JPH0448929Y2 - - Google Patents

Info

Publication number
JPH0448929Y2
JPH0448929Y2 JP18800787U JP18800787U JPH0448929Y2 JP H0448929 Y2 JPH0448929 Y2 JP H0448929Y2 JP 18800787 U JP18800787 U JP 18800787U JP 18800787 U JP18800787 U JP 18800787U JP H0448929 Y2 JPH0448929 Y2 JP H0448929Y2
Authority
JP
Japan
Prior art keywords
shot
flow rate
valve body
outlet
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18800787U
Other languages
Japanese (ja)
Other versions
JPH0192370U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18800787U priority Critical patent/JPH0448929Y2/ja
Publication of JPH0192370U publication Critical patent/JPH0192370U/ja
Application granted granted Critical
Publication of JPH0448929Y2 publication Critical patent/JPH0448929Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 〔産業上の利用分野〕 この考案はシヨツトブラスト装置に関する。[Detailed explanation of the idea] [Industrial application field] This invention relates to a shot blasting device.

〔従来の技術〕[Conventional technology]

一般に間隔をおいて搬送されてくるビレツトな
どの鋼材の研掃をおこなうシヨツトブラスト装置
としては、第4図および第5図に示す装置が用い
られている。図中、1はキヤビネツトで、ローラ
2によりこのキヤビネツト1内を搬送される被研
掃材3に対して、4台のシヨツト投射装置4より
シヨツトが投射されて研掃がおこなわれる。投射
後のシヨツトは、キヤビネツト1の下部ホツパ部
1aからスクリユーコンベア5により排出され、
バケツトエレベータ6により上方へ移送され、上
部ホツパ7から流量制御装置8を経てシヨツト投
射装置4へ還送される。9は上部ホツパ7内の移
送用のスクリユーコンベアである。流量制御装置
8は、第5図に示すように流入管10の下端部
に、曲板状の仕切板11の両側に扇形の側板12
を固着した弁体13を揺動自在に取付け、エアシ
リンダ15によりこの弁体13の開閉をおこなう
ようになつている。また16はケーシング14に
固着したブラケツト17とエアシリンダ15の間
に連結された電動式の直動アクチユエータから成
る開度調節機で、ロツド18の突出量を調節して
弁体13の開放時の仕切板11の開度を調節しシ
ヨツト流量を調節するためのものである。
Generally, the apparatus shown in FIGS. 4 and 5 is used as a shot blasting apparatus for polishing steel materials such as billets that are conveyed at intervals. In the figure, reference numeral 1 denotes a cabinet, and four shot projection devices 4 project shots onto a material 3 to be polished, which is conveyed through the cabinet 1 by rollers 2, thereby performing cleaning. The shot after being projected is discharged from the lower hopper portion 1a of the cabinet 1 by a screw conveyor 5,
The liquid is transported upward by the bucket elevator 6 and returned to the shot projection device 4 from the upper hopper 7 via the flow control device 8. 9 is a screw conveyor for transfer within the upper hopper 7. As shown in FIG.
A valve body 13 to which is fixed is swingably mounted, and the valve body 13 is opened and closed by an air cylinder 15. Reference numeral 16 denotes an opening adjuster consisting of an electric direct-acting actuator connected between a bracket 17 fixed to the casing 14 and an air cylinder 15, which adjusts the amount of protrusion of the rod 18 to adjust the opening amount when the valve body 13 is opened. This is for adjusting the opening degree of the partition plate 11 to adjust the shot flow rate.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

