JPH0448699U - - Google Patents

Info

Publication number
JPH0448699U
JPH0448699U JP9144590U JP9144590U JPH0448699U JP H0448699 U JPH0448699 U JP H0448699U JP 9144590 U JP9144590 U JP 9144590U JP 9144590 U JP9144590 U JP 9144590U JP H0448699 U JPH0448699 U JP H0448699U
Authority
JP
Japan
Prior art keywords
integrated circuit
flat package
package integrated
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9144590U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9144590U priority Critical patent/JPH0448699U/ja
Publication of JPH0448699U publication Critical patent/JPH0448699U/ja
Pending legal-status Critical Current

Links

JP9144590U 1990-08-30 1990-08-30 Pending JPH0448699U (US20020193084A1-20021219-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9144590U JPH0448699U (US20020193084A1-20021219-M00002.png) 1990-08-30 1990-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9144590U JPH0448699U (US20020193084A1-20021219-M00002.png) 1990-08-30 1990-08-30

Publications (1)

Publication Number Publication Date
JPH0448699U true JPH0448699U (US20020193084A1-20021219-M00002.png) 1992-04-24

Family

ID=31827083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9144590U Pending JPH0448699U (US20020193084A1-20021219-M00002.png) 1990-08-30 1990-08-30

Country Status (1)

Country Link
JP (1) JPH0448699U (US20020193084A1-20021219-M00002.png)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837991A (ja) * 1981-08-31 1983-03-05 株式会社東芝 フラツトパツケ−ジ形電子部品の実装装置
JPS63242000A (ja) * 1987-03-28 1988-10-07 株式会社東芝 電子部品の実装方法
JPH0147085B2 (US20020193084A1-20021219-M00002.png) * 1980-08-13 1989-10-12 Bicc Plc

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0147085B2 (US20020193084A1-20021219-M00002.png) * 1980-08-13 1989-10-12 Bicc Plc
JPS5837991A (ja) * 1981-08-31 1983-03-05 株式会社東芝 フラツトパツケ−ジ形電子部品の実装装置
JPS63242000A (ja) * 1987-03-28 1988-10-07 株式会社東芝 電子部品の実装方法

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