JPH0449099A - Ic receiving case - Google Patents

Abstract

PURPOSE:To prevent the release of a bottom plate from a frame by using the bottom plate having a three-dimensional shape in an IC receiving case and three-dimensionally combining the same with the frame. CONSTITUTION:A molded bottom plate 22 having tags 23, 23' is prepared from a steel plate to be combined with a resin frame 25 and, after the molded bottom plate 22 and the frame 25 are integrated by the adhesion due to an adhesive and the caulking of the tags 23, 23', a substrate 8 loaded with electronics parts is received and an upper resin lid 5 is bonded to the frame 25 to form a card type electronic calculator.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to an IC storage case, more specifically, an electronic component including an IC (hereinafter also simply referred to as an IC).
This relates to a thin container for storing. This kind of IC storage case is applied to thin and thick products such as card-type electronic products.
Examples include card-type calculators, card-type telephone directories, card-type radios, etc. In this specification, a card-type calculator will be explained as a representative example, but it is a thin card-type electronics product that stores ICs and other electronic components. Needless to say, it can be applied to any one.

(Prior technology) In today's so-called card age, it has become a habit to carry credit cards, cash cards, etc. with you. Calculator (hereinafter abbreviated as Calculator)
has been commercialized.

Figure 1 shows an example, and Figure 1 (a) shows the calculator 1.
FIG. 1(B) and FIG. 1(VIII) are a side view and a rear view, respectively.According to the card dimensions defined in the international standard, the short side length Ll is 541. The length L2 of the long side is 85.6 m-.The thickness of a credit card is 0.76 m-, but as will be described later, calculators with a thickness T of 3 to 4 mm are commercially available. As for the thickness, a card-sized one has not been realized.
A solar cell 2, a display 3, and a keyboard 4 are provided on the front of the calculator 1.

A credit card has a simple structure with a magnetic strip pasted onto a plastic plate, whereas a calculator has a case structure because it needs to house electronic parts.

As an example, FIG. 2 shows a cross-sectional view of the calculator 1 shown in FIG.
2(<) and (0) are a sectional view taken along the line AA' and sectional view taken along the line BB' in FIG. 1, respectively. Overall, it has a case structure in which a board 8 with components mounted thereon is housed in a frame 7, and a top plate 15 and a bottom plate 6 are attached.

FIG. 3 shows the upper lid 5, FIG. 3(A) is a front view, and FIG.
N(Il+) is a side view, and FIG. 3(8) is a partial sectional view of a modified example. It corresponds to solar cell 2 and display 3 in Figure 1! Through-holes 2° and 3° are provided, and a keyboard 4 is printed and displayed. The upper cover 5 is made of resin or paper, but if it is necessary to provide rigidity or durability, as in the modified example of FIG. The upper cover 5 may be made by bonding a metal back plate 51 to form a composite top cover 5. In this case, the back plate 5''
Although not shown in the figure, through holes are provided at positions corresponding to the solar cell 2 and display 3, and a through hole is also provided at the position of the keyboard 4 as shown by the broken line 4' in FIG. 3(A). It is being

The thickness t shown in Fig. 3 (IT) and (c) is 50 to 10
It is 0 p.

FIG. 4 shows the bottom plate 6, and FIGS. 4(A) and 4(TI) are a front view and a side view, respectively. A metal plate is used as the bottom plate 6. The reason for using metal is to give the thin calculator more rigidity against bending and to prevent damage to the electronic components even when external forces are applied. Figure 4 (E
The thickness t'' shown in 1) varies depending on the rigidity required for the calculator, and is usually from 100 to 300 mm.

Fig. 5 shows the frame 7, Fig. 5 (a) is a front view, Fig. 5 ('I)) is a sectional view taken along line AA' in Fig. 5 (a), and Fig. 5 (8) is a partially enlarged view thereof. The symbol (=) is a rear view. The outer dimension 7, Lx shown in FIG. 5(a) is the same as Ll, shi in FIG. 1(a). Further, the total thickness T shown in FIG. 5 (b) is the same as T in FIG. 1 (Il+). The frame 7 as a whole consists of a peripheral frame portion 18 and a flat plate portion 17 inside the frame portion 18, and the flat plate portion 17 includes a through hole 15a for accommodating a thick electronic component.
15b and 15c are provided. The frame portion 18 has a land 13.13゛ on the outermost periphery as shown in FIG. 5(c), into which the top cover 5 and bottom plate 6 shown in FIGS. The inner dimensions of the zero step 14 with a step of 14.14° ll゛, j! 2' is the outer diameter dimension ffi of the upper lid 5 in Fig. 3 (a),',! 2゛, and the depth ho of the step 14 is the thickness t' of the upper cover 5.
(see Figure 3 (ET)), and the step is 14"
Inner shell dimensions 1! +', Ilz'' are the same as the outer diameter dimensions 1.m and 11 of the bottom plate 6 in Fig. 4 (A), and the depth ho of the step 14° is the thickness t'' of the bottom plate 6 (Fig. ) is equivalent to ).

