JPH0448878B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a plating device suitable for, for example, partially plating the inner peripheral surface of a cylindrical member.

(Prior Art) For example, a part of the inner circumferential surface (wiper seal, U-ring groove) of a cylinder head of a hydraulic cylinder is sometimes galvanized for the purpose of imparting corrosion resistance.

There are two methods for this: masking unnecessary areas with tape, etc., and then plating by immersing the part in a plating tank, and using electrodes impregnated with plating liquid while rotating the part to be plated without using a plating tank. There is a brush plating method in which the conductor is coated with cotton or the like and impregnated with a plating liquid and is pressed against the inner surface.

(Problem to be solved by the invention) However, in this case, the former requires man-hours and costs for masking parts of the member to be plated that do not need to be plated, resulting in poor productivity, and the electrolytic cleaning liquid bath and plating bath are separated. There is also the problem that the device needs to be provided, which increases the size of the device.

On the other hand, the latter has excellent transportability of the device itself, but the electrode needs to be manufactured each time according to the shape of the part to be plated, and the workability of replacing it is poor, and the electrode is attached to the sliding part. It also consumes a lot of water, and since the chemicals such as the plating solution are highly concentrated and disposable, their disposal becomes a problem and is costly.

The present invention aims to solve such problems.

(Means for Solving the Problems) In order to achieve the above object, in the present invention, an electrode is arranged on a pedestal on which a member to be plated is placed via a seal ring, and a supply passage and a discharge passage are formed. A liquid level adjustment tank is provided in communication with the discharge passage, and an electrolytic cleaning liquid tank and a plating liquid tank are provided below the liquid level adjustment tank, and each tank is provided with a liquid level adjustment tank that communicates with the liquid level adjustment tank. A pump that selectively supplies each liquid of the electrolytic cleaning liquid tank and the plating liquid tank to the supply passage, which is provided with a freely movable receiving tank that selectively guides the liquid and is provided with a drive means for switching the position of the receiving tank according to the process. (Function) Based on the above configuration, the workpiece to be plated is placed on the pedestal, and while the internal space is used as a plating tank, electrolytic cleaning solution is supplied. By sequentially feeding , cleaning water, and plating liquid while adjusting their liquid levels, a uniform plating layer is formed up to a predetermined height on the inner surface.

On the other hand, the electrolytic cleaning solution or plating solution discharged from the adjustment tank in accordance with the plating process is positioned relative to the adjustment tank via a driving means when the effluent from the adjustment tank flows in corresponding to each process. The liquid is reliably distributed to the electrolytic cleaning liquid tank or the plating tank by the receiving tank, and is recycled and used.

(Example) Specific examples of the present invention will be described below based on the drawings.

In FIG. 1, reference numeral 1 denotes a cylinder head (workpiece) as a member to be plated, which is placed on the upper part of a pedestal 2 with a seal ring 3 interposed therebetween.

An electrode 4 is provided in the center of the pedestal 2, and this electrode 4
protrudes into the internal space 6 of the workpiece 1. Electrode 4
is formed in a hollow shape, and a plurality of nozzles 5 are formed in the upper part thereof, and constitutes a supply passage through which electrolytic cleaning liquid and plating liquid are supplied, as will be described later.

A discharge passage 7 is formed in the pedestal 2 and communicates with the internal space 6 of the workpiece 1, and this discharge passage 7 communicates with a liquid level adjustment tank 8. The liquid level adjustment tank 8 is provided with a partition wall 9 for adjusting the liquid level inside thereof, and a liquid level adjustment plate 10 is attached to the upper part of the partition wall 9 so as to be freely raised and lowered, and a small diameter passage 11 is formed in the lower part. be done.

The liquid that has passed through the liquid level adjustment tank 8 is led to a drainage channel 12.

On the other hand, 13 is an electrolytic cleaning liquid tank containing electrolytic cleaning liquid, 14 is a plating liquid tank containing plating liquid,
Pipes 17 and 1 are connected by pumps 15 and 16, respectively.
8 and electromagnetic valves 19 and 20, electrolytic cleaning liquid or plating liquid is selectively fed into the internal passage of the electrode 4.

Note that when the solenoid valves 19 and 20 are closed, the bypass valves 19A and 20A are opened and the pumps 15 and 16 are closed.
The electrolytic cleaning solution and plating solution are circulated to an electrolytic cleaning solution tank 13 and a plating solution tank 14, respectively.

Further, a water supply pipe 21 is connected to the electrode 4, and cleaning water is also supplied to the electrode 4 by opening the electromagnetic valve 22.

