JPH0448506A - Dielectric composite for film capacitor - Google Patents
Dielectric composite for film capacitorInfo
- Publication number
- JPH0448506A JPH0448506A JP2155302A JP15530290A JPH0448506A JP H0448506 A JPH0448506 A JP H0448506A JP 2155302 A JP2155302 A JP 2155302A JP 15530290 A JP15530290 A JP 15530290A JP H0448506 A JPH0448506 A JP H0448506A
- Authority
- JP
- Japan
- Prior art keywords
- film
- inorganic
- film capacitor
- dielectric
- ferroelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 39
- 239000002131 composite material Substances 0.000 title description 5
- 239000003989 dielectric material Substances 0.000 claims abstract description 18
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 22
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 13
- 229910002113 barium titanate Inorganic materials 0.000 claims description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract 2
- FHTQCUNSKSWOHF-UHFFFAOYSA-N ethyl carbamate;silicon Chemical compound [Si].CCOC(N)=O FHTQCUNSKSWOHF-UHFFFAOYSA-N 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 10
- 238000009413 insulation Methods 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、フィルムコンデンサに使用するフィルムコン
デンサ用誘電体組成物に関し、更に詳しくは、樹脂系の
基材と強誘電体配合物あるいは高誘電体配合物とからな
るフィルムコンデンサ用誘電体組成物の成分の内、特に
フィルムの物性の観点から樹脂系の基材に着目した改良
を行うことにより、得られるフィルムコンデンサの絶縁
性を特に顕著に増加させ得るフィルムコンデンサ用誘電
体組成物に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a dielectric composition for a film capacitor used in a film capacitor, and more specifically, a dielectric composition for a film capacitor that is composed of a resin base material and a ferroelectric compound or a high dielectric material. Among the components of the dielectric composition for film capacitors, which consists of a dielectric composition for film capacitors, the insulation properties of the resulting film capacitors are particularly improved by improving the resin base material from the viewpoint of the physical properties of the film. The present invention relates to a dielectric composition for film capacitors that can be increased.
[従来の技術]
従来、フィルムコンデンサ用誘電体フィルムとしては、
1比誘電率2〜5程度のものが広く使用されており、主
として樹脂系の基材からなるフィルムの高誘電率化を図
る目的で、チタン酸バリウム等の無機強誘電体あるいは
二酸化チタン等の無機高誘電体をフィルムに混合したも
のが検討されている。[Conventional technology] Conventionally, dielectric films for film capacitors include:
1, a dielectric constant of about 2 to 5 is widely used, and inorganic ferroelectric materials such as barium titanate or titanium dioxide, etc. are used to increase the dielectric constant of films mainly made of resin base materials. A film in which an inorganic high dielectric material is mixed is being considered.
例えば、特公昭59−15340号および特公昭59−
15341号には、単層または複数層の熱可塑性ポリマ
ーフィルムにチタン酸カルシウム等の強誘電体物質配合
物が含有せられた高誘電率フィルムが開示されている。For example, Special Publication No. 59-15340 and Special Publication No. 59-15340 and Special Publication No. 59-15340
No. 15341 discloses a high dielectric constant film comprising a single layer or multiple layers of a thermoplastic polymer film containing a ferroelectric material blend such as calcium titanate.
また特公昭61−5246号には、強誘電体物質含有層
のみからなるフィルムの延伸性の欠陥を改善し、優れた
高い誘電率を示す複合フィルムを提供する目的で、強誘
電体物質を含有しない熱可塑性ポリマー層と、積層後の
全フィルムに対する平均含有率が15fi量%以上とな
るように強誘電体物質を含有する熱可塑性ポリマー層と
の少なくとも各−層が積層され、−軸方向または二軸方
向に延伸された高誘電率複合フィルムが開示されている
。In addition, Japanese Patent Publication No. 5246/1983 discloses that a layer containing a ferroelectric material is used for the purpose of improving the stretching defects of a film consisting only of a layer containing a ferroelectric material and providing a composite film that exhibits an excellent high dielectric constant. and a thermoplastic polymer layer containing a ferroelectric material such that the average content of the total film after lamination is 15% by weight or more with respect to the total film. A biaxially stretched high dielectric constant composite film is disclosed.
