JPH0448664U - - Google Patents
Info
- Publication number
- JPH0448664U JPH0448664U JP9009190U JP9009190U JPH0448664U JP H0448664 U JPH0448664 U JP H0448664U JP 9009190 U JP9009190 U JP 9009190U JP 9009190 U JP9009190 U JP 9009190U JP H0448664 U JPH0448664 U JP H0448664U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- circuit board
- plate portion
- plate part
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9009190U JPH0448664U (es) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9009190U JPH0448664U (es) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448664U true JPH0448664U (es) | 1992-04-24 |
Family
ID=31824539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9009190U Pending JPH0448664U (es) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448664U (es) |
-
1990
- 1990-08-30 JP JP9009190U patent/JPH0448664U/ja active Pending