ところで前記構成のシヨツトブラスト装置19
においては、被研掃材3の前端がキヤビネツト1
内の研掃位置に到達する時点でシヨツトの投射を
開始し、被研掃材3の後端が研掃位置を通過した
時点で投射を終了するサイクルを繰返す必要があ
るが、このときのシヨツト流の制御は、流量制御
装置8の開閉動作によりおこなつている。すなわ
ち弁体13はエアシリンダ15により全閉状態と
しておき、投射開始時に開放し、研掃終了時に全
閉状態に戻すのである。ところがこの方法による
と、弁体13の開放動作時におけるシヨツト流量
の立上り遅れや、弁体13上部のシヨツト過大蓄
積量に起因する大流量シヨツトの初期流出および
それに続くシヨツト流量の増減変動などを生じ
て、シヨツト流量が安定しないという問題があつ
た。
By the way, the shot blasting device 19 having the above configuration
In this case, the front end of the material to be polished 3 is connected to the cabinet 1.
It is necessary to repeat the cycle in which the shot starts firing when it reaches the cleaning position in the middle and ends when the rear end of the material to be polished 3 passes the polishing position. The flow is controlled by opening and closing the flow rate control device 8. That is, the valve body 13 is kept in a fully closed state by the air cylinder 15, opened at the start of projection, and returned to the fully closed state at the end of cleaning. However, this method causes a delay in the start-up of the shot flow rate when the valve body 13 is opened, an initial outflow of a large flow rate shot due to an excessive accumulation of shot in the upper part of the valve body 13, and subsequent fluctuations in the shot flow rate. However, there was a problem that the shot flow rate was not stable.

一般に被研掃材3の形状、材質、移送速度やシ
ヨツトの投射速度等の条件に応じて、少ないシヨ
ツト流量で研掃硬化の高い研掃をおこなうことが
できる最適シヨツト流量値(シヨツト原単位最良
値)が存在するが、上記のようにシヨツト流量が
不安定だと上記最適シヨツト流量値の維持が困難
で、経済的な研掃ができない原因となつていた。
また上記の研掃開始時の大流量シヨツトの投射に
よりシヨツト投射装置4のモータトリツプ事故を
おこすなどの問題もあつた。
In general, depending on conditions such as the shape, material, transfer speed, and shot projection speed of the material to be polished 3, the optimum shot flow rate value (best shot consumption rate) that can perform highly hardening cleaning with a small shot flow rate is determined. However, if the shot flow rate is unstable as described above, it is difficult to maintain the above-mentioned optimum shot flow rate value, which is the reason why economical cleaning cannot be performed.
Further, there were also problems such as the motor tripping accident of the shot projection device 4 due to the projection of the large flow rate shot at the start of the cleaning process.

この考案は上記従来の問題点を解決するもの
で、安定したシヨツト流量で断続的にシヨツト投
射をおこなうことができるシヨツトブラスト装置
を提供しようとするものである。
This invention is an attempt to solve the above-mentioned conventional problems and to provide a shot blasting device that can perform shot blasting intermittently with a stable shot flow rate.

〔問題点を解決するための手段〕[Means for solving problems]

しかしてこの考案の装置は、上部ホツパから供
給されたシヨツトをシヨツト投射装置によりキヤ
ビネツト内の被研掃材に投射して研掃をおこなう
シヨツトブラスト装置において、シヨツト通過面
積を変化させてシヨツト流量の調節をおこなう流
量調節装置を前記上部ホツパに接続し、この流量
調節装置の出口側に、シヨツト流を2方向に切替
える切替装置を接続し、この切替装置の一方のシ
ヨツト流出口を前記シヨツト投射装置に、他方の
シヨツト流出口を前記キヤビネツト内に開口する
バイパス管路に、それぞれ接続したことを特徴と
するシヨツトブラスト装置である。
However, the device of this invention is a shot blasting device that blasts shot supplied from an upper hopper onto a material to be polished in a cabinet using a shot projection device, and changes the shot passing area to adjust the shot flow rate. A flow rate adjustment device for adjusting the shot flow is connected to the upper hopper, a switching device for switching the shot flow in two directions is connected to the outlet side of this flow rate adjustment device, and one shot outlet of this switching device is connected to the shot projection side. The shot blasting apparatus is characterized in that the other shot outlet is connected to a bypass pipe opening into the cabinet.

