JPH0448646U - - Google Patents
Info
- Publication number
- JPH0448646U JPH0448646U JP1990091449U JP9144990U JPH0448646U JP H0448646 U JPH0448646 U JP H0448646U JP 1990091449 U JP1990091449 U JP 1990091449U JP 9144990 U JP9144990 U JP 9144990U JP H0448646 U JPH0448646 U JP H0448646U
- Authority
- JP
- Japan
- Prior art keywords
- receiving element
- light receiving
- amplifier circuit
- electrode layer
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990091449U JPH0448646U (US06633782-20031014-M00005.png) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990091449U JPH0448646U (US06633782-20031014-M00005.png) | 1990-08-30 | 1990-08-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0448646U true JPH0448646U (US06633782-20031014-M00005.png) | 1992-04-24 |
Family
ID=31827094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990091449U Pending JPH0448646U (US06633782-20031014-M00005.png) | 1990-08-30 | 1990-08-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0448646U (US06633782-20031014-M00005.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008066583A (ja) * | 2006-09-08 | 2008-03-21 | Asahi Kasei Electronics Co Ltd | 光センサ |
-
1990
- 1990-08-30 JP JP1990091449U patent/JPH0448646U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008066583A (ja) * | 2006-09-08 | 2008-03-21 | Asahi Kasei Electronics Co Ltd | 光センサ |