The frame 7 is a complex-shaped component as described above, and is preferably manufactured by injection molding of resin.

FIG. 6 shows a resin board 8 on which electronic parts are mounted, FIG. 6 (A) is a plan view, and A-A
', B-B' cross-sectional views are shown in Figure 6 (17) and (A).
In addition to the solar cell 2, the display 3, and the keyboard switch 10, a component assembly 9 such as an IC is mounted on the substrate 8, respectively shown in FIG. External dimensions of the board 82. ．． 2. is the inner dimension ffi of the flat plate portion 17 of the frame 7 in FIG.
It is the same as ffi□. Also, the thickness h of the substrate 8 in FIG.
is the same as the height difference between the frame-shaped flat surface 16 and the flat plate portion 17 of the frame 7 shown in FIG. A board 8 on which electronic parts including ICs are attached is attached to a frame 7 (see Fig. 5).
Components that are mounted and stored in (see b)) and have a thickness greater than that of the board 8,
In other words, in Fig. 6, solar cell 2, display 3
A component assembly 9 such as an IC is housed in through holes 15a, 15b, and 15c of the frame 7 shown in FIG. After that, the top cover 5 is glued to the frame-shaped flat part 16 of the frame 7, the bottom plate 6 is glued to the back surface 16'' of the flat plate part 17 of the frame 7,
Calculator l shown in FIG. 1 is assembled.

(Problems to be Solved by the Invention) By the way, the problem with the durability of the calculator 1 is the adhesive strength. If the end faces of the top cover 5 and the bottom plate 6 are exposed, peeling is likely to occur, so a step 14.14° is provided near the periphery of the frame 7 as shown in Fig. 5, so that the end faces of the top cover 5 and the bottom plate 6 are exposed. I try not to do that. However, when the calculator 1 is carried or used, it is inevitable that torsion force or bending force as shown in FIG. 7(a) as shown by the arrow in FIG. 7(a) or bending force as shown in FIG. When twisting or bending deformation occurs, as shown in FIG. For example, a shearing force as shown by the arrow acts on the adhesive surface 11' of the bottom plate 6 and the frame 7, and when this is repeated, the bottom plate 6 peels off as shown in FIG. 8 (El), for example. In terms of material mechanics, peeling tends to occur between materials with a large difference in Young's modulus, and is often observed between the metal bottom plate 6 and the frame 70. The same applies when a metal plate is used for the upper part 15.

In order to prevent such peeling, it is obvious that it is necessary to select an adhesive that provides sufficient adhesive strength, but it is the fate of adhesives that their adhesive strength decreases over time, and this is a fundamental Conventionally, in order to prevent this peeling, the thickness T (Fig. 1) of the calculator was set to 3~4+a.
m to prevent twisting or bending.

In terms of portability, the thickness T should be 0.0mm, which is the same as the card.
It goes without saying that a thickness of 76 m+* is desirable, but it cannot be made thinner to prevent peeling caused by twisting or bending as described above.

Therefore, an object of the present invention is to provide a thin IC storage case that does not cause the bottom plate and top cover to peel off during use, thereby making it possible to reduce the thickness of electronic products such as card-type calculators. To provide a thin IC storage case.

(Means for Solving the Problems) That is, according to the present invention, instead of the flat bottom plate 6 as shown in FIG. 4 used in conventional IC storage cases, a three-dimensional bottom plate (hereinafter referred to as By using a molded bottom plate (referred to as a molded bottom plate) and three-dimensionally combining this with a frame, a novel IC storage case is provided which prevents the bottom plate 6 from peeling off from the frame 7 as shown in FIG. 8(b). Ru.