フィルム基材と強誘電体配合物あるいは高誘電体配合物
との他の組合せとして、例えば特開昭60−17010
3号には、誘電率が14以上のプラスチックのバインダ
中に誘電率、が100以上の無機粉体を10〜90Vo
1%含有した複合物を誘電体としたコンデンサが開示さ
れ、また特開昭64−25406号には、光学的に異方
性の溶融相を形成する高分子液晶化合物に無機強誘電体
粉末を混合し成膜したコンデンサー用フィルムが開示さ
れている。Other combinations of a film base material and a ferroelectric compound or a high dielectric compound include, for example, Japanese Patent Application Laid-open No. 60-17010.
No. 3 contains inorganic powder with a dielectric constant of 100 or more in a plastic binder with a dielectric constant of 14 or more at 10 to 90 Vo.
A capacitor using a composite containing 1% as a dielectric is disclosed, and JP-A No. 64-25406 discloses a method in which an inorganic ferroelectric powder is added to a polymeric liquid crystal compound that forms an optically anisotropic melt phase. A mixed and formed capacitor film is disclosed.
更に、フィルム基材としてポリフェニレンオキサイドを
用い、高誘電体物質として表面処理を施したfl微粒子
酸化チタンを用い、高誘電体物質の表面処理によりプラ
スチック材料との密着性の向上や表面疎水性の付与を図
り、耐電圧や誘電正接等の電気特性を劣化させることな
く吸湿による容量変化を低く抑えることのできるフィル
ムコンデンサが、特開平1−130514号、特開平1
−130515号、並びに特開平1−130516号に
開示されている。Furthermore, we used polyphenylene oxide as the film base material and surface-treated fl fine particle titanium oxide as a high dielectric material, and by surface treatment of the high dielectric material, we improved the adhesion with plastic materials and imparted surface hydrophobicity. Film capacitors that can suppress capacitance changes due to moisture absorption without deteriorating electrical characteristics such as withstand voltage and dielectric loss tangent are disclosed in Japanese Patent Application Laid-Open No. 1-130514 and Japanese Patent Application Laid-open No. 1-130514.
-130515 and JP-A-1-130516.
しかしながら、フィルムコンデンサに関するこれらの従
来技術は、静電容量の増加すなわち誘電率の増加を主目
的とし、この観点からの性能向上に主眼が置かれていた
。このため、樹脂系の基材と強誘電体配合物あるいは高
誘電体配合物とからなるフィルムコンデンサ用誘電体組
成物の成分の内、強誘電体配合物あるいは高誘電体配合
物に着目した改良が多く、樹脂系の基材に着目して総合
的な観点からコンデンサ性能の向上を企図する試みは少
なかった。However, these conventional techniques related to film capacitors mainly aim at increasing capacitance, that is, increasing dielectric constant, and focus on improving performance from this perspective. Therefore, among the components of a dielectric composition for film capacitors consisting of a resin base material and a ferroelectric compound or a high dielectric compound, improvements have been made focusing on the ferroelectric compound or the high dielectric compound. However, there have been few attempts to improve capacitor performance from a comprehensive perspective by focusing on resin-based base materials.
主として強誘電体配合物あるいは高誘電体配合物に着目
した改良には限界があり、そのため特に無機強誘電体等
を含有させることにより、フィルム自体のフレキシブル
性が損われ、コンデンサへの成形が困誼になる欠点や、
絶縁性が低下する欠点があった。これを解決するために
は前記した特公昭61−5246号に記載された技術の
ように積層梢迫の複合フィルムとする手段もあるが、よ
り$純な単層#l造のフィルムにより目的を達成できれ
ば、工業生産の観点からは望ましい。There are limits to improvements that focus primarily on ferroelectric compounds or high dielectric compounds, and for this reason, especially when inorganic ferroelectrics are included, the flexibility of the film itself is impaired, making it difficult to form into capacitors. Detracting flaws,
There was a drawback that insulation properties deteriorated. In order to solve this problem, there is a method of using a composite film with a laminated top layer as described in the above-mentioned Japanese Patent Publication No. 61-5246, but it is possible to achieve the objective by using a simpler single-layer #l film. If this can be achieved, it would be desirable from the perspective of industrial production.