〔作用〕[Effect]

この考案のシヨツトブラスト装置においては、
流量調節装置は被研掃材に応じて一定の開度(シ
ヨツト通過面積)にセツトして用いる。この流量
調節装置を通過した一定流量のシヨツト流は切替
装置によりシヨツト投射装置またはバイパス管路
に供給される。投射開始時には切替装置をシヨツ
ト投射装置側に切替えるだけでよいので、投射開
始時から一定流量の安定したシヨツト流がシヨツ
ト投射装置に供給され投射される。投射終了時に
切替装置をバイパス管路側に切替えれば、このバ
イパス管路を経てキヤビネツト内にシヨツト流が
流入するが、シヨツト投射装置を経由しない自由
落下であるため、シヨツトの消耗は少ない。
In the shot blasting device of this invention,
The flow rate adjustment device is used by setting it to a certain opening degree (shot passage area) depending on the material to be polished. A constant flow rate of the shot stream passing through the flow regulating device is supplied to a shot projection device or a bypass line by a switching device. Since it is only necessary to switch the switching device to the shot projection device side at the start of projection, a stable shot flow at a constant flow rate is supplied to the shot projection device and projected from the start of projection. If the switching device is switched to the bypass pipe side at the end of projection, the shot flow will flow into the cabinet via the bypass pipe, but since it is a free fall without passing through the shot projection device, there is little wear on the shot.

〔実施例〕〔Example〕

以下第1図乃至第3図によりこの考案の一実施
例を説明する。
An embodiment of this invention will be described below with reference to FIGS. 1 to 3.

図中第4図および第5図と同一部分にはこれら
の図面と同一符号を付して図示し、詳細な説明は
省略する。21は上部ホツパ7に接続した流量調
節装置、22はこの流量調節装置21の出口側に
接続した切替装置、23はこの切替装置22の一
方のシヨツト流出口24とシヨツト投射装置4と
を接続するシヨツト供給管路、25は切替装置2
2の他方のシヨツト流出口26に接続したバイパ
ス管路で、その下端はキヤビネツト1内に開口し
ている。流量調節装置21は第2図に示す構造を
有し、前記従来の流量制御装置8からエアシリン
ダ15を除去した構成を有し、開度調節機16の
ロツド18の端部は弁体13に連結されており、
開度調節機16の操作により弁体13を揺動させ
て流入管10の下端部の開口面積を変えてシヨツ
ト流量の調節をおこなうものである。なおシヨツ
トブラスト装置休転時などに備えて、ロツド18
の最長突出時に弁体13が全閉状態となるように
しておくのがよい。また切替装置22は第3図に
示す構造を有し、ケーシング27に短筒状の弁体
28を揺動自在に支持し、レバー29を介してこ
の弁体28を揺動駆動するエアシリンダ30をケ
ーシング27に取付け、ケーシング27の弁体2
8の下方位置には、弁体28の左右両傾動位置に
対向して開口するシヨツト流出口24および26
を設けてある。27aはケーシング27の底部に
固設した仕切壁である。また弁体28の上方には
流量調節装置21のケーシング14下端の流出口
14aが開口している。
In the figure, the same parts as in FIGS. 4 and 5 are designated by the same reference numerals and detailed explanations will be omitted. 21 is a flow rate adjustment device connected to the upper hopper 7, 22 is a switching device connected to the outlet side of this flow rate adjustment device 21, and 23 is a connection between one shot outlet 24 of this switching device 22 and the shot projection device 4. Shot supply pipe, 25 is switching device 2
This is a bypass line connected to the other shot outlet 26 of 2, and its lower end opens into the cabinet 1. The flow rate adjustment device 21 has a structure shown in FIG. 2, and has a configuration in which the air cylinder 15 is removed from the conventional flow rate control device 8. are connected,
The shot flow rate is adjusted by swinging the valve body 13 by operating the opening adjuster 16 to change the opening area of the lower end of the inflow pipe 10. In addition, in case the shot blasting equipment is stopped, the rod 18
It is preferable that the valve body 13 be in a fully closed state when it is extended to its maximum extent. Furthermore, the switching device 22 has a structure shown in FIG. is attached to the casing 27, and the valve body 2 of the casing 27 is
At the lower position of 8, there are shot outlet ports 24 and 26 that open opposite the left and right tilted positions of the valve body 28.
is provided. 27a is a partition wall fixed to the bottom of the casing 27. Further, an outlet 14a at the lower end of the casing 14 of the flow rate adjustment device 21 is opened above the valve body 28.

