating.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、第1の課題解決手段では
、溶接電極の一方の電極の溶接側端面にΦαくd2〈Φ
n+hの条件を満足させる交差状の位置決め溝を形成す
ることで、被溶接要素たる金属板と金属線との溶接時の
位置づれをなくして位置決め精度を向上させることがで
きる。また金属線の傾き防止を図り、溶接電流の分流を
防止するので、溶接強度を高める。その結果、製品の歩
留まり(生産性)を高めることができる。
As described above, according to the present invention, in the first problem solving means, Φα and d2<Φ
By forming intersecting positioning grooves that satisfy the condition n+h, it is possible to eliminate positional deviation during welding between the metal plate and metal wire, which are elements to be welded, and improve positioning accuracy. It also prevents the metal wire from tilting and prevents the welding current from splitting, increasing welding strength. As a result, product yield (productivity) can be increased.

第2の課題解決手段では、被溶接要素たる金属板表面に
絶縁層を形成することで、プロジェクション溶接時に金
属線が金属板に接触しても、溶接電流の分流を防止し、
上記同様に溶接強度ひいては生産性の向上を図り得る。
In the second problem-solving means, by forming an insulating layer on the surface of the metal plate that is the element to be welded, even if the metal wire comes into contact with the metal plate during projection welding, the welding current is prevented from being shunted,
Similarly to the above, welding strength and productivity can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は1本発明の第1実施例に係るプロジェクション
溶接の状態を示す説明図、第2図は、その要部を示す説
明図、第3図は、第1実施例に用いる一方の溶接電極の
構造を示す説明図、第4図は、端子、Niワイヤの溶接
後の状態を示す平面図、第5図は、上記電子装置の組立
状態を示す平面図、第6図は、プロジェクション溶接装
置の概略斜視図、第7図は、本発明の第2実施例たるプ
ロジェクション溶接を示す断面図、第8図は、第7図の
平面図、第9図は、第2実施例のプロジェクション溶接
完了後の電子装置の状態を一部断面して示す側面図であ
る。 1・・・金属板(板状端子)、2・・・突起、3・・・
金属線(Niワイヤ)、4・・・電子回路、5・・・モ
ールドケース、10.11・・・溶接電極、20・・・
絶縁層、23・・・位置決め溝(交差溝)、A、B・・
・溝部。 代理人 弁理士 高橋明夫・−:・− (他1名)″−1 第 図 ワイヤ)2 ルドケ 10.11・・・溶接電極。 第 図 第 図 第 図 め溝) 第 図 (a) (b) 第 図
FIG. 1 is an explanatory diagram showing the state of projection welding according to the first embodiment of the present invention, FIG. 2 is an explanatory diagram showing the main parts thereof, and FIG. An explanatory diagram showing the structure of the electrode, FIG. 4 is a plan view showing the terminal and Ni wire after welding, FIG. 5 is a plan view showing the assembled state of the electronic device, and FIG. 6 is projection welding. A schematic perspective view of the apparatus, FIG. 7 is a sectional view showing projection welding according to the second embodiment of the present invention, FIG. 8 is a plan view of FIG. 7, and FIG. 9 is a projection welding according to the second embodiment. FIG. 3 is a partially cross-sectional side view showing the state of the electronic device after completion. 1... Metal plate (plate-shaped terminal), 2... Protrusion, 3...
Metal wire (Ni wire), 4... Electronic circuit, 5... Mold case, 10.11... Welding electrode, 20...
Insulating layer, 23... positioning groove (cross groove), A, B...
・Groove. Agent Patent Attorney Akio Takahashi・-:・- (1 other person)''-1 Diagram wire) 2 Rudke 10.11...Welding electrode. Diagram Diagram Diagram Diagram Groove) Diagram (a) (b ) Figure

Claims (1)