Receiving tanks 23 and 24 are provided above the electrolytic cleaning liquid tank 13 and plating liquid tank 14, respectively, and each of the receiving tanks 23 and 24 can be moved in the horizontal direction by air cylinders 25 and 26 as driving means. .

In other words, the receiving tanks 23 and 24 are connected to the air cylinders 25 and 2.
6 is located directly below the drainage channel 12 when expanded, and is movable so as to be removed from the drainage channel 12 when contracted, and when located directly below the drainage channel 12, it is located directly below the drainage channel 12. Drain tubes 27 and 28 are attached so that the liquid can be dropped into the electrolytic cleaning liquid tank 13 and the plating liquid tank 14, respectively.

In addition, instead of moving the receiving tanks 23 and 24 with respect to the drainage channel 12, the drainage channel 12 may be made movable and the position of the drainage channel 12 with respect to the receiving tanks 23 and 24 may be changed.

Further, a wastewater receiving tank 29 is provided between the electrolytic cleaning liquid tank 13 and the plating liquid tank 14, and each of the above-mentioned receiving tanks 2
3 and 24 are adapted to receive wash water discharged from the drainage channel 12 when they are removed from directly below the drainage channel 12.

In order to flow a predetermined plating current between the aforementioned electrode 4 and the pedestal 2, the electrode terminal 31 from the rectifier 30 is connected to the electrode terminal 31 from the rectifier 30.
and 32 can be connected to the electrode 4 and the workpiece 1.

In the above configuration, first, the work 1 is placed on the pedestal 2, and the work 1 is fixed by a fixing means (not shown) as necessary. In this case, the seal ring 3 on the lower surface of the workpiece 1 maintains the sealing performance between the workpiece 1 and the pedestal 2.

After connecting the electrode 4 to the (+) side and the workpiece 1 to the (-) side, open the solenoid valve 19 and turn on the pump 1.
5, the electrolytic cleaning liquid in the electrolytic cleaning liquid tank 13 is transferred to the pipe 1.
At the same time, the air cylinder 25 is extended to move the receiving tank 23 directly below the drainage channel 12.

The electrolytic cleaning liquid from the pump 15 flows out into the internal space 6 of the workpiece 1 through the nozzle 5 of the electrode 4, and a portion flows into the liquid level adjustment tank 8 through the discharge passage 7. Furthermore, the electrolytic cleaning solution overflows the liquid level adjustment plate 10 of the liquid level adjustment tank 8 and is placed in the receiving tank 2 below the drainage channel 12.
3 and returns to the electrolytic cleaning liquid tank 13 again.

In the liquid level adjustment tank 8, the electrolytic cleaning liquid also flows out from the passage 11 at the bottom of the partition wall 9, but the pump 15
The flow rate supplied from the liquid level adjusting plate 10 is set to be excessive so as to always overflow the liquid level adjusting plate 10. Therefore, the internal space 6 of the workpiece 1 communicating with this plate
is filled with electrolytic cleaning liquid to the same level as the liquid level adjustment plate 10.

The liquid level of the electrolytic cleaning liquid in the workpiece 1 is determined according to the area to be plated, and can be freely adjusted by moving the liquid level adjusting plate 10 up and down.

In this way, when the electrolytic cleaning is completed by supplying current from the rectifier 30 for a predetermined time and circulating the electrolytic cleaning liquid, the solenoid valve 19 is closed.

When the supply of electrolytic cleaning solution is stopped, the liquid level adjustment tank 8
Since the passage 11 at the bottom of the workpiece 1 is always open and the piping from the lower end of the electrode 4 to the drainage channel 12 is always open, the electrolytic cleaning solution in the internal space 6 of the workpiece 1 flows through this bottom passage. After passing through step 11, the entire amount flows out.

Next, the electromagnetic valve 22 is opened to send cleaning water from the water supply pipe 21 to clean the inner surface of the workpiece 1.

In this case, the air cylinder 25 is contracted and the receiving tank 2 is
3 is moved from the lower surface of the drainage channel 12, and after washing the workpiece 1 with water, the washing water flowing out from the drainage channel 12 is made to flow into the drainage tank 29.

When the predetermined water washing process is completed, the solenoid valve 22
Close to stop water supply.

The cleaning water flows out from the inside of the submerged workpiece 1 and the liquid level adjustment tank 8 in the same manner as described above.

Thereafter, the solenoid valve 20 is opened and the air cylinder 26 is extended to move the receiving tank 24 directly below the drainage channel 12.

