JPH04502546A - Conductor winding device for large rotating electric machines - Google Patents

Conductor winding device for large rotating electric machines

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Publication number
JPH04502546A
JPH04502546A JP1507455A JP50745589A JPH04502546A JP H04502546 A JPH04502546 A JP H04502546A JP 1507455 A JP1507455 A JP 1507455A JP 50745589 A JP50745589 A JP 50745589A JP H04502546 A JPH04502546 A JP H04502546A
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Prior art keywords
semiconductor layer
layer
conductor
slot
filler
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JPH0744798B2 (en
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ウイツヒマン、アルノルト
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シーメンス アクチエンゲゼルシヤフト
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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/32Windings characterised by the shape, form or construction of the insulation
    • H02K3/40Windings characterised by the shape, form or construction of the insulation for high voltage, e.g. affording protection against corona discharges
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/46Fastening of windings on the stator or rotor structure
    • H02K3/48Fastening of windings on the stator or rotor structure in slots

Abstract

(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 大形回転電機のための導体巻線装置 この発明は、約20MVA特に約50MVA以上の電気入力又は出力を有する大 形回転電機特にタービン発電機のための導体巻線装置に関し、この導体巻線は部 分的にスロット中に挿入された巻線バーから成る。[Detailed description of the invention] Conductor winding device for large rotating electric machines The present invention provides a large Regarding a conductor winding device for a rotating electrical machine, especially a turbine generator, this conductor winding is It consists of a wire-wound bar that is partially inserted into a slot.

通常の巻線バーの構造の詳細な説明は例えばドイツ連邦共和国特許第31028 49号明細書に記載されている。それによれば巻線バーは導電性の一般には銅の 一つ又は複数の棒及び棒を囲む絶縁層から成り、これらの棒は全体として又は部 分的に冷却媒体を導(ために中空とすることができる。この絶縁層は一般に導体 装置が例えば雲母のような強固な絶縁材料を含み含浸可能なテープにより巻かれ ることにより製造され、テープ層は例えば合成樹脂のような液状の硬化可能な充 填剤を含浸され、最後に充填剤が硬化される。含浸された絶縁材料は硬化前には 全く形状安定性を有しないので、硬化は巻線バーを入れられたプレス金型の中で 行われる。A detailed description of the structure of a typical wire-wound bar can be found, for example, in German Patent No. 31 028 It is described in the specification of No. 49. According to this, the wire-wound bar is made of conductive material, generally copper. Consisting of one or more rods and an insulating layer surrounding the rods, the rods may be used in whole or in part. It can be hollow to partially conduct the cooling medium. This insulating layer is generally a conductor. The device is wrapped with an impregnable tape containing a strong insulating material, such as mica. The tape layer is made of a liquid hardenable filler such as synthetic resin. The filler is impregnated and finally the filler is cured. The impregnated insulation material is Since it has no shape stability, hardening is done in a press mold containing a wire-wound bar. It will be done.

大形回転電機のための導体巻線装置の組立は従来技術によれば、巻線バーが支持 体に加工されたスロット中に挿入され、そしてスロットが適当な装置により閉鎖 され、個々の巻線バーが導体巻線を形成するために電気的に相互に接続されるよ うに行われる。According to the prior art, when assembling a conductor winding device for a large rotating electric machine, the winding bar is supported. inserted into a slot machined in the body, and the slot is closed by a suitable device and the individual winding bars are electrically connected together to form a conductor winding. It is done in a sea urchin.

大形回転電機の駆動の際に巻線バーは大きい力にさらされる。静止した巻線バー の場合にはまず第1に磁力が問題となり、回転する巻線バーの場合には遠心力の 追加が重要である。スロット中に巻線バーを固定するための方法は例えばドイツ 連邦共和国特許出願公開筒3[116996号公報に記載されている6巻線バー を遊びなくスロット中に固定するために、十分に負荷能力のあるスロット閉鎖装 置のほかにばね弾性要素がスロット中に組み込まれる。When driving a large rotating electrical machine, the winding bar is exposed to large forces. stationary winding bar In this case, the first problem is magnetic force, and in the case of a rotating wire-wound bar, the problem is centrifugal force. Additions are important. The method for fixing the winding bar in the slot is for example German 6-winding bar described in Federal Republic of Patent Application Publication No. 3 [116996] Slot closure with sufficient load capacity to secure the device in the slot without play. In addition to the position, a spring elastic element is incorporated into the slot.

大形回転電機のための巻線バーの絶縁の特に経済的な製造方法として、類似の形 で既に小形変圧器などの製造のために知られているいわゆる全含浸法が近年開発 された。全含浸法の工程ではまず事前に充填剤を含浸せずに導体巻線を備えた支 持体が完全に組み立てられ、特に巻線バーは含浸されていない絶縁材料外被によ り囲まれ、続いて全体として含浸される。巻線バーは組み込み完了状態で初めて 充填剤含浸を受けるので、組み込み前の含浸工程における形に忠実な絶縁層の高 額な製作費が不要である。Similar shapes as a particularly economical manufacturing method of winding bar insulation for large rotating electrical machines The so-called total impregnation method, already known for the production of small transformers etc., has been developed in recent years. It was done. In the full impregnation process, the support with conductor windings is first prepared without prior impregnation with filler. The carrier is fully assembled, especially the winding bar with an unimpregnated insulating material jacket. surrounded and then impregnated as a whole. The winding bar is installed only after it has been assembled. Since it undergoes filler impregnation, the height of the insulating layer true to shape during the impregnation process before assembly is No large production costs are required.