[発明が解決しようとする課U]
本発明は、樹脂系の基材と強誘電体配合物あるいは高誘
電体配合物とからなるフィルムコンデンサ用誘電体組成
物の成分の内、特にフィルムの物性の観点から樹脂系の
基材に着目した改良を行うことにより、フィルムのフレ
キシブル性が損われることなく、がっ絶縁性を十分に維
持し得るフィルムコンデンサを与えるフィルムコンデン
サ用誘電体組成物を提供することを目的とする。[Problem U to be Solved by the Invention] The present invention focuses on the physical properties of the film among the components of a dielectric composition for a film capacitor consisting of a resin base material and a ferroelectric compound or a high dielectric compound. Provides a dielectric composition for a film capacitor that provides a film capacitor that can maintain sufficient insulation properties without impairing the flexibility of the film, by improving the resin base material from the viewpoint of The purpose is to
[課題を解決するための手段]
本発明によれば、生餌にシロキサン結合を有するシリコ
ン系ウレタン樹脂に、無機強誘電体あるいは無機高誘電
体を50〜90重量%含有させたことを特徴とするフィ
ルムコンデンサ用誘電体組成物が提供される。[Means for Solving the Problems] According to the present invention, the raw bait is characterized in that the silicone-based urethane resin having a siloxane bond contains 50 to 90% by weight of an inorganic ferroelectric material or an inorganic high dielectric material. A dielectric composition for a film capacitor is provided.
無機強誘電体がチタン酸バリウムであれば好適である。It is preferable that the inorganic ferroelectric material is barium titanate.
無機高誘電体が二酸化チタンであれば好適である。It is preferable that the inorganic high dielectric material is titanium dioxide.
一般にフィルム中に無機強誘電体等を含有させると絶縁
性が低下するが、この現象は、フィルムと無機物との密
着性が悪いため、無m物の表面を電流が流れることに起
因すると考えられる。In general, when a film contains an inorganic ferroelectric material, its insulation properties decrease, but this phenomenon is thought to be caused by the current flowing on the surface of the inorganic material due to poor adhesion between the film and the inorganic material. .
本発明にあっては、樹脂系の基材と強誘電体配合物ある
いは高誘電体配合物とからなるフィルムコンデンサ用誘
電体組成物の成分の内、特にフィルムの物性の観点から
樹脂系の基材に着目した改良を行い、無機物との密着性
が高い主鎖にシロキサン結合を有するシリコン系ウレタ
ン樹脂を用い、これに無機強誘電体あるいは無機高誘電
体を50〜90重量%含有させた。In the present invention, among the components of a dielectric composition for a film capacitor consisting of a resin base material and a ferroelectric compound or a high dielectric compound, the resin base material is particularly selected from the viewpoint of the physical properties of the film. We made improvements focusing on the material, using a silicone urethane resin with a siloxane bond in the main chain that has high adhesion to inorganic materials, and containing 50 to 90% by weight of an inorganic ferroelectric material or an inorganic high dielectric material.
本発明によるシリコン系ウレタン樹脂をフィルムの基材
とすることにより、無機物との密着性が大幅に向上し、
たとえ従来のフィルムよりチタン酸バリウム等の配合物
の添加量を増加させても、優れた絶縁性を示す。By using the silicone-based urethane resin of the present invention as the base material of the film, the adhesion with inorganic substances is greatly improved.
It exhibits excellent insulation properties even when the amount of compounds such as barium titanate is increased compared to conventional films.
[発明の効果]
本発明によれば、樹脂系の基材と強誘電体配合物あるい
は高誘電体配合物とからなるフィルムコンデンサ用誘電
体組成物の成分の内、特にフィルムの物性の観点から樹
脂系の基材に着目した改良を行い、無機物との密着性が
高い主鎖にシロキサン結合を有するシリコン系ウレタン
樹脂を用い、これに無機強誘電体あるいは無機高誘電体
を50〜90重量%含有させることにより、フィルムの
フレキシブル性が損われることなく、かつ絶縁性を十分
に維持し得るフィルムコンデンサを与えるフィルムコン
デンサ用誘電体組成物が提供される・。[Effects of the Invention] According to the present invention, among the components of a dielectric composition for a film capacitor consisting of a resin base material and a ferroelectric compound or a high dielectric compound, particularly from the viewpoint of the physical properties of the film, We made improvements focusing on the resin base material, using a silicone urethane resin with a siloxane bond in the main chain that has high adhesion to inorganic materials, and adding 50 to 90% by weight of an inorganic ferroelectric material or an inorganic high dielectric material to this resin. There is provided a dielectric composition for a film capacitor that provides a film capacitor that can sufficiently maintain insulation properties without impairing the flexibility of the film.
[実施例]
以下に実施例により本発明を更に詳細に説明するが、本
発明は以下の実施例にのみ限定されるものではない。[Examples] The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited only to the following Examples.