The gist of the present invention is to provide an IC storage case comprising a frame, a bottom plate bonded to the bottom surface of the frame, and a top cover bonded to the top surface of the frame, the frame comprising: A recessed portion for storing electronic components including an IC, a frame-shaped peripheral portion surrounding the recessed portion, and a slit-shaped transparent portion provided at an arbitrary position in the circumferential direction slightly inside the outermost portion of the peripheral portion. The bottom plate includes a flat part and a plurality of tags provided at arbitrary positions on the outer edge of the flat part and standing upright from the flat part, and the tags are connected to the slit-shaped through hole of the frame. The bottom plate and the frame are assembled so as to penetrate through the bottom plate,
The IC storage case is characterized in that the tag is bent inward with a frame in between and caulked, and the upper lid is bonded to the frame after housing electronic components including the IC.

According to another aspect of the present invention, a slit groove is extended in the same circumferential position as the slit-like through hole on the surface of the frame on which the bottom plate is attached, and the bottom plate is a flat part,
It consists of a peripheral side wall and a plurality of tags provided at arbitrary positions in the circumferential direction of the edge of the side wall, the side wall is fitted into the slit groove, and the tag passes through the slit-shaped through hole. The bottom plate and the frame are assembled in this way, and the tag is bent inward with the frame in between and caulked.

Furthermore, in a modification of the present invention, a frame omitting the slit-like through hole and a bottom plate with side walls omitting the tag may be used. A given composition is ensured by the combination.

The side wall and/or the bottom plate with the tag may be further bonded to the frame using an adhesive.

Further, the top cover has a two-layer structure of a back plate made of metal plate and a top plate made of resin or paper, and the bottom plate is made of metal, and after spot welding the back plate and the folded part of the tag, the top plate is attached to the back side. It may also be bonded onto a board.

(effect) Hereinafter, the contents of the present invention will be explained in detail with reference to the accompanying drawings.

FIG. 9 is a schematic perspective view showing one embodiment of a molded bottom plate used in the IC storage case of the present invention.

In the figure, the outer dimensions of the bottom surface 26 of the molded bottom plate 22 are 1. m, l!
"and thickness t" are the same as the bottom plate 6 shown in FIG.
Multiple tags 2 on some corners and, if necessary, on the right side.
3.23゛It is a one-piece bent product.

Note that the thickness of the tag 23.23'' may be the same as that of t''. This molded bottom plate 22 is usually made of metal such as a stainless steel plate, but may be made of resin in some cases.

Fig. 1O shows the frame 25 combined with this, Fig. 10 (A) is a plan view, and Fig. 10 (El) is a sectional view taken along B-B' or C-C'' shown in Fig. 10 (A). A partial sectional view is shown, and the shape of the AA' cross section is the same as that in FIG. 5(A). FIG.

The frame 25 according to the present invention has a tag 23 on the molded bottom plate 22.
．． A slit-like through hole 20.20 that passes through 23゛
° at appropriate positions in the circumferential direction, in the example in the figure, at a part of the corner and the right side, and as described later, the inserted tag 2
Frame 7 in Fig. 5 except that it has a concave portion 21.21゛ for storing the bent and caulked part of 3.23゛.
It has the same dimensions and shape. Recessed portion 21.21° depth from frame-like flat surface 16 of frame 25 Tag 23.2
3' thickness. In addition, the slit-like through hole 20
．． The wall spacing g of 20゛ is the same as the thickness of the tag 23.23゛.

Figure 11 (a) shows the state in which the molded bottom plate 22 and frame 25 are combined, the tips of all the tags 23.23'' are bent inward to form a flat part 24 and caulked, as shown in Figure 10 (a). It is shown in correspondence with the cc' cross section.

The height H of the 9th tag 23.23゛ is that the flat part tip 24゛ of the tag after folding is the flat part 17 of the frame 25.
Do not exceed the 17゛ standing wall.

The bottom surface 26 of the molded sole vi22 is usually bonded to the frame 25 using an appropriate adhesive, but in some cases, the use of adhesive may be omitted.
If the tag flat part 24 and the wall of the slit-shaped through hole 20.20 of the frame 25 and the tag upright part 27 are also bonded with adhesive, the frame 25 and the molded bottom plate 22 will be firmly connected. Become.