全含浸法はそれに伴う費用が少なくない(特に含浸しようとする装置のための含 浸槽を収容する数メートルの寸法を有する容器が必要である)が、多くの長所を 有する。即ち充填剤が十分に流動性でさえあれば、充填剤は含浸の際に装置中に 残っているすべての間隙を充填し、従って硬化が行われた後に単一の緻密な固体 を形成することができる。それにより優れた電気的特性特に絶縁体の高い品質が 保証される。更に硬化された充填剤はスロット中での巻線バーの固定のために寄 与するので、スロット閉鎖装置に対する要求を場合によってはかなり低減するこ とができる。また場合によってはスロット中の巻線バーの位置を固定する補助的 なばね要素を省略できるので、電気出力容量に対する要求が与えられた場合に従 来の機械に比べて小型にすることが可能である。The total impregnation method has considerable costs associated with it (especially the impregnating equipment for the equipment to be impregnated). (requires a container with dimensions of several meters to accommodate the soaking bath), but it has many advantages. have That is, if the filler is sufficiently fluid, it will not flow into the equipment during impregnation. Fills all remaining gaps and thus forms a single dense solid after curing has taken place can be formed. This results in excellent electrical properties, especially high quality insulation. Guaranteed. Furthermore, the hardened filler is used to secure the winding bar in the slot. therefore, the demands on the slot closing device can be reduced considerably, in some cases. I can do it. In some cases, it may also be used as an auxiliary device to fix the position of the winding bar in the slot. As the spring element can be omitted, the requirement for electrical output capacity can be It is possible to make the machine smaller than conventional machines.

導体巻線装置の含浸のために通常は、装置の運転温度より明らかに高い温度で硬 化する充填剤特に合成樹脂が用いられる。運転温度は特に水冷式大形回転電機の 場合に100”C前後の範囲にあるので、一般に硬化温度が約100”Cないし 約200@C望ましくは約150’C前後の範囲にある充填剤が用いられる。For impregnation of conductor winding equipment, hardening is normally performed at temperatures significantly higher than the operating temperature of the equipment. fillers, especially synthetic resins, are used. The operating temperature is particularly high for water-cooled large rotating electric machines. Generally, the curing temperature is around 100"C or around 100"C. Fillers in the range of about 200°C, preferably around 150'C, are used.

硬化のために含浸された装置を硬化温度に相当するか又は僅かにそれより高い温 度に加熱すべきである。一般的に約150°Cの温度への加熱は事情によっては 支持体の熱に基づく顕著な形状変化を招くおそれがあり、このことは特に含浸の 硬化完了後の冷却の際に問題となるおそれがある。冷却の際には成る程度の収縮 が起こり支持体中に引張応力が発生する。この引張応力は硬化された充填剤の脆 性に応じて間隙発生を招くおそれがある。一方ではこの種の間隙により強度が著 しく損なわれるおそれがあり、他方では間隙中に運転の際にグロー放電が発生す るおそれがある。グロー放電は絶縁物の品質を損なうばかりでなく時間の経過と 共に絶縁層の損傷を招くおそれがある。For curing, the impregnated equipment is heated to a temperature corresponding to or slightly above the curing temperature. It should be heated to a certain degree. Generally, heating to a temperature of about 150°C depends on the circumstances. This can lead to significant heat-induced changes in the shape of the support, which is especially true during impregnation. This may cause problems during cooling after curing is complete. Some degree of shrinkage occurs during cooling. occurs and tensile stress is generated in the support. This tensile stress is due to the brittleness of the hardened filler. Depending on the nature of the product, there is a risk of creating gaps. On the one hand, this type of gap significantly increases the strength. On the other hand, glow discharges may occur during operation during the gap. There is a risk of Glow discharge not only impairs the quality of the insulation but also deteriorates over time. Both may cause damage to the insulating layer.

従ってこの発明の課題は、コントロールできないような亀裂の形成が防止され、 それによりグロー放電の発生がそれに由来する損傷と共に防止されるような導体 巻線装置を提供することにある。Therefore, it is an object of the invention to prevent uncontrolled crack formation, conductors such that the occurrence of glow discharges together with the damage resulting therefrom is prevented; An object of the present invention is to provide a winding device.

この課題は、導体巻線を備える支持体から成り、その際導体巻線が部分的にスロ ット中に挿入された導体バーから成り、各導体バーが絶縁層により囲まれた導体 装置を有するような、大形回転電機のための充填剤を含浸可能な導体巻線装置に おいて、この発明に基づき、各巻線バーが第1の半導体層により覆われ、各巻線 バーと各スロット壁との間には、第1の半導体層と電気的に接続された少なくと も一つの第2の半導体層及び分離層が設けられ、その際分離層により第1の半導 体層と少なくとも一つの第2の半導体層との間の充填剤に基づ(付着が低減され ることにより解決される。This task consists of a support with conductor windings, where the conductor windings are partially slotted. A conductor consisting of conductor bars inserted into a conductor, each conductor bar being surrounded by an insulating layer. Conductor winding equipment that can be impregnated with filler for large rotating electric machines, such as those that have According to the invention, each winding bar is covered with a first semiconductor layer, and each winding bar is covered with a first semiconductor layer. Between the bar and each slot wall there is at least one layer electrically connected to the first semiconductor layer. a second semiconductor layer and a separation layer, wherein the separation layer separates the first semiconductor layer from the first semiconductor layer; Based on the filler between the body layer and the at least one second semiconductor layer (adhesion is reduced) This is solved by

この発明によれば、硬化された充填剤中の熱膨張及び収縮過程に起因する亀裂形 成があらかじめ定められた領域中に集中させられ、その際この領域ではグロー放 電を誘発する過度な電界強度が生じるおそれがないということが保証される。According to the invention, crack formation due to thermal expansion and contraction processes in the cured filler The glow is concentrated in a predetermined area, and the glow is emitted in this area. It is ensured that there is no risk of excessive electric field strengths inducing electricity.