【特許請求の範囲】 1、金属板と金属線とを溶接する場合に、前記金属板の
表面に突起を形成し、この突起と前記金属線とを交差接
触させ、前記金属板・金属線を対の電極により加圧挾持
して電流を流し電気抵抗溶接を行う溶接法において、 前記電極のうち前記突起及び金属線に対面する一方の電
極の溶接側端面に、溝部A、Bを交差させた位置決め溝
を形成し、このうち溝部Aは前記突起に嵌合可能な幅W
1、溝部Bは前記金属線に嵌合可能な幅W2とし、且つ
前記位置決め溝のうち溝部Bの深さd2、前記突起の高
さh及び前記金属線の直径Φlの関係を、Φl<d2<
Φl+hの条件を満足するように設定し、この一方の電
極に設けた溝部A、Bにより前記突起及び金属線を嵌合
させつつ、前記溶接電極を介して電気抵抗溶接を行うこ
とを特徴とするプロジェクション溶接法。 2、金属線と金属板とを抵抗溶接するために用いる対の
電極で、前記金属板の表面に形成した突起と前記金属線
とを交差接触させて電気抵抗溶接を行うプロジェクショ
ン溶接用電極において、前記電極のうち少なくとも一方
の電極の溶接側端面に溝部A、Bを交差させた位置決め
溝を形成し、このうち溝部Aは前記突起に嵌合可能な幅
W1、溝部Bは前記金属線に嵌合可能な幅W2とし、且
つ前記位置決め溝のうち溝部Bの深さd2、前記突起の
高さh及び前記金属線の直径Φlの関係を、Φl<d2
<Φl+hの条件を満足するように設定してなることを
特徴とするプロジェクション溶接用電極。 3、金属板と金属線とを溶接する場合に、前記金属板の
表面に突起を形成し、この突起と前記金属線とを交差接
触させ、前記金属板・金属線を溶接用の対の電極により
加圧挾持して電流を流し電気抵抗溶接を行う溶接法にお
いて、 前記金属板の表面に予め該金属板表面を覆う絶縁層を形
成し、この絶縁層により溶接時の金属線が前記金属板の
溶接部以外の所に接触した場合の溶接電流の分流を防止
することを特徴とするプロジェクション溶接法。 4、第3請求項において前記絶縁層は、前記金属板の表
面を強制酸化して形成されるプロジェクション溶接法。 5、第1請求項、第3請求項、第4請求項のいずれか1
項において、前記金属板は電子装置のモールドケース内
に配設された板状端子よりなり、前記金属線はNi(ニ
ッケル)ワイヤよりなり、前記抵抗溶接を行う場合には
、前記モールドケースの上下を開口させて、この開口部
から溶接用の電極を導入して行うプロジェクション溶接
法。
[Claims] 1. When welding a metal plate and a metal wire, a protrusion is formed on the surface of the metal plate, the protrusion and the metal wire are brought into cross contact, and the metal plate/metal wire is welded. In a welding method in which electric resistance welding is performed by applying a current while being held under pressure by a pair of electrodes, grooves A and B are made to intersect on the welding side end surface of one of the electrodes that faces the protrusion and the metal wire. A positioning groove is formed, of which groove A has a width W that can fit into the protrusion.
1. The groove B has a width W2 that can fit the metal wire, and the relationship among the depth d2 of the groove B of the positioning groove, the height h of the protrusion, and the diameter Φl of the metal wire is Φl<d2. <
The method is characterized in that electric resistance welding is performed through the welding electrode while the protrusion and the metal wire are fitted into the grooves A and B provided in one of the electrodes, with the condition set to satisfy the condition Φl+h. Projection welding method. 2. A projection welding electrode that is a pair of electrodes used for resistance welding a metal wire and a metal plate, and performs electric resistance welding by bringing protrusions formed on the surface of the metal plate into cross contact with the metal wire, A positioning groove in which grooves A and B intersect is formed in the welding side end surface of at least one of the electrodes, of which groove A has a width W1 that can fit into the protrusion, and groove B has a width that can fit into the metal wire. and the relationship among the depth d2 of the groove B of the positioning groove, the height h of the protrusion, and the diameter Φl of the metal wire is Φl<d2.
An electrode for projection welding, characterized in that it is set to satisfy the condition of <Φl+h. 3. When welding a metal plate and a metal wire, a protrusion is formed on the surface of the metal plate, the protrusion and the metal wire are brought into cross contact, and the metal plate/metal wire is connected to a pair of electrodes for welding. In a welding method in which electrical resistance welding is performed by applying an electric current while clamping the metal plate under pressure, an insulating layer is formed on the surface of the metal plate in advance to cover the surface of the metal plate, and this insulating layer allows the metal wire during welding to adhere to the metal plate. A projection welding method characterized by preventing the welding current from being shunted when it comes into contact with a part other than the welded part. 4. A projection welding method according to claim 3, wherein the insulating layer is formed by forcibly oxidizing the surface of the metal plate. 5. Any one of the first claim, the third claim, and the fourth claim
In paragraph 1, the metal plate is a plate-shaped terminal disposed inside a molded case of an electronic device, the metal wire is made of Ni (nickel) wire, and when the resistance welding is performed, the upper and lower parts of the molded case are A projection welding method in which the welding electrode is introduced through an opening in the opening.
JP2157024A 1990-06-15 1990-06-15 Projection welding method and its electrode Pending JPH0452081A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2157024A JPH0452081A (en) 1990-06-15 1990-06-15 Projection welding method and its electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2157024A JPH0452081A (en) 1990-06-15 1990-06-15 Projection welding method and its electrode

