JPH0450311U - - Google Patents
Info
- Publication number
- JPH0450311U JPH0450311U JP9205390U JP9205390U JPH0450311U JP H0450311 U JPH0450311 U JP H0450311U JP 9205390 U JP9205390 U JP 9205390U JP 9205390 U JP9205390 U JP 9205390U JP H0450311 U JPH0450311 U JP H0450311U
- Authority
- JP
- Japan
- Prior art keywords
- frame material
- base material
- conductive sheet
- heating element
- equalizing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims 1
- 238000002791 soaking Methods 0.000 description 1
Landscapes
- Central Heating Systems (AREA)
Description
第１図及び第２図は、本考案の床暖房パネルの
一実施例であり、第１図は床暖房パネルの全体断
面図、第２図は床暖房パネルの要部断面図である
。第３図は従来例の床暖房パネルの全体断面図で
ある。
１……基材、２……額縁材、３……発熱体、４
……均熱板、５……化粧板、６……熱伝導シート
。
1 and 2 show one embodiment of the floor heating panel of the present invention, FIG. 1 is an overall sectional view of the floor heating panel, and FIG. 2 is a sectional view of the main part of the floor heating panel. FIG. 3 is an overall sectional view of a conventional floor heating panel. 1... Base material, 2... Frame material, 3... Heating element, 4
... Soaking board, 5... Decorative board, 6... Heat conductive sheet.
Claims (1)
材の上面の内方に発熱体を配し、該発熱体の上面
に均熱板を敷設し、額縁材の上面に基材と略同一
平面形状の化粧板を積層して成る床暖房パネルに
おいて、前記額縁材と化粧板との間に熱伝導シー
トを設けると共に、該熱伝導シートと前記均熱板
とを接続して成る床暖房パネル。 A frame material is provided on the periphery of the upper surface of the base material, a heating element is placed inside the upper surface of the base material, a heat equalizing plate is laid on the upper surface of the heating element, and a frame material approximately the same as the base material is placed on the upper surface of the frame material. A floor heating panel formed by laminating planar decorative boards, in which a heat conductive sheet is provided between the frame material and the decorative board, and the heat conductive sheet and the heat equalizing plate are connected. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9205390U JPH0450311U (en) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9205390U JPH0450311U (en) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0450311U true JPH0450311U (en) | 1992-04-28 |
Family
ID=31828226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9205390U Pending JPH0450311U (en) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0450311U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993004490A1 (en) * | 1991-08-26 | 1993-03-04 | Nippon Tungsten Co., Ltd. | Heating apparatus using ptc thermistor |
-
1990
- 1990-08-31 JP JP9205390U patent/JPH0450311U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993004490A1 (en) * | 1991-08-26 | 1993-03-04 | Nippon Tungsten Co., Ltd. | Heating apparatus using ptc thermistor |