この領域は巻線バーを収容する支持体のスロット中で硬化された充填剤が分離層 と接触する領域により与えられる。充填剤は分離層と全く又は僅かしか付着しな いので、材料の損傷を起こすことなく各接触個所に間隙が発生できる。充填剤と 分離層との接触域が電気的に相互に接続された二つの半導電性層の間に存在する ので、接触域はほぼ一定の電位が存在する領域である。従ってグロー放電はそこ では発生せず、その結果接触域における亀裂による充填剤の絶縁品質の低下がほ ぼ防止される。スロット中への分離層の導入によりその強度に関してスロット中 の他の領域より劣る領域が生じるが、しかし推定上のこの弱点は特に考慮するJ 必要はなく従ってこの発明の対象ではない。なぜならばスロット中に巻線バーを 固定するためのすべての公知の手段が利用できるからである。装置の長い寿命の ために必要な優れた機械的特性は当業者によ(知られた手段により達成すること ができる。This area is a separated layer of hardened filler in the slot of the support that houses the winding bar. given by the area in contact with. The filler has no or only slight adhesion to the separating layer. This allows gaps to be created at each point of contact without causing damage to the material. filler and A contact area with the separation layer exists between two semiconducting layers that are electrically interconnected Therefore, the contact area is an area where a nearly constant potential exists. Therefore, the glow discharge As a result, the insulating quality of the filler is reduced by cracking in the contact area. It is prevented from collapsing. The introduction of a separation layer into the slot improves its strength. However, this putative weakness should be especially taken into account by J This is not necessary and is therefore not the subject of this invention. This is because the winding bar is inserted into the slot. All known means for fixing are available. long lifespan of equipment The excellent mechanical properties necessary for Can be done.

分離層の主な構成部分は充填剤に濡れない分離剤である。この種の分離剤として は充填剤として合成樹脂が用いられる場合に、例えば油状又はグリース状の物質 、ポリテトラフルオロエチレン、シリコーンコンパウンドなどが考えられる。The main component of the separation layer is a separation agent that does not wet the filler. As this kind of separation agent When synthetic resins are used as fillers, e.g. oily or grease-like substances Possible materials include , polytetrafluoroethylene, and silicone compounds.

この種の分離剤を適当な支持体上に塗布する、例えば布に分離剤を含浸するか又 はフィルムに構成部分として分離剤を添加するのが有利である。更に場合によっ ては適当な添加物により半導電性にしたポリテトラフルオロエチレンなどのよう な濡れない物質から成るフィルムを使用することもできる。This type of separating agent is applied to a suitable support, for example by impregnating a cloth with the separating agent or Advantageously, the separating agent is added as a component to the film. Furthermore, depending on the case For example, polytetrafluoroethylene made semiconductive with appropriate additives. It is also possible to use films made of non-wettable materials.

この発明の有利な構成では、特に試験済みの工程においてこの発明に基づ(装置 の製造を可能にするために、巻線バーの第1の半導体層が、半導電性布特に導電 性顔料を添加したプラスチックから成る織物又は不織布から成り絶縁層上に巻き 付けられたテープにより形成される。従って半導体層の材料は一般に絶縁材料を 含むテープを用いた巻き付は層により生じる絶縁層の材料に似ており、半導体層 の材料の加工は絶縁層の被覆と同じ方法で行うことができる。それにより合理的 な加工が可能である。少な(とも一つの第2の半導体層を半導電性布又はフィル ムから成り巻線バー上に巻かれたテープとして構成することも同一の目的に役立 つ。In an advantageous embodiment of the invention, an apparatus according to the invention is provided in a particularly tested process. In order to enable the production of It consists of a woven or non-woven fabric made of plastic with added pigments and is wrapped on an insulating layer. formed by the attached tape. Therefore, the material of the semiconductor layer is generally an insulating material. Wrapping with tape containing layers is similar to the material of the insulating layer caused by the layer and the material of the semiconductor layer The processing of the material can be carried out in the same way as the coating of the insulating layer. That makes it more reasonable processing is possible. One second semiconductor layer is coated with a semiconductive cloth or film. It also serves the same purpose. Two.

この発明の有利な構成では、含浸の際に充填剤に基づく第1の半導体層と少なく とも一つの第2の半導体層との付着が分離層のために完全には妨げられず、でき る限り広い面積に分散して半導体層の間に接触個所が残っている。これらの接触 個所では半導体層は相互に電気的に接続することができ、接触を確保する装置は そのほかに必要でない。また分離層を貫く第1の半導体層と少なくとも一つの第 2の半導体層との電気的接続は、分離層と充填剤との接触域での最善の電位均一 化を保証する。なぜならば層の電気的接続を最適に短く保つことができ、比較的 大きいループを介する必要がないからである。In an advantageous embodiment of the invention, during the impregnation the first semiconductor layer based on filler and at least The adhesion with one of the second semiconductor layers is not completely hindered by the separation layer and is not possible. Contact points remain between the semiconductor layers, distributed over as wide an area as possible. these contacts In places, the semiconductor layers can be electrically connected to each other, and the devices that ensure the contact are Nothing else is necessary. Further, a first semiconductor layer penetrating the separation layer and at least one first semiconductor layer are provided. The electrical connection with the semiconductor layer 2 is achieved by achieving the best potential uniformity in the contact area between the separation layer and the filler. ensure that Because the electrical connections of the layers can be kept optimally short and relatively This is because there is no need to go through a large loop.

半導体層相互の完全には中断されない付着は、分離層と充填剤との接触域の強度 が成る程度残ることも保証する。この強度は装置の安定性を全体として補助し、 特に運転時に非常に高い負荷を受ける装置の場合には望ましい。The completely uninterrupted adhesion of the semiconductor layers to each other is determined by the strength of the contact zone between the separating layer and the filler. We also guarantee that it will remain as long as possible. This strength aids in the overall stability of the device and This is particularly desirable in the case of equipment that is subject to very high loads during operation.