Publications (1)

Publication Number Publication Date
JPH0452081A true JPH0452081A (en) 1992-02-20

Family

ID=15640520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2157024A Pending JPH0452081A (en) 1990-06-15 1990-06-15 Projection welding method and its electrode

Country Status (1)

Country Link
JP (1) JPH0452081A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012192472A (en) * 2011-03-15 2012-10-11 Koriyama Chip Industry Corp Wire-coupled nail
CN106132623A (en) * 2014-04-17 2016-11-16 日本精工株式会社 Welder and method for resistance welding and for protruding the shape of the projection of welding

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012192472A (en) * 2011-03-15 2012-10-11 Koriyama Chip Industry Corp Wire-coupled nail
CN106132623A (en) * 2014-04-17 2016-11-16 日本精工株式会社 Welder and method for resistance welding and for protruding the shape of the projection of welding
JP6065157B2 (en) * 2014-04-17 2017-01-25 日本精工株式会社 Resistance welding apparatus, resistance welding method, and projection shape for projection welding
JPWO2015159907A1 (en) * 2014-04-17 2017-04-13 日本精工株式会社 Resistance welding apparatus, resistance welding method, and projection shape for projection welding
EP3132881A4 (en) * 2014-04-17 2018-01-10 NSK Ltd. Resistance welding device, resistance welding method, and protrusion shape for projection welding
US9937582B2 (en) 2014-04-17 2018-04-10 Nsk Ltd. Resistance welding device and resistance welding method
CN106132623B (en) * 2014-04-17 2018-11-16 日本精工株式会社 The shape of welder and resistance welding method and the protrusion for protruding welding

Similar Documents

Publication Publication Date Title
MX2011002395A (en) Apparatus and method for consolidation welding.
JPH05121139A (en) Connecting method for flat conductor
US5593604A (en) Method of resistance welding thin elements
JPH11333569A (en) Method and device for series spot welding
JPH0452081A (en) Projection welding method and its electrode
EP0893945B1 (en) Printed board and manufacturing method therefor
JP3454055B2 (en) Connection structure and connection method of insulated wire
CN117062687A (en) Laser welding a metal foil stack to a metal substrate
JPH115182A (en) Material and structure of laser welding
JP2002336968A (en) Resistance welding machine, and welding method for covered conductor using the welding machine
JP2973389B2 (en) Method and apparatus for switching crimping wide of joint thermocompression bonding machine
JPH0757790A (en) Structure for connecting terminal to wire
JP2001068171A (en) Circuit conductor jointing structure of junction block
JP3417835B2 (en) Laser welding method for busbar
JP3313062B2 (en) Busbar structure of electrical junction box
JPS60210383A (en) Joining method of fine wire
JP2000152465A (en) Wire connecting structure
JPH0225287A (en) Cold press welding method
JPS63317265A (en) Part welding method for sandwich damping steel plate
JP3325204B2 (en) Laser welding structure of bus bar
JP2816090B2 (en) How to join wires
JP3352956B2 (en) Busbar welded structure
JPH0722149A (en) Method and device for connecting electric wire
JP2973388B2 (en) Method and apparatus for crimping electric wire in joint thermocompression bonding machine
JPH10118772A (en) Electrode for welding parallel gap