JPH0449308U - - Google Patents
Info
- Publication number
- JPH0449308U JPH0449308U JP8987090U JP8987090U JPH0449308U JP H0449308 U JPH0449308 U JP H0449308U JP 8987090 U JP8987090 U JP 8987090U JP 8987090 U JP8987090 U JP 8987090U JP H0449308 U JPH0449308 U JP H0449308U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- ceramic substrate
- arm body
- head element
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Description
第１図は、本考案によるマルチギヤツプのＦＤ
Ｄ用薄膜磁気ヘツドの主要部の模式図で、ａが上
面図、ｂが断面図である。第２図は、従来のマル
チギヤツプのＦＤＤ用薄膜磁気ヘツドの主要部の
断面図である。
１……薄膜ヘツド素子、３……セラミツク基板
、５……ヘツド支持板、７……アーム体、９……
ＦＰＣ、１１……ワイヤー、１３……接続導体。
Figure 1 shows a multi-gap FD according to the present invention.
FIG. 2 is a schematic diagram of the main parts of a D thin-film magnetic head, in which a is a top view and b is a cross-sectional view. FIG. 2 is a sectional view of the main parts of a conventional multi-gap thin film magnetic head for FDD. DESCRIPTION OF SYMBOLS 1... Thin film head element, 3... Ceramic substrate, 5... Head support plate, 7... Arm body, 9...
FPC, 11...Wire, 13...Connection conductor.
Claims (1)
ク基板が支持され、該セラミツク基板に薄膜ヘツ
ド素子が実装され、該薄膜ヘツド素子の巻線端子
と、アーム体に支持されたＦＰＣのリード線端子
とが、接続導体で接続されたＦＤＤ用薄膜磁気ヘ
ツドにおいて、 前記接続導体は、前記セラミツク基板に美装さ
れた前記薄膜ヘツド素子の巻線端子の位置に対応
する位置で前記セラミツク基板を貫通する棒状導
体であり、 該接続導体によつて、前記セラミツク基板の上
部では前記薄膜ヘツド素子の前記巻線端子と、そ
して、前記セラミツク基板の下部ではヘツド支持
基板およびアーム体の開口部を介してＦＰＣのリ
ード端子とが、一体的に接続されていることを特
徴とするＦＤＤ用薄膜磁気ヘツド。[Claims for Utility Model Registration] A ceramic substrate is supported on a head support plate fixed to an arm body, a thin film head element is mounted on the ceramic substrate, and a winding terminal of the thin film head element is supported on the arm body. In a thin film magnetic head for an FDD in which lead wire terminals of a FPC are connected by a connecting conductor, the connecting conductor is located at a position corresponding to a position of a winding terminal of the thin film head element mounted on the ceramic substrate. A rod-shaped conductor that penetrates the ceramic substrate, and the connection conductor connects the winding terminal of the thin film head element at the top of the ceramic substrate, and the head support substrate and the arm body at the bottom of the ceramic substrate. A thin film magnetic head for an FDD, characterized in that it is integrally connected to a lead terminal of an FPC through an opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8987090U JPH0449308U (en) | 1990-08-28 | 1990-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8987090U JPH0449308U (en) | 1990-08-28 | 1990-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0449308U true JPH0449308U (en) | 1992-04-27 |
Family
ID=31824160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8987090U Pending JPH0449308U (en) | 1990-08-28 | 1990-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0449308U (en) |
-
1990
- 1990-08-28 JP JP8987090U patent/JPH0449308U/ja active Pending