As a method of joining the frame 25 and the tag flat part 24 by means other than the adhesive side, for example, as shown in FIG. Through hole 33 shown in FIG. 12 (Il+)
．． A tag 23.23" having a length of 33" is combined with a molded bottom plate 22 having a tag 23.23", and the tag 23.23" is bent.
There is a method of fitting the protrusion 32.32'' into the tag through hole 33.33''.

FIG. 11 (U) shows a board 8 on which the electronics components shown in FIG. 6 are mounted on the assembled product of the frame 25 and the molded bottom plate 22.
, and furthermore on the third figure! 5 is shown bonded to the frame-shaped flat surface 16 of the frame 25 (see FIG. 10 (8)) with an adhesive.

By the way, above! ! When a metal plate is used for 5, it is also possible to connect the upper lid 5 and the molded bottom plate 22 by joining the contact surface 34 with the tag flat part 24 by spot welding.

Even if the IC storage case with the above structure is bent or torsionally deformed, since the tag 23.23° hugs the frame 25, the bottom plate 2 will be deformed when the IC storage case is bent or torsioned.
2 and the frame 25 is suppressed, and peeling as shown in FIG. 8 (El) is extremely unlikely to occur.

FIG. 13 is a perspective view of another U-shaped molded bottom plate used in the IC storage case of the present invention.

External dimensions ll' of the bottom surface 31 of the molded bottom plate 29,! ! "and thickness t" are the same as the bottom plate 6 shown in FIG. It is a quality item. The thickness of the side wall 30 and the tag 23.23゛ is t.
It may be the same as l.

FIG. 14 shows a frame 34 combined with this,
Figure 14 (A) is a plan view, and (El) is Figure 14 (A).
A partial sectional view on the AA′ or D cross section shown in
14(c) shows a partial sectional view taken along the B or c-c' cross section shown in FIG. The other dimensions and shape are the same as the frame 25 in FIG. 10.

The slit groove 35 is provided at a position corresponding to the side wall 30 of the molded bottom plate 29 in FIG. 13, and is continuous with the slint-shaped through hole 20.20' through which the tag 23.23' passes. Depth d of the slit groove 35 shown in FIG. 14(0)
.

may be the same as the depth d of the side wall 30 of the molded bottom plate 29 shown in FIG. 13, and the height H to the tip of the tag 23.23" in FIG. 13 may be the same as H in FIG. 9. .

FIG. 15 shows that the side wall 30 of the molded plate bottom 29 is inserted into the slit groove 35 of the frame 34, and the slit-shaped through hole 20.
0゛ is passed through the tag 23. The 23° tip is bent inward and swaged.
The AA' cross section in the figure corresponds to the cc' cross section (ff). The joint between the molded bottom plate 29 and the frame 34 becomes even stronger than in the case of FIG. 11(a) when adhesive force is applied by the adhesive on the side wall 30.

Also, since the side wall 30 of the molded bottom plate 29 is fitted into the slit groove 35 of the frame 34, relative slippage between the frame 34 and the molded bottom plate 29 cannot occur. By reinforcing the frame 34, it is also possible to omit bonding the frame 34 and the molded bottom plate 29 with an adhesive.

In addition, as a modification example, conversely, the frame 34 and the molded bottom plate 2
It is also possible to omit the tags 23 and 23" if an adhesive that is resistant to peeling is used to join the parts 9 to 9. In that case, the side wall 30 and the slit groove 35 can be attached to the entire periphery. Since the parts are fitted around each other, the overall rigidity is considerably increased, and depending on the structure such as the fitting state, adhesion with an adhesive is not necessarily required.

Next, the present invention will be explained in more detail with reference to Examples.

Example 1 From a S[l5304 stainless steel plate with a plate thickness t"=0.1 mm, l1"=53. as shown in FIG. 9. Ovw, 1
z'=84.6mm, H=2mm, W=1.5
A molded bottom plate 22 having six tags 23.23" of AS is manufactured, and a PEEK resin frame 25 shown in Fig. 1θ is fabricated.
In combination with epoxy adhesive and tag 23
．． 23゛ After integrating the molded bottom Fi 22 and the frame 25 by caulking, the board 8 on which electronic parts are mounted is housed, and a PET resin plate with a thickness t' having the dimensions shown in FIGS. 3(A) and 3(U) is =o, ll1ll upper cover 5 is glued to the frame 25, L+"54.0mm shown in FIG.
, Lt=85.6mm, T=0.76mm (D force)'
It was used as a type calculator.