シリコン系ウレタン樹脂としてにR−305(信越シリ
コーン)を用い、この樹脂中にチタン酸バリウム(Ba
Ti0slを含有させた際の含有率と比誘電率との関係
を第1図に示す。R-305 (Shin-Etsu Silicone) is used as the silicone urethane resin, and barium titanate (Ba
FIG. 1 shows the relationship between the content rate and relative dielectric constant when Ti0sl is contained.
第1図から、チタン酸バリウムの含有率が増加すると共
に比誘電率が増加する関係にあることが分る。この際、
比誘電率の増加は、チタン酸バリウム含有率が50%を
越える付近から顕著となるため、この程度以上のチタン
酸バリウムを含有させることが必要である。From FIG. 1, it can be seen that as the barium titanate content increases, the relative dielectric constant increases. On this occasion,
Since the relative permittivity increases significantly when the barium titanate content exceeds 50%, it is necessary to contain barium titanate in an amount higher than this level.
従来の樹脂系基材においては、チタン酸バリウムのよう
な無機強誘電体を高濃度で含有すると、フィルムの物性
低下が顕著であったが、本発明のフィルムに使用するシ
リコン系ウレタン樹脂にあっては、高濃度で含有させて
もそのような物性低下は起らず、フィルムのフレキシブ
ル性が維持される。In conventional resin-based base materials, when inorganic ferroelectric materials such as barium titanate were contained in high concentrations, the physical properties of the film deteriorated significantly, but this was not the case with the silicon-based urethane resin used in the film of this invention. Therefore, even if it is contained at a high concentration, such a decrease in physical properties does not occur, and the flexibility of the film is maintained.
信越シリコンKR−305(シリコン系ウレタンワニス
)樹脂中にチタン酸バリウム
(BaTi0i >を57%含有させたフィルムコンデ
ンサ用誘電体組成物を調製し、これを用いて常法により
フィルムを作成してフィルムコンデンサを製造した。A dielectric composition for film capacitors containing 57% barium titanate (BaTi0i) in Shin-Etsu Silicon KR-305 (silicon-based urethane varnish) resin was prepared, and a film was prepared using this in a conventional manner. Manufactured capacitors.
犬1自肌l
信越シリコンにR−305(シリコン系ウレタンワニス
)樹脂中にチタン酸バリウム
(BaTi0i )を89%含有させたフィルムコンデ
ンサ用誘電体組成物を翻製し、これを用いて常法により
フィルムを作成してフィルムコンデンサを製造した。A dielectric composition for film capacitors containing 89% of barium titanate (BaTi0i) in R-305 (silicon-based urethane varnish) resin was manufactured using Shin-Etsu Silicon, and using this, a conventional method was used. A film was prepared using the method described above, and a film capacitor was manufactured.
ル較凰ユ
ポリイミド(ポリ(4,4°−オキシジーP−フェニレ
ンピロメリトイミド)樹脂中にチタン酸バリウム(Ba
Ti0i )を51%含有させたフィルムコンデンサ用
誘電体組成物を調製し、これを用いて常法によりフィル
ムを作成してフィルムコンデンサを製造した。Barium titanate (Ba
A dielectric composition for a film capacitor containing 51% of TiOi ) was prepared, and a film was formed using this in a conventional manner to produce a film capacitor.
ル較■ユ
ポリエチレンテレフタレート樹脂中に二酸化チタンを4
7%含有させたフィルムコンデンサ用誘電体組成物を調
製し、これを用いて常法によりフィルムを作成してフィ
ルムコンデンサを製造した。Comparison ■4 titanium dioxide in polyethylene terephthalate resin
A dielectric composition for a film capacitor containing 7% of the dielectric composition was prepared, and a film was prepared using this in a conventional manner to produce a film capacitor.
A棟ユ茗上
実施例1および2、比較例1および2によるフィルムコ
ンデンサ用フィルムについて、漏れ電流の試験による絶
縁性試験を行った。A leakage current test was conducted on the films for film capacitors according to Examples 1 and 2 and Comparative Examples 1 and 2.
漏れ電流の試験は、前記各フィルム試料(面積4C11
2>に対し、定電圧電源により電4 。The leakage current test was conducted using each film sample (area 4C11
2>, the voltage is 4 by a constant voltage power supply.
圧50Vを印加後、1分経過時点における漏れt?L値
を測定することにより行った。結果を第1表に示す。Leakage t? 1 minute after applying a pressure of 50V? This was done by measuring the L value. The results are shown in Table 1.