場合によってはそれ自体半導電性である分離層を用いることもできる。半導電性 分離層として特に半導電性顔料を含む分離剤を用いるか、又は分離剤を含浸した 半導電性布又は半導電性フィルムを用いることができる。Optionally, it is also possible to use separating layers that are themselves semiconducting. semiconducting A separating agent containing a semiconductive pigment is used as a separating layer, or a separating agent is impregnated with a separating agent. A semi-conductive cloth or a semi-conductive film can be used.

この発明の別の有利な構成は、分離層を半導体層のうちの一つの材料と統合する 、特に分離層を半導体層の被膜として分離剤により構成することにある。こうし て導体巻線装置への分離層の導入が相応の半導体層と同時に行われ、導体巻線装 置の製造過程が実質的に簡単化される。この発明の有利な実施態様では各巻線バ ーが第1の半導体層上に被覆されたテープの形の分離層を有し、その際テープが 充填剤に濡れない分離剤を含む。分離層を形成するテープを第1の半導体層上に 巻き付けるのが特に有利である。それにより巻線バーへの分離層の導入は通常の 方法の枠内で可能である。Another advantageous embodiment of the invention integrates the separation layer with the material of one of the semiconductor layers. In particular, the separation layer is formed of a separation agent as a coating on the semiconductor layer. instructor The introduction of a separation layer into the conductor winding device is carried out at the same time as the corresponding semiconductor layer, and the conductor winding device The manufacturing process of the device is substantially simplified. In an advantageous embodiment of the invention, each winding bar has a separation layer in the form of a tape coated on the first semiconductor layer, the tape being Contains a separating agent that does not wet the filler. A tape forming a separation layer is placed on the first semiconductor layer. Wrapping is particularly advantageous. Thereby the introduction of a separation layer into the winding bar is It is possible within the framework of the method.

第1の半導体層と少なくとも一つの第2の半導体層との特別に良好な電気的接続 は、導電性棒の形の少なくとも一つの接触導体の組み込みにより達成され、この 接触導体は第1の半導体層とばかりでな(少なくとも一つの第2の半導体層とも 電気的に接続するように、分離層と共に第1の半導体層上に取り付けられる。A particularly good electrical connection between the first semiconductor layer and at least one second semiconductor layer is achieved by the incorporation of at least one contact conductor in the form of a conductive rod, this The contact conductor is not only connected to the first semiconductor layer (but also to at least one second semiconductor layer). A separation layer is mounted on the first semiconductor layer for electrical connection.

その際テープが第1の半導体層の周囲への巻き付けの際に交互に接触導体の上及 び下へ導かれるように、少な(とも一つの接触導体を分離層形成テープと共に巻 線バーの第1の半導体層上に固定するのが特に有利である。この構成によっても 大きいループを回避する第1の半導体層と少なくとも一つの第2の半導体層との 電気的接続が可能となる。それにより各半導体層間の分離層と充填剤との接触域 での電位の不変性が特に保証され、この発明の目的に特に叶う装置が得られる。In this case, the tape alternately wraps around the contact conductor as it wraps around the first semiconductor layer. Wrap at least one contact conductor with separating layer-forming tape so that it is guided downward. It is particularly advantageous to fix the line bar on the first semiconductor layer. Even with this configuration A combination of a first semiconductor layer and at least one second semiconductor layer that avoids large loops. Electrical connection is possible. Thereby the contact area between the separation layer and the filler between each semiconductor layer The constancy of the potential at is particularly guaranteed, resulting in a device which particularly meets the objectives of the invention.

この発明の別の有利な構成によれば、少なくとも一つの第2の半導体層が、半導 電性材料から成り少な(とも一つのスロット壁を覆う内張りにより与えられる。According to another advantageous embodiment of the invention, the at least one second semiconductor layer is a semiconductor layer. Provided by a lining made of electrically conductive material (both covering one slot wall).

この構成の枠内では各巻線バーに固有の第2の半導体層を設けることは必要でな い。巻線バー当たりの明らかに少ない所要空間が結果として得られるので。Within the framework of this configuration, it is not necessary to provide each winding bar with its own second semiconductor layer. stomach. As clearly less space required per winding bar results.

導体巻線装置を所定の負荷容量に対して特にコンパクトに構成するか、又は別の 観点から例えば大形回転電機の巻線装置に与えられた機能に関して最適化するこ とが可能である。スロットの内張りに対しては既に述べた半導電性布が好適であ る。このような構成の有利な実施態様ではスロット内張りは、例えば被膜の形で 又は既に述べたスロット内張り上に半導電性布をかぶせた別の内張りの形で分離 層を設けることができる。その際すべてのスロット壁のスロット内張りに分離層 を設けることは必ずしも必要でない。この発明に基づく長所はスロット内張りが 分離層を備えた唯一のスロット壁に設けられるときに既に発揮される。それによ り導体巻線装置と分離層を有しないスロット壁との強固な付着が、装置の強度向 上のために補助的に寄与する。The conductor winding arrangement must be constructed particularly compactly for a given load capacity, or alternatively From this point of view, for example, it is possible to optimize the functions given to the winding device of a large rotating electric machine. is possible. The semiconductive cloth mentioned above is suitable for lining the slot. Ru. In an advantageous embodiment of such an arrangement, the slot lining is, for example, in the form of a coating. or separate in the form of a separate lining with a semi-conductive cloth over the slot lining already mentioned. layers can be provided. A separating layer is added to the slot lining on all slot walls. It is not necessarily necessary to provide. The advantage of this invention is that the slot lining It is already exhibited when only one slot wall with a separating layer is provided. That's it The strong adhesion between the conductor winding device and the slot wall without separation layer increases the strength of the device. contribute auxiliary to the above.