A bending test in which the main island was supported at its short sides and a load of 5 kg was applied to the central part in the longitudinal direction was repeated 500 times intermittently, but no peeling of the bottom plate 22 was observed.

On the other hand, instead of the bottom plate 22, the thickness t″=
When the flat bottom plate 6 made of 0.1 mm 5US304 stainless steel plate was used, the bottom plate peeled off after being bent 10 to 15 times.

Example 2 In this example, the same molded bottom plate 22 and frame 2 as in Example 1 are used.
After combining 5, gluing and caulking the tag in the same way, and storing the board 8 on which electronic parts are mounted,
A stainless steel back plate 5" with a thickness of 1 t+=0.05 as shown in FIG. 3 (8) is attached to the frame-like flat surface 16 of the frame 25 shown in FIG. 10 (A) using epoxy adhesive. After spot welding the back plate 5'' and the tag flat part 24 shown in FIG. A 0.05 m paper top plate 5'' is glued to form the upper lid 5, and L+=5 in Fig. 1.
4.01, L! = 85.6 kaku, T = 0.76 kaku card type calculator.

A bending test similar to that in Example 1 was conducted on the main island, but
Even after repeating the process several times, no peeling of the bottom plate or top lid was observed.

In place of the bottom plate 22 and top lid 5, a flat bottom plate 6 made of 5TLS304 stainless steel plate with a thickness t''=0.1 mm shown in FIG. 4 and a thickness t''=0.1 shown in FIG. 05
Cabinet paper board 5" and thickness t!l = o, os ■ 5US30
When the top cover 5 to which the No. 4 stainless steel plate was bonded was bonded to the frame 25 with epoxy resin, the bottom plate and the top cover peeled off after being bent 5 to 10 times.

Example 3 In this example, from a 5US304 stainless steel plate with a thickness t"=0.1, ffi+'=53.0 as shown in FIG.
11 = 84.6 cabinets, d = 0.4 cabinet side walls 30 all around, and H = 2 at the corners and the center of the long side.
A molded bottom plate 29 having a total of 6 tags 23 and 23' of W=1.5 is manufactured, and the frame 3 shown in FIG.
After fitting the molded bottom plate 29 and the frame 34 into the slit groove 35 with the gap g=0.1 of 4 and integrating the molded bottom plate 29 and the frame 34 by adhering with epoxy adhesive and caulking the tag, the board 8 on which electronic parts are mounted is stored, A top cover 5 made of PET resin with the dimensions shown in FIG. 3 and having a thickness t'=0.1 m is glued to this frame 34, and the thickness shown in FIG. 1 is 54.0 mm.
, Lz' = 85.6 mm, T = 0.76 m, and it was a card type calculator.

A bending test similar to that in Example 1 was conducted on the main island, but
Even after repeating the test several times, no peeling of the bottom plate was observed.

Example 4 In this example, the same molded bottom plate 29 and frame 3 as in Example 3 are used.
After combining 4, gluing and caulking the tag in the same way, and storing the board 8 on which electronic parts are mounted,
A back plate 5'' made of the same stainless steel plate as in Example 2 was bonded and spot welded, and a top plate 5'', which was the same as in Example 2, was further bonded to form the upper M5, and L+= as shown in FIG. 54.
0m, Lz=85.6IIl, T=0.76 card type calculator.

A bending test similar to that in Example 1 was conducted on the main island, but
No peeling of the bottom plate or top lid was observed even after repeating the test several times.

Example 5 This example uses a bottom plate and frame that do not have a tag or a slit-like through hole.

Plate thickness t' = 0.11111 (7) From SUS304 stainless steel plate, ffi shown in Fig. 13, "= 53.0 kaku,
A molded bottom plate 29 with an untagged side wall 30 of d=0.4 m and a diameter of 84.6 m is manufactured, and a slit-like through hole 20.20 cm is formed in the shape shown in Fig. 14. Recessed part 2
After fitting the frame 34 into the slit groove 35 with the gap g=0.1 and bonding it to the frame 34 with an epoxy adhesive, the board 8 on which the electronics components are mounted is housed. Glue the top cover 5 identical to 3 to the frame, and as shown in Figure 1, = 54.0 K, L! =
It is a card type calculator with 85.6 kaku and T=0.76 kaku.

