JPH0451166U - - Google Patents

Info

Publication number
JPH0451166U
JPH0451166U JP9211890U JP9211890U JPH0451166U JP H0451166 U JPH0451166 U JP H0451166U JP 9211890 U JP9211890 U JP 9211890U JP 9211890 U JP9211890 U JP 9211890U JP H0451166 U JPH0451166 U JP H0451166U
Authority
JP
Japan
Prior art keywords
hole
wiring board
peripheral wall
conductor layers
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9211890U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9211890U priority Critical patent/JPH0451166U/ja
Publication of JPH0451166U publication Critical patent/JPH0451166U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP9211890U 1990-08-31 1990-08-31 Pending JPH0451166U (US06878557-20050412-C00065.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9211890U JPH0451166U (US06878557-20050412-C00065.png) 1990-08-31 1990-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9211890U JPH0451166U (US06878557-20050412-C00065.png) 1990-08-31 1990-08-31

Publications (1)

Publication Number Publication Date
JPH0451166U true JPH0451166U (US06878557-20050412-C00065.png) 1992-04-30

Family

ID=31828335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9211890U Pending JPH0451166U (US06878557-20050412-C00065.png) 1990-08-31 1990-08-31

Country Status (1)

Country Link
JP (1) JPH0451166U (US06878557-20050412-C00065.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005431A (ja) * 2005-06-22 2007-01-11 Shinko Electric Ind Co Ltd コンデンサ埋め込み基板およびその製造方法
JP2021180316A (ja) * 2017-05-12 2021-11-18 大日本印刷株式会社 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005431A (ja) * 2005-06-22 2007-01-11 Shinko Electric Ind Co Ltd コンデンサ埋め込み基板およびその製造方法
JP2021180316A (ja) * 2017-05-12 2021-11-18 大日本印刷株式会社 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法

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