JPH0451150U - - Google Patents
Info
- Publication number
- JPH0451150U JPH0451150U JP9335690U JP9335690U JPH0451150U JP H0451150 U JPH0451150 U JP H0451150U JP 9335690 U JP9335690 U JP 9335690U JP 9335690 U JP9335690 U JP 9335690U JP H0451150 U JPH0451150 U JP H0451150U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- lead
- punch
- roller
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9335690U JPH0451150U (es) | 1990-09-03 | 1990-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9335690U JPH0451150U (es) | 1990-09-03 | 1990-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451150U true JPH0451150U (es) | 1992-04-30 |
Family
ID=31830499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9335690U Pending JPH0451150U (es) | 1990-09-03 | 1990-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451150U (es) |
-
1990
- 1990-09-03 JP JP9335690U patent/JPH0451150U/ja active Pending