JPH0449908U - - Google Patents
Info
- Publication number
- JPH0449908U JPH0449908U JP9270190U JP9270190U JPH0449908U JP H0449908 U JPH0449908 U JP H0449908U JP 9270190 U JP9270190 U JP 9270190U JP 9270190 U JP9270190 U JP 9270190U JP H0449908 U JPH0449908 U JP H0449908U
- Authority
- JP
- Japan
- Prior art keywords
- cutting line
- card
- broken cutting
- plate body
- penetrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000009331 sowing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
図面はこの考案の一実施例を示し、第１図はこ
の考案を適用したカード型栽培キツトの正面図、
第２図は使用状態を示す正面図、第３図は種蒔き
の手順を示す図、第４図は種蒔きの完了状態を示
す図である。
１……プレート本体、１ａ……第１部分、１ｂ
……第２部分、２……ミシン目（切断破線）、３
ａ，３ｂ……種子名称、４ａ，４ｂ……土深さラ
イン、５ａ，５ｂ……種子袋、６ａ，６ｂ……接
着箇所、７ａ，７ｂ……種子、８……植木鉢、９
……培養土。
The drawings show one embodiment of this invention, and Figure 1 is a front view of a card-type cultivation kit to which this invention is applied.
FIG. 2 is a front view showing the state of use, FIG. 3 is a diagram showing the procedure for sowing seeds, and FIG. 4 is a diagram showing the state when sowing is completed. 1... Plate body, 1a... First part, 1b
... Second part, 2 ... Perforation (cutting broken line), 3
a, 3b...Seed name, 4a, 4b...Soil depth line, 5a, 5b...Seed bag, 6a, 6b...Gluing point, 7a, 7b...Seed, 8...Flower pot, 9
...Culture soil.
Claims (1)
に貫通して切断破線を形成し、この切断破線によ
り分割される第１部分および第２部分に、水分解
性材料により密封された種子を夫々設けたことを
特徴とするカード型栽培キツト。 A broken cutting line is formed by penetrating the front and back surfaces of the plate body formed in a card shape, and seeds sealed with a water-decomposable material are provided in the first part and the second part, which are divided by the broken cutting line, respectively. A card-type cultivation kit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9270190U JPH0449908U (en) | 1990-09-05 | 1990-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9270190U JPH0449908U (en) | 1990-09-05 | 1990-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0449908U true JPH0449908U (en) | 1992-04-27 |
Family
ID=31829363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9270190U Pending JPH0449908U (en) | 1990-09-05 | 1990-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0449908U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100402280B1 (en) * | 2001-04-12 | 2003-10-23 | 류봉균 | Manufacturing method of post card for budding seed |
-
1990
- 1990-09-05 JP JP9270190U patent/JPH0449908U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100402280B1 (en) * | 2001-04-12 | 2003-10-23 | 류봉균 | Manufacturing method of post card for budding seed |