Then, the plating liquid from the plating liquid tank 14 is sent to the electrode 4 via the pipe 18.
It is supplied into the workpiece 1 from the nozzle 5.

The plating liquid rises to a predetermined liquid level in the same manner as described above, and the surplus is returned from the liquid level adjustment tank 8 to the plating liquid tank 14 via the receiving tank 24.

In this way, the inner surface of the workpiece 1 is immersed in the plating liquid up to a predetermined position, and at the same time, when a plating current is supplied from the rectifier 30, a plating layer is formed on the inner surface of the workpiece 1.

When the plating layer reaches a predetermined thickness, the electrode 4
At the same time, the electromagnetic valve 20 is closed and the supply of plating liquid is stopped. As a result, all the plating liquid flows out from inside the workpiece 1 and is collected in the plating liquid tank 14.

Finally, the electromagnetic valve 22 is opened again, and the cleaning water is jetted from the nozzle 5 toward the inner surface of the workpiece 1, thereby cleaning the formed plating layer. At this time, the receiver tank 2
4 is moved, and the washing water falling from the drainage channel 12 is discharged from the drainage receiving tank 29.

When cleaning is completed, the workpiece 1 is removed from the pedestal 2, the next workpiece 1 is newly set, and the operation is repeated in the same manner as above.

In this way, the present invention applies internal plating while using the internal space 6 of the workpiece 1 as a plating tank, and by adjusting the height of the liquid level, it is possible to easily apply a plating layer to any part. can be formed.

In this embodiment, the electrolytic cleaning liquid and plating liquid are supplied through the inside of the electrode 4, but it is of course possible to provide a supply passage separately from the electrode.

It is also possible to adjust the height of the liquid level by regulating the relationship between the supply amount and the outflow amount using, for example, a flow rate control valve.

Furthermore, in electrolytic cleaning, the current is switched and workpiece 1 is cleaned.
be treated as an anode, multiple pretreatment tanks (electrolytic cleaning solution tanks, etc.) and plating tanks may be installed, and the plating pretreatment process may be, for example, alkaline degreasing → water washing → electrolytic cleaning → water washing, or the plating layer may be two or three layers. , supplying air at the same time as washing water and performing air agitation to improve the cleaning effect, blowing air after draining the liquid to drain the liquid and increasing the liquid recovery rate, and rectifiers for electrolytic cleaning and plating. It is possible to install each separately and to obtain the optimum processing conditions for each.

(Effects of the Invention) As described above, according to the present invention, it is possible to arbitrarily apply internal plating only to necessary parts without using masking or electrodes that match the shape of the member to be plated, thus improving work efficiency. However, it is possible to achieve significant cost reductions.

Furthermore, according to the present invention, once the parts to be plated are set, the processing is carried out continuously, further improving work efficiency, and furthermore, the electrolytic cleaning solution and plating liquid used for plating in this processing process are compatible with each process. Since the liquid is distributed to each liquid tank via a moving receiving tank, collected, and then reused, it is extremely economical compared to disposable liquids.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an apparatus for implementing the present invention. 1... part to be plated (work), 2... pedestal, 3
... Seal ring, 4 ... Electrode, 5 ... Nozzle,
6... Internal space, 7... Discharge passage, 8... Liquid level adjustment tank, 9... Partition wall, 10... Liquid level adjustment plate, 12
... Drainage channel, 13 ... Electrolytic cleaning liquid tank, 14 ... Metsuki liquid tank, 15, 16 ... Pump, 19, 20,
22... Solenoid valve, 23, 24... Receiving tank, 25, 2
6...Air cylinder, 29...Drainage tank, 30...
…rectifier.

Claims (1)

[Claims] 1. An electrode is arranged on a pedestal on which a member to be plated is placed via a seal ring, a supply passage and a discharge passage are formed, and a liquid level adjustment tank is provided in communication with the discharge passage. An electrolytic cleaning liquid tank and a plating liquid tank are arranged below the liquid level adjustment tank, and each tank is provided with a freely movable receiving tank for selectively guiding the effluent from the liquid level adjustment tank. A driving means for switching the position of the receiving tank according to the process is provided, a pump is provided in the supply passage for selectively supplying each liquid of the electrolytic cleaning liquid tank and the plating liquid tank, and further cleaning water is selectively supplied. A plating device characterized by being equipped with a means. 2. The plating device according to claim 1, wherein the liquid level adjusting tank has an internal partition wall whose height can be adjusted via a liquid level adjusting plate. 3. The plating device according to claim 1 or 2, wherein the supply passage is formed through the inside of the electrode.