JPH044775U - - Google Patents

Info

Publication number

JPH044775U

JPH044775U JP4354790U JP4354790U JPH044775U JP H044775 U JPH044775 U JP H044775U JP 4354790 U JP4354790 U JP 4354790U JP 4354790 U JP4354790 U JP 4354790U JP H044775 U JPH044775 U JP H044775U

Authority

JP

Japan

Prior art keywords

circuit board

printed circuit

foil pattern

copper foil

copper plate

Prior art date

1990-04-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
• 239000011889 copper foil Substances 0.000 claims description 9
• 229910052802 copper Inorganic materials 0.000 claims description 6
• 239000010949 copper Substances 0.000 claims description 6
• 238000010586 diagram Methods 0.000 description 1
• 239000012212 insulator Substances 0.000 description 1

Cited By (1)