この発明は、充填剤特に硬化される合成樹脂を含浸された大形回転電機のための 導体巻線装置を、部分的に支持体のスロット中に挿入された巻線バーから成る導 体巻線を備えた支持体の形で提供し、その際支持体の各スロットが電気的に遮蔽 された少なくとも一つの領域を有し、この領域の強度はスロット中の他の領域に 比べて減少している。例えば熱的膨張及び収縮過程により起こる充填剤の亀裂は 強度の小さい前記領域中に生じやすい。この領域ではほとんど電位勾配が生じな いので、亀裂中の火花発生が実際上防止され、装置の電気的品質の低下が防止さ れる。更に亀裂形成の起こりやすい領域が良好に限定されるので、亀裂形成にも かかわらず装置の機械的強度の低下を強度を高める手段の適当な利用により回避 することができる。This invention is for large rotating electric machines impregnated with fillers, especially hardened synthetic resins. The conductor winding device consists of a conductor winding bar partially inserted into a slot in the support. provided in the form of a support with body windings, each slot of the support being electrically shielded. the strength of this region is greater than that of other regions in the slot. It has decreased compared to For example, cracks in the filler caused by thermal expansion and contraction processes It tends to occur in the region where the intensity is low. Almost no potential gradient occurs in this region. This effectively prevents sparks from forming in cracks and prevents deterioration of the electrical quality of the device. It will be done. Furthermore, since the areas where crack formation is likely to occur are well defined, crack formation is also prevented. However, the decrease in mechanical strength of the device can be avoided by appropriate use of means to increase the strength. can do.

この発明は、充填剤特に硬化性の合成樹脂による含浸後に大形回転電機の部分と して特に固定子又は回転子として特に適している導体巻線装置を提供する。なぜ ならばこの導体巻線装置は所定の負荷容量に対し特にコンパクトな形を得ると共 に優れた電気的特性を備える特別な堅固さを有するからである。This invention allows parts of large rotating electric machines to be A conductor winding device is provided which is particularly suitable as a stator or a rotor. why This conductor winding arrangement then obtains a particularly compact form for a given load capacity. This is because it has special robustness with excellent electrical properties.

この発明の詳細な説明を以下図面に示した実施例により行う。A detailed explanation of the present invention will be given below with reference to embodiments shown in the drawings.

第1図は、含浸のために準備されたこの発明に基づ(導体巻線装置の部分図を示 す。FIG. 1 shows a partial view of a conductor winding device according to the invention prepared for impregnation. vinegar.

第2図は、この発明に基づ(装置への組み込みのために特に適した巻線i<−の 一実施例を示す。FIG. 2 shows a winding i An example is shown.

第3図は、特別に有利に構成されたこの発明に基づく装置の部分図を示す。FIG. 3 shows a partial view of a particularly advantageously constructed device according to the invention.

第1図に示すように、支持体1は巻線バー3を収容するために用いられるスロッ ト2を備え、巻線バー3の挿入後に当業者に種々の構成で知られているこの発明 の対象ではない適当なスロット閉鎖装置4により閉鎖される。その際支持体1は 例えば回転子のように一体の又は二、三の要素だけから組み立てられたブロック から成るか、又は例えば固定子に対してよく用いられるように多数の個々の板5 から組み立てることができる。その際両者の混合形式も自明のように当業者によ り実施可能である。As shown in Figure 1, the support 1 has slots used to accommodate the winding bar 3. This invention is known to those skilled in the art in various configurations after insertion of the winding bar 3. It is closed by a suitable slot closing device 4 which is not subject to. At that time, the support 1 A block assembled from one piece or only a few elements, such as a rotor or a number of individual plates 5, as is often used for example for stators. It can be assembled from. In this case, it will be obvious to those skilled in the art that a mixed form of the two may also be used. This is possible.

巻線バー3は主構成部分として絶縁層7により囲まれた導体装置6を備える。The winding bar 3 has as its main component a conductor arrangement 6 surrounded by an insulating layer 7 .

導体装置6は少なくとも一つの導電性棒特に銅棒から成り、所定の運転負荷に応 じて冷却媒体などを案内する流路を有することができる。絶縁層7は一般にテー プの巻き付は層から成り、テープは例えば雲母のような絶縁材料を備え、例えば 合成樹脂のような充填剤を含浸可能である。充填剤含浸の完了後に絶縁層7はほ ぼ緻密で均一な固体となり、この固体内部にはテープの繊維組織が絶縁材料と共 に入っている。The conductor arrangement 6 consists of at least one electrically conductive bar, in particular a copper bar, which is adapted to the given operating load. It is also possible to have a flow path for guiding a cooling medium or the like. The insulating layer 7 is generally a tape. The wrapping of the tape consists of layers, the tape comprises an insulating material, e.g. mica, e.g. It can be impregnated with fillers such as synthetic resins. After completion of filler impregnation, the insulation layer 7 is It becomes a dense and uniform solid, and inside this solid, the fiber structure of the tape is combined with the insulating material. It's in.

この発明によれば巻線バー3の絶縁層7は第1の半導体層8により囲まれ、この 半導体層8上には少なくとも巻線バー3のスロット壁11に向かう側面に、装置 に含浸しようとする充填剤に全く又はほとんど濡れない材料から成る分離層9が 張り付けられている。分離層9は分離層9及び第1の半導体層8上にかぶせられ た第2の半導体層10により巻線バー3上に固定されている。According to the invention, the insulating layer 7 of the winding bar 3 is surrounded by the first semiconductor layer 8; On the semiconductor layer 8, at least on the side of the winding bar 3 facing the slot wall 11, there is provided a device. A separation layer 9 made of a material that does not or hardly wets the filler to be impregnated into the It is attached. The separation layer 9 is placed over the separation layer 9 and the first semiconductor layer 8. It is fixed onto the winding bar 3 by a second semiconductor layer 10 .