上記構成のシヨツトブラスト装置31において
は、流量調節装置21により所望のシヨツト流量
が得られるように弁体13の開度をセツトし、そ
の後は切替装置22のエアシリンダ30による弁
体28の揺動切換のみによりシヨツト流のシヨツ
ト投射装置4への供給および供給停止をおこな
う。弁体28をシヨツト流出口26側に位置させ
て一定流量のシヨツトがキヤビネツト1内へバイ
パス管路25を経て流通している状態で、弁体2
8をシヨツト流出口24側へ切換えれば、シヨツ
ト流量の変動なしに一定流量のシヨツト流がシヨ
ツト供給管路23を経てシヨツト投射装置4に供
給され投射される。シヨツト投射終了時には弁体
28をシヨツト流出口26側に切替えればよい。
このようにして、間隔をおいて搬送されてくる各
被研掃材3に対し、常に最適シヨツト流量値(シ
ヨツト原単位最良値)でのシヨツト投射ができ、
経済的であるとともに被研掃材の研掃効果のばら
つきも少ない。
In the shot blasting device 31 configured as described above, the opening degree of the valve body 13 is set by the flow rate adjustment device 21 so as to obtain a desired shot flow rate, and then the valve body 28 is oscillated by the air cylinder 30 of the switching device 22. The shot flow is supplied to and stopped from being supplied to the shot projection device 4 only by dynamic switching. With the valve body 28 positioned on the shot outlet 26 side and a constant flow rate of shot flowing into the cabinet 1 via the bypass pipe 25, the valve body 2
8 to the shot outlet 24 side, a constant flow rate of shot flow is supplied to the shot projection device 4 via the shot supply pipe 23 and projected without fluctuation in the shot flow rate. At the end of shot projection, the valve body 28 may be switched to the shot outlet 26 side.
In this way, it is possible to always project a shot at the optimum shot flow rate value (best shot consumption value) for each workpiece 3 that is conveyed at intervals,
It is economical and there is little variation in the cleaning effect of the material to be polished.

この考案は上記実施例に限定されるものではな
く、たとえば流量調節装置21としては、揺動式
の弁体13のかわりに平板状の弁体を直線駆動す
るものや、弁体の開度調節を手動操作によりおこ
なうものなどを用いてもよい。また切替装置22
としては、揺動式の弁体28のかわりに、固定し
た弁体28に対してケーシング27側を揺動する
構造のものなど、上記以外の形式のものを用いて
もよい。さらにキヤビネツト1から上部ホツパ7
へのシヨツト返送手段も上記実施例以外のものと
してもよい。
This invention is not limited to the above-described embodiments; for example, the flow rate regulating device 21 may be one in which a flat valve body is linearly driven instead of the swinging type valve body 13, or one in which the opening degree of the valve body is adjusted. A method in which this is performed manually may also be used. Also, the switching device 22
Alternatively, instead of the swingable valve body 28, a type other than the above may be used, such as one in which the casing 27 side swings relative to the fixed valve body 28. Furthermore, from cabinet 1 to upper hopper 7
The shot return means may also be other than the above embodiment.

〔考案の効果〕[Effect of idea]

