JPH0448265U - - Google Patents
Info
- Publication number
- JPH0448265U JPH0448265U JP8901790U JP8901790U JPH0448265U JP H0448265 U JPH0448265 U JP H0448265U JP 8901790 U JP8901790 U JP 8901790U JP 8901790 U JP8901790 U JP 8901790U JP H0448265 U JPH0448265 U JP H0448265U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- glow discharge
- discharge decomposition
- conductive film
- decomposition apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 3
Landscapes
- Chemical Vapour Deposition (AREA)
Description
第１図は本考案グロー放電分解装置の反応室の
破砕断面図、第２図は第１図におけるＹ−Ｙ′切
断面線での概略断面図、第３図は本考案の他の実
施例を示す分解斜視図、第４図は従来のグロー放
電分解装置の反応室の一部破断面図、第５図は第
４図におけるＸ−Ｘ′切断面線での概略断面図で
ある。
１ａ，１ｂ……反応室、２，２ａ……円筒体、
３……支持体、４……ダミーリング、５，５ａ，
５ｂ，５ｃ……一方電極、６……他方電極、７…
…導入口、８，８ａ……導電性フイルム部材、９
……固定材。
Fig. 1 is a fragmented sectional view of the reaction chamber of the glow discharge decomposition device of the present invention, Fig. 2 is a schematic sectional view taken along the Y-Y' section line in Fig. 1, and Fig. 3 is another embodiment of the present invention. FIG. 4 is a partially cutaway sectional view of a reaction chamber of a conventional glow discharge decomposition apparatus, and FIG. 5 is a schematic sectional view taken along the line X-X' in FIG. 4. 1a, 1b... reaction chamber, 2, 2a... cylindrical body,
3... Support body, 4... Dummy ring, 5, 5a,
5b, 5c...one electrode, 6...other electrode, 7...
...Introduction port, 8, 8a... Conductive film member, 9
...fixing material.
Claims (1)
上記円筒体の端部に導電性フイルム部材で覆つた
ダミーリングを配置したことを特徴とするグロー
放電分解装置。 A glow discharge decomposition apparatus characterized in that a dummy ring covered with a conductive film member is disposed at the end of the cylindrical body to uniformly form a semiconductor film on the outer peripheral surface of the cylindrical body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8901790U JPH0448265U (en) | 1990-08-23 | 1990-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8901790U JPH0448265U (en) | 1990-08-23 | 1990-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448265U true JPH0448265U (en) | 1992-04-23 |
Family
ID=31822708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8901790U Pending JPH0448265U (en) | 1990-08-23 | 1990-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448265U (en) |
-
1990
- 1990-08-23 JP JP8901790U patent/JPH0448265U/ja active Pending