支持体1、巻線バー3及びスロット閉鎖装置4から成る巻線装置が完全に組み立 てられると、巻線装置は硬化可能な合成樹脂又は類似の充填剤により全体として 含浸され、充填剤が硬化される。硬化のために本来の充填剤には多くの場合相応 の化学薬品が添加混合され、硬化過程の誘起のために通常の合成樹脂の場合には 約150″Cの範囲の所定の温度に充填剤を加熱することが必要である。硬化が 行われた後に装置は再び冷却される。その際熱的収縮過程に基づき装置内部に特 にスロット2内部に、場合によっては亀裂形成を招くおそれのある引張応力が生 じる。The winding device consisting of the support 1, the winding bar 3 and the slot closing device 4 is fully assembled. The winding device is then entirely covered with a curable synthetic resin or similar filler. impregnated and the filler is cured. Often suitable for the original filler for curing In the case of ordinary synthetic resins, chemicals are added and mixed to induce the curing process. It is necessary to heat the filler to a predetermined temperature in the range of about 150"C. After this is done, the device is cooled down again. At that time, due to the thermal shrinkage process, special tensile stress is generated inside the slot 2 which may lead to crack formation. Jiru.

この発明の重要な要素は、支持体lの各スロット2の中で発生する亀裂を所定の 領域に集中させ、更にこの領域ではグロー放電を誘発する過度の電界強度が発生 するおそれがないように配慮することである。この領域は硬化した充填剤が分離 層9と接触するスロット2中の領域により形成される。充填剤は分離層9と全( 又は少ししか付着しないので、材料の損傷を招くことなく各接触個所に間隙が生 じ得る。分離層9は第1の半導体層8又は第2の半導体層10から成り相互に結 合された導電性の二つの層の間に囲まれているので、分離層9従って充填剤と分 離層9との間の接触域は電位の無い領域中に存在する。電界従ってグローl!j 、iiiがこの領域中で発生するおそれがないので、優れた電気的品質が保証さ れる。スロット2中への分離層9の導入によりその強度に関してスロット2中の 他の領域より劣る個所が生じるが、しかし推定上のこの弱点を考慮することは必 要でない。充填剤の含浸を受けない支持体1のスロット2中で巻線バー3を固定 するために用いることができるすべての手段が利用される。特に長い寿命をもた らす優れた機械的特性が保証される。An important element of the invention is that the cracks occurring in each slot 2 of the support l are This area generates excessive electric field strength that induces a glow discharge. care must be taken to ensure that there is no risk of this happening. This area is where the hardened filler separates. It is formed by the area in the slot 2 that is in contact with the layer 9. The filler is separated into the separation layer 9 and the total ( Or, it adheres so little that it creates gaps at each point of contact without causing damage to the material. It can be done. The separation layer 9 consists of the first semiconductor layer 8 or the second semiconductor layer 10 and is interconnected. Since the separation layer 9 is enclosed between the two combined conductive layers, the filler and the separation layer 9 The contact area with the delamination 9 is in a potential-free area. The electric field therefore glows! j , iii can occur in this area, ensuring excellent electrical quality. It will be done. The introduction of the separating layer 9 into the slot 2 improves the strength of the slot 2 with respect to its strength. Some areas will be weaker than others, but it is necessary to take this putative weakness into account. Not necessary. Fixing the winding bar 3 in the slot 2 of the support 1 which is not subject to impregnation with filler All available means will be used to do so. has a particularly long lifespan Excellent mechanical properties are guaranteed.

第2図は、この発明で用いることができるような巻線バー3の特別な構造を示す 、この実施例の特徴は、巻線バー3の絶縁層7上の第1の半導体層8の周囲に巻 き付けられた分離層9がテープの形をとることである。FIG. 2 shows a special construction of the winding bar 3 as can be used in the invention. The feature of this embodiment is that the wire is wound around the first semiconductor layer 8 on the insulating layer 7 of the winding bar 3. The applied separation layer 9 is in the form of a tape.

第1の半導体層8と第2の半導体層10との間の導電接続は、第1図に示す実施 例では第1の半導体層8と第2の半導体層10とが相互に部分的に接触すること により保証されたが、第2図に示す巻線バー3の場合にはこれは導電性材料特に 銅から成る補助の接触導体13によりもたらされ、接触導体13は分離層9上に 巻き付けられた第1の半導体層8及び第2の半導体層10に交互に接触するよう に、分離層9と共に第1の半導体層8上に設けられている。それによりこの種の 巻線バー3はその全周において、熱応力から生じる亀裂がグロー放電などに対し て守られた領域に集中することを保証する。The electrically conductive connection between the first semiconductor layer 8 and the second semiconductor layer 10 is made using the implementation shown in FIG. In the example, the first semiconductor layer 8 and the second semiconductor layer 10 are in partial contact with each other. However, in the case of the wire-wound bar 3 shown in FIG. This is provided by an auxiliary contact conductor 13 made of copper, which contact conductor 13 is placed on the separating layer 9. so as to alternately contact the wound first semiconductor layer 8 and second semiconductor layer 10. It is provided on the first semiconductor layer 8 together with the separation layer 9 . This kind of The wire-wound bar 3 has cracks caused by thermal stress on its entire circumference due to glow discharge, etc. ensure that they are focused on protected areas.

第3図は、この発明に基づく導体巻線装置の有利な構成を示す。巻線バー3は第 1の半導体層8だけを有し、巻線バー3の外側領域中に組み込まれる分離層9の 代わりに、スロット壁11が分離層9のように充填剤に濡れないスロット内張り 14を有し、それにより亀裂の形成を制限するための領域がスロット壁11の周 囲の領域へ移される。スロット内張り14の領域での電位均一化は、巻線バー3 の第1の半導体層8が支持体lと導電接続されることによりもたらされる。この ことはスロット底12がスロット内張りI4を有せず、それにより第1の半導体 層8がスロット底12を介して支持体lと電気的に接続することにより行われる のが合目的的である。スロット底12に対してスロット内張り14を省略できな い場合には、例えばスロット底12のために第2図に示したのと同様に電気的接 続を保証する接触導体13により貫かれたスロット内張り14を使用することが 考えられる。FIG. 3 shows an advantageous configuration of the conductor winding arrangement according to the invention. The winding bar 3 is of a separating layer 9 which has only one semiconductor layer 8 and is incorporated in the outer region of the winding bar 3. Instead, the slot wall 11 is a slot lining that does not wet the filler like the separation layer 9. 14, whereby an area for limiting crack formation is provided around the slot wall 11. be moved to the enclosed area. The potential equalization in the area of the slot lining 14 is achieved by the winding bar 3 This is brought about by the first semiconductor layer 8 of being electrically connected to the carrier l. this This means that the slot bottom 12 does not have a slot lining I4, so that the first semiconductor This is done by electrically connecting the layer 8 to the support l via the slot bottom 12. is purposeful. The slot lining 14 cannot be omitted for the slot bottom 12. For example, if the slot bottom 12 is the same as shown in FIG. It is possible to use a slot lining 14 pierced by a contact conductor 13 which ensures the connection. Conceivable.