以上説明したようにこの考案によれば、変動の
少ない安定したシヨツト流量で断続的にシヨツト
投射をおこなうことができ、シヨツト原単位の向
上と被研掃材の研掃効果のばらつきの低減化をは
かることができる。
As explained above, according to this invention, it is possible to perform shot projection intermittently with a stable shot flow rate with little fluctuation, improving the shot consumption rate and reducing variations in the cleaning effect of the material to be polished. It can be measured.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例を示すシヨツトブ
ラスト装置の一部縦断正面図、第2図は第1図の
流量調節装置の縦断面図、第3図は同じく切替装
置の縦断面図、第4図は従来のシヨツトブラスト
装置の一例を示す一部縦断正面図、第5図は第4
図の流量制御装置の縦断面図である。 1……キヤビネツト、4……シヨツト投射装
置、7……上部ホツパ、13……弁体、14……
ケーシング、16……開度調節機、21……流量
調節装置、22……切替装置、23……シヨツト
供給管路、24……シヨツト流出口、25……バ
イパス管路、26……シヨツト流出口、27……
ケーシング、28……弁体、30……エアシリン
ダ、31……シヨツトブラスト装置。
Fig. 1 is a partially longitudinal sectional front view of a shot blasting device showing an embodiment of this invention, Fig. 2 is a longitudinal sectional view of the flow rate adjustment device shown in Fig. 1, and Fig. 3 is a longitudinal sectional view of the switching device. , FIG. 4 is a partially longitudinal front view showing an example of a conventional shot blasting device, and FIG.
FIG. 3 is a longitudinal cross-sectional view of the flow control device shown in the figure. 1... Cabinet, 4... Shot projection device, 7... Upper hopper, 13... Valve body, 14...
Casing, 16...Opening degree controller, 21...Flow rate regulator, 22...Switching device, 23...Shot supply pipe line, 24...Shot outlet, 25...Bypass pipe line, 26...Shot flow Exit, 27...
Casing, 28... Valve body, 30... Air cylinder, 31... Shot blasting device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上部ホツパから供給されたシヨツトをシヨツト
投射装置によりキヤビネツト内の被研掃材に投射
して研掃をおこなうシヨツトブラスト装置におい
て、シヨツト通過面積を変化させてシヨツト流量
の調節をおこなう流量調節装置を前記上部ホツパ
に接続し、この流量調節装置の出口側に、シヨツ
ト流を2方向に切替える切替装置を接続し、この
切替装置の一方のシヨツト流出口を前記シヨツト
投射装置に、他方のシヨツト流出口を前記キヤビ
ネツト内に開口するバイパス管路に、それぞれ接
続したことを特徴とするシヨツトブラスト装置。
In shot blasting equipment, which blasts the shot supplied from the upper hopper onto the material to be polished inside the cabinet using a shot projection device to perform polishing, a flow rate adjustment device is used to adjust the shot flow rate by changing the shot passing area. A switching device connected to the upper hopper and switching the shot flow in two directions is connected to the outlet side of this flow rate regulating device, and one shot outlet of this switching device is connected to the shot projection device, and the other shot outlet is connected to the above shot projection device. A shot blasting device, characterized in that each of the above-mentioned shot blasting devices is connected to a bypass pipe line opening into the cabinet.
JP18800787U 1987-12-10 1987-12-10 Expired JPH0448929Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18800787U JPH0448929Y2 (en) 1987-12-10 1987-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18800787U JPH0448929Y2 (en) 1987-12-10 1987-12-10

Publications (2)

Publication Number Publication Date
JPH0192370U JPH0192370U (en) 1989-06-16
JPH0448929Y2 true JPH0448929Y2 (en) 1992-11-18

Family

ID=31479132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18800787U Expired JPH0448929Y2 (en) 1987-12-10 1987-12-10

Country Status (1)

Country Link
JP (1) JPH0448929Y2 (en)

Also Published As

Publication number Publication date
JPH0192370U (en) 1989-06-16

Similar Documents

Publication Publication Date Title
US5361993A (en) Device for material removing processing of a material layer
JPS646628A (en) Hot water supplier
JPH0448929Y2 (en)
GB1295552A (en)
US5014889A (en) Powder feeding apparatus
US4578878A (en) Tobacco drying machine
US3324566A (en) Structure for and method of cooling granular material
US5045245A (en) Device for atomizing liquid or for comminuting gas into small bubbles
US3904128A (en) Method and device for enamelling the edges of sanitary articles
JPS6341088Y2 (en)
GB2268900A (en) A process and a device for setting the insertion speed (welding arm movement speed) during welding using welding studs
JP2961468B2 (en) Sintering raw material charging method
JPH10297695A (en) Flow rate adjusting valve for powdery and granular material
JPS62285824A (en) Oscillating type granular material supply device
SU1722581A1 (en) Wet grinding control method
JPS61153425A (en) Mixing device of hot water and water
SU1748877A1 (en) Method for control of foam separation process and device for its realization
JPS5618107A (en) Controlling device for direction of flow
JPS6212544Y2 (en)
JPH01189707A (en) Flow rate controller
US1819021A (en) Sand blast machine
JPS5942845A (en) Control of blowing of warm air in coarsely rubbing machine of tea preparation
JPS6341089Y2 (en)
SU565185A1 (en) Method for automatic control of bulk materials drying process
JPH07115114B2 (en) Method and apparatus for controlling sand discharge