A bending test similar to that in Example 1 was conducted on the main island, but
Even after repeating the test several times, no peeling of the bottom plate was observed.

Example 6 In Example 3, a molded blank plate having a total of 12 tags, 4 on the corner, 3 on the long side, and 2 on the short side, was used, and a frame 34 with slit-shaped through holes at the corresponding positions was used.
After integrating the frame 34 and the molded bottom plate 29 only by caulking the tag without using adhesive, Example 3
I made a card type calculator in the same way.

A bending test similar to that in Example 1 was conducted on the main island, but
No abnormality was observed in the bonding of the bottom plate even after repeating the process several times.

(Effects of the Invention) As described above, the IC storage case of the present invention has an assembly structure including a three-dimensional metal bottom plate, a frame provided thereon, and a metal plate as the back plate of the top cover. The unique feature is that even if the case is bent or torsionally deformed, the bottom plate or top cover is unlikely to peel off, making it possible to make the IC storage case thinner.

[Brief explanation of the drawing]

Figures 1 (A), (II), and (C) are respectively a front view, a side view, and a back view of the calculator 1, and Figures 2 (A) and ([1) are respectively A- A'
3 (a), (b), and (8) are respectively a front view and a side view of the upper lid 5, and a partial sectional view of a modified example, and FIG. 4 (
Figure 5 (a), (+7), and (d) are front and side views of the bottom plate 6, respectively; Figures (a), (+7), (c), and (d) are front views of the frame 7, respectively Figures 6A, 6A, 6C are a front view, an AA' sectional view, and a BB'' sectional view, respectively, of the substrate 8. Cross-sectional view, Figure 7 (
A) and (0) are perspective views showing how the calculator l is twisted and bent, respectively; FIGS. The figures are a schematic perspective view of the molded bottom plate according to the present invention.
Figures (A) and (B) are schematic illustrations of how the molded bottom plate 22 and frame 25 are assembled, and Figures 12 (A) and (+7) are how the molded bottom plate 22 and frame 25 are joined, respectively. 13 is a schematic perspective view showing another modification of the present invention, and FIGS. 14(a), (b), and (c) are plan views of the frame 34, respectively, A-A" The cross-sectional view, the cc' cross-sectional view, and FIGS. 15(a) and (II) are respectively taken from A-
They are an A sectional view and a cc' sectional view. Part l b

Claims (5)

[Claims] (1) An IC storage case consisting of a frame, a bottom plate bonded to the bottom surface of the frame, and a top cover bonded to the top surface of the frame, wherein the frame is
A recessed portion for storing electronic components including C, a frame-shaped peripheral portion surrounding the recessed portion, and a slit-shaped transparent portion provided at an arbitrary position in the circumferential direction slightly inside from the outermost portion of the peripheral portion. The bottom plate includes a flat part and a plurality of tags provided at arbitrary positions on the outer edge of the flat part and standing upright from the flat part, and the tags are connected to the slit-shaped through hole of the frame. The bottom plate and the frame are assembled so as to pass through the bottom plate, the tag is bent inward across the frame and caulked, and the top cover houses electronic components including an IC, and then is bonded to the frame. An IC storage case characterized by: (2) A slit groove is provided on the side of the frame on which the bottom plate is attached, and a slit groove is extended at the same circumferential position as the slit-shaped through hole, and the bottom plate is attached to the flat part, the surrounding side wall, and the edge of the side wall. The bottom plate and the frame are assembled such that the side wall is fitted into the slit groove, and the tag passes through the slit-shaped through hole. 2. The IC storage case according to claim 1, wherein the tag is bent inward across the frame and crimped. (3) The IC storage case according to claim 2, characterized in that it uses a frame omitting the slit-like through hole and a bottom plate with side walls omitting the tag. (4) The IC storage case according to any one of claims 1 to 3, wherein the side wall and/or the bottom plate with the tag and the frame are further bonded with an adhesive. (5) The top cover has a two-layer structure consisting of a back plate made of a metal plate and a top plate made of resin or paper, and the bottom plate is made of metal, and the back plate and the folded part of the tag are spot welded, and the back plate is made of metal. 5. The IC storage case according to claim 1, wherein the top plate is bonded to the top of the plate.