墓工羞
フィルムの厚さ 漏れ電流
一仁L1」−工m工
実施例1 19.3 1.1実施例2
39.5 0.7比較例1 19.8
98.4比較例2 20.6 10
9.6以上の結果から、本発明によるフィルムコンデン
サ用誘電体組成物は、フィル、ムのフレキシブル性が損
われることなく、かつ絶縁性を十分に維持し得るフィル
ムコンデンサを与えることが分る。Thickness of tombstone film Leakage current L1 - Construction Example 1 19.3 1.1 Example 2
39.5 0.7 Comparative Example 1 19.8
98.4 Comparative Example 2 20.6 10
From the results of 9.6 and above, it can be seen that the dielectric composition for a film capacitor according to the present invention provides a film capacitor that can maintain sufficient insulation properties without impairing the flexibility of the film.
第1図は、シリコン系ウレタン樹脂としてKR−305
(信越シリコーン)を用い、この樹脂中にチタン酸バリ
ウム(8aTi03)を含有させた際の含有率と比誘電
率との開隔を示す図である。Figure 1 shows KR-305 as a silicone urethane resin.
(Shin-Etsu Silicone) is used and barium titanate (8aTi03) is contained in this resin. It is a diagram showing the gap between the content rate and the relative dielectric constant.
Claims (3)
ン樹脂に、無機強誘電体あるいは無機高誘電体を50〜
90重量%含有させたことを特徴とするフィルムコンデ
ンサ用誘電体組成物。(1) Add 50 to 50% of inorganic ferroelectric material or inorganic high dielectric material to silicone urethane resin having siloxane bonds in the main chain.
A dielectric composition for a film capacitor, characterized in that it contains 90% by weight.
記載のフィルムコンデンサ用誘電体組成物。(2) Claim 1 wherein the inorganic ferroelectric material is barium titanate.
The dielectric composition for a film capacitor as described above.
のフィルムコンデンサ用誘電体組成物。(3) The dielectric composition for a film capacitor according to claim 1, wherein the inorganic high dielectric material is titanium dioxide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2155302A JPH0448506A (en) | 1990-06-15 | 1990-06-15 | Dielectric composite for film capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2155302A JPH0448506A (en) | 1990-06-15 | 1990-06-15 | Dielectric composite for film capacitor |
Publications (1)
Publication Number | Publication Date |
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JPH0448506A true JPH0448506A (en) | 1992-02-18 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2155302A Pending JPH0448506A (en) | 1990-06-15 | 1990-06-15 | Dielectric composite for film capacitor |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007019327A (en) * | 2005-07-08 | 2007-01-25 | Kansai Electric Power Co Inc:The | High heat-resistant film capacitor |
WO2019146755A1 (en) * | 2018-01-25 | 2019-08-01 | 株式会社村田製作所 | Film capacitor, and outer case for film capacitor |
-
1990
- 1990-06-15 JP JP2155302A patent/JPH0448506A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007019327A (en) * | 2005-07-08 | 2007-01-25 | Kansai Electric Power Co Inc:The | High heat-resistant film capacitor |
JP4530927B2 (en) * | 2005-07-08 | 2010-08-25 | 関西電力株式会社 | High heat resistance film capacitor |
WO2019146755A1 (en) * | 2018-01-25 | 2019-08-01 | 株式会社村田製作所 | Film capacitor, and outer case for film capacitor |
WO2019146751A1 (en) * | 2018-01-25 | 2019-08-01 | 株式会社村田製作所 | Film capacitor, and exterior case for film capacitor |
CN111557037A (en) * | 2018-01-25 | 2020-08-18 | 株式会社村田制作所 | Film capacitor and outer case for film capacitor |
JPWO2019146751A1 (en) * | 2018-01-25 | 2020-10-22 | 株式会社村田製作所 | Film capacitors and exterior cases for film capacitors |
JPWO2019146755A1 (en) * | 2018-01-25 | 2020-10-22 | 株式会社村田製作所 | Film capacitors and exterior cases for film capacitors |
US11437190B2 (en) | 2018-01-25 | 2022-09-06 | Murata Manufacturing Co., Ltd. | Film capacitor, and exterior case for film capacitor |
US11791099B2 (en) | 2018-01-25 | 2023-10-17 | Murata Manufacturing Co., Ltd. | Film capacitor, and outer case for film capacitor |
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