各実施例では二つの巻線バー3を備えるスロット2だけを紹介した。自明のよう にこの発明は二つの巻線バー3を備える装置ばかりでなく、周知の方法で説明の ためにだけ用いられた図示の実施例から考えられるすべての装置を含む。In each embodiment only a slot 2 with two winding bars 3 was introduced. self-evident The invention not only provides a device with two winding bars 3, but also a device that can be used in a well-known manner. It includes all conceivable devices from the illustrated embodiments which are used only for this purpose.

この発明は、電気的損失の最小化及び寿命の向上を考膚して特別の方法で全含浸 の長所の利用を可能にするような、大形回転電機のための導体巻線装置を提供す る。This invention uses a special method to completely impregnate the We provide a conductor winding device for large rotating electric machines that makes it possible to take advantage of the advantages of Ru.

国際調査報告 ol、rlr+v QQlonA<G□□kPCT/DE 89 100456International search report ol, rlr+v QQlonA<G□□kPCT/DE 89 100456

Claims (1)

【特許請求の範囲】 1.導体巻線を備える支持体(1)から成り、その際導体巻線が部分的にスロッ ト(2)中に挿入された巻線バー(3)から成り、各巻線バー(3)が絶縁層( 7)により囲まれた導体装置(6)を有するような、大形回転電機のための充填 剤を含浸可能な導体巻線装置において、各巻線バー(3)が第1の半導体層(8 )により覆われ、各巻線バー(3)と各スロット壁(11)との間に、第1の半 導体層(8)と電気的に接続された少なくとも一つの第2の半導体層(10)及 び分離層(9)が設けられ、その際分離層(9)により第1の半導体層(8)と 少なくとも一つの第2の半導体層(10)との間の充填剤に基づく付着が低減さ れることを特徴とする大形回転電機のための導体巻線装置。 2.分離層(9)が充填剤による濡れを防止する分離剤を含浸された布から成る ことを特徴とする請求の範囲1記載の装置。 3.分離層(9)が充填剤による濡れを防止する分離剤を含むフィルムから成る ことを特徴とする請求の範囲1記載の装置。 4.第1の半導体層(8)が絶縁層(7)上に巻かれた半導電性布のテープによ り形成されることを特徴とする請求の範囲1ないし3の一つに記載の装置。 5.各巻線バー(3)が巻線バー(3)の周囲に巻き付けられた半導電性布のテ ープから成る少なくとも一つの第2の半導体層(10)を有することを特徴とす る請求の範囲1ないし4の一つに記載の装置。 6.第1の半導体層(8)と少なくとも一つの第2の半導体層(10)との間の 充填剤に基づく付着が分離層(9)により完全には中断されないことを特徴とす る請求の範囲1ないし5の一つに記載の装置。 7.第1の半導体層(8)が少なくとも一つの第2の半導体層(10)と分離層 (9)を貫いて電気的に接続されることを特徴とする請求の範囲6記載の装置。 8.分離層(9)が第1の半導体層(8)の材料と統合されることを特徴とする 請求の範囲1ないし7の一つに記載の装置。 9.分離層(9)が第1の半導体層(8)の材料の被膜により形成されることを 特徴とする請求の範囲8記載の装置。 10.分離層(9)が少なくとも一つの第2の半導体層(10)の材料と統合さ れることを特徴とする請求の範囲1ないし7の一つに記載の装置。 11.分離層(9)が少なくとも一つの第2の半導体層(10)の被膜により形 成されることを特徴とする請求の範囲10記載の装置。 12.各巻線バー(3)が第1の半導体層(8)上に巻き付けられたテープの形 の分離層(9)を有し、その際テープが充填剤による濡れを防止する分離剤を含 むことを特徴とする請求の範囲1ないし7の一つに記載の装置。 13.分離層(9)となるテープが第1の半導体層(8)上に巻き付けられるこ とを特徴とする請求の範囲12記載の装置。 14.第1の半導体層(8)と少なくとも一つの第2の半導体層(10)との電 気的接続が導電性棒の形の少なくとも一つの接触導体(13)により形成され、 この接触導体が第1の半導体層(8)とばかりでなく少なくとも一つの第2の半 導体層(10)とも電気的に接続されるように、接触導体が分離層(9)と共に 第1の半導体層(8)上に取り付けられていることを特徴とする請求の範囲12 又は13記載の装置。 15.少なくとも一つの第2の半導体層(10)が、少なくとも一つのスロット 壁(11)を覆い半導電性材料から成るスロット内張り(14)により形成され ることを特徴とする請求の範囲1ないし14の一つに記載の装置。 16.スロット内張り(14)が半導電性布から成ることを特徴とする請求の範 囲15記載の装置。 17.一方のスロット壁(11)だけにスロット内張り(14)が分離層(9) を備えることを特徴とする請求の範囲15又は16記載の装置。 18.充填剤特に硬化性の合成樹脂を合浸され、大形回転電機の一部として特に 固定子として又は回転子として用いられることを特徴とする請求の範囲1ないし 17の一つに記載の装置。 19.部分的に支持体(1)のスロット(2)中に挿入された巻線バー(3)か ら成る導体巻線を備える支持体(1)の形で、充填剤特に硬化性の合成樹脂を含 浸された大形回転電機用導体巻線装置であって、各スロット(2)がスロット壁 (11)にほぼ平行に置かれ電気的に遮蔽された少なくとも一つの領域を有し、 この領域の強度がスロット(2)中の他の領域に比べて低減されていることを特 徴とする請求の範囲1ないし17の一つに記載の特に充填剤を含浸された装置。[Claims] 1. It consists of a carrier (1) with conductor windings, the conductor windings being partially slotted. It consists of a winding bar (3) inserted into a winding bar (2), each winding bar (3) being covered with an insulating layer ( 7) Filling for large rotating electrical machines, such as those with conductor devices (6) surrounded by In a conductor winding device that can be impregnated with a chemical agent, each winding bar (3) is coated with a first semiconductor layer (8 ) and between each winding bar (3) and each slot wall (11) is a first half. At least one second semiconductor layer (10) electrically connected to the conductor layer (8) and and a separation layer (9), wherein the separation layer (9) separates the first semiconductor layer (8) from the first semiconductor layer (8). Filler-based adhesion between the at least one second semiconductor layer (10) is reduced. A conductor winding device for a large rotating electric machine, characterized in that: 2. The separating layer (9) consists of a cloth impregnated with a separating agent that prevents wetting by the filler. The device according to claim 1, characterized in that: 3. The separation layer (9) consists of a film containing a separation agent that prevents wetting by the filler. The device according to claim 1, characterized in that: 4. The first semiconductor layer (8) is formed by a semiconductive cloth tape wrapped on the insulating layer (7). 4. Device according to claim 1, characterized in that it is formed by a. 5. Each winding bar (3) is made of semi-conductive cloth wrapped around the winding bar (3). characterized in that it has at least one second semiconductor layer (10) consisting of a 5. A device according to one of claims 1 to 4. 