JPH0447369B2 - - Google Patents
Info
- Publication number
- JPH0447369B2 JPH0447369B2 JP57025714A JP2571482A JPH0447369B2 JP H0447369 B2 JPH0447369 B2 JP H0447369B2 JP 57025714 A JP57025714 A JP 57025714A JP 2571482 A JP2571482 A JP 2571482A JP H0447369 B2 JPH0447369 B2 JP H0447369B2
- Authority
- JP
- Japan
- Prior art keywords
- head
- thin
- film
- magnetic head
- film magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 27
- 230000005291 magnetic effect Effects 0.000 claims description 19
- 238000005498 polishing Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000001939 inductive effect Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005294 ferromagnetic effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/488—Disposition of heads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
本発明は薄膜磁気ヘツド、特に書込み専用薄膜
磁気ヘツドと読出し専用薄膜磁気ヘツドを上下に
重ねて成る２階建薄膜磁気ヘツド（以下２階建ヘ
ツドと呼ぶ）の製造プロセス中に用いられる位置
合せマークに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a process for manufacturing a thin-film magnetic head, particularly a two-story thin-film magnetic head (hereinafter referred to as a two-story head) consisting of a write-only thin-film magnetic head and a read-only thin-film magnetic head stacked one above the other. This relates to alignment marks used in the process.
第１図Ａに上述した様な２階建ヘツドの一例の
概略断面図を示す。ここで基板１１上に絶縁層１
２を成膜した後、軟磁性体より成る下部ポール１
３を形成する。ついでギヤツプとなる所定膜厚の
絶縁層１４を成膜し、焼締めフオトレジスト層１
６，１８およびコイル１７を形成するその後、軟
磁性体より成る上部ポール１５を形成し、端子部
（図示せず）に銅メツキを、30μｍ程度メツキし
絶縁層より成る保護膜２５を成膜する。以上のプ
ロセスによりこの例においては８ターンのインダ
クテイブ書込み専用薄膜磁気ヘツドが形成され
る。その後、端子部の銅メツキ部が十分露出する
まで研磨により保護膜２６をラツプして平面状に
仕上げ、この上に前記書込み専用薄膜磁気ヘツド
と同様にして下部ポール１９、コイル２３あるい
は上部ポール２１等を形成し図では13ターンのイ
ンダクテイブ読出し専用薄膜磁気ヘツドが形成さ
れる。 FIG. 1A shows a schematic cross-sectional view of an example of a two-story head such as that described above. Here, an insulating layer 1 is placed on a substrate 11.
2, the lower pole 1 made of soft magnetic material is formed.
form 3. Next, an insulating layer 14 with a predetermined thickness that forms a gap is formed, and the photoresist layer 1 is baked and tightened.
6, 18 and the