6. between the first semiconductor layer (8) and at least one second semiconductor layer (10); characterized in that the adhesion based on the filler is not completely interrupted by the separating layer (9) 6. A device according to one of claims 1 to 5. 7. The first semiconductor layer (8) is connected to at least one second semiconductor layer (10) and a separation layer. 7. The device according to claim 6, wherein the device is electrically connected through (9). 8. characterized in that the separation layer (9) is integrated with the material of the first semiconductor layer (8) Device according to one of claims 1 to 7. 9. It is noted that the separation layer (9) is formed by a coating of the material of the first semiconductor layer (8). 9. The device of claim 8, characterized in that: 10. The separation layer (9) is integrated with the material of the at least one second semiconductor layer (10). 8. Device according to one of claims 1 to 7, characterized in that: 11. The separation layer (9) is formed by a coating of at least one second semiconductor layer (10). 11. The device according to claim 10, characterized in that it is made of: 12. in the form of a tape in which each winding bar (3) is wound onto the first semiconductor layer (8) of separating layer (9), the tape containing a separating agent to prevent wetting by the filler. 8. Device according to one of claims 1 to 7, characterized in that: 13. A tape serving as a separation layer (9) is wound onto the first semiconductor layer (8). 13. The device according to claim 12, characterized in that: 14. Electrical connection between the first semiconductor layer (8) and at least one second semiconductor layer (10) the electrical connection is formed by at least one contact conductor (13) in the form of an electrically conductive rod; This contact conductor is connected not only to the first semiconductor layer (8) but also to at least one second semiconductor layer (8). A contact conductor is provided with a separation layer (9) such that it is also electrically connected to the conductor layer (10). Claim 12, characterized in that it is mounted on the first semiconductor layer (8). or the device according to 13. 15. At least one second semiconductor layer (10) has at least one slot. The wall (11) is covered with a slot lining (14) made of a semi-conductive material. 15. Device according to claim 1, characterized in that: 16. Claim characterized in that the slot lining (14) consists of a semiconductive fabric. The apparatus according to Box 15. 17. Only one slot wall (11) has a slot lining (14) with a separating layer (9). 17. The device according to claim 15 or 16, comprising: 18. Fillers, especially hardening synthetic resins, are mixed, especially as part of large rotating electric machines. Claims 1 to 3 are characterized in that they are used as stators or rotors. 17. The device according to claim 17. 19. The winding bar (3) partially inserted into the slot (2) of the support (1) in the form of a support (1) with a conductor winding consisting of a filler, in particular a curable synthetic resin. A immersed conductor winding device for a large rotating electric machine, in which each slot (2) has a slot wall. (11) having at least one region placed substantially parallel to and electrically shielded; Note that the intensity of this region is reduced compared to other regions in the slot (2). 18. A device particularly impregnated with a filler according to one of claims 1 to 17, characterized in that it is characterized by:
JP1507455A 1989-07-10 1989-07-10 Conductor winding device for large rotating electric machine Expired - Lifetime JPH0744798B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE1989/000456 WO1991001059A1 (en) 1989-07-10 1989-07-10 Conductor-winding assembly for a large electrical machine

Publications (2)

Publication Number Publication Date
JPH04502546A true JPH04502546A (en) 1992-05-07
JPH0744798B2 JPH0744798B2 (en) 1995-05-15

Family

ID=6835105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1507455A Expired - Lifetime JPH0744798B2 (en) 1989-07-10 1989-07-10 Conductor winding device for large rotating electric machine

Country Status (4)

Country Link
US (1) US5030870A (en)
EP (1) EP0481984B1 (en)
JP (1) JPH0744798B2 (en)
WO (1) WO1991001059A1 (en)

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Also Published As

Publication number Publication date
EP0481984A1 (en) 1992-04-29
EP0481984B1 (en) 1994-01-19
JPH0744798B2 (en) 1995-05-15
US5030870A (en) 1991-07-09
WO1991001059A1 (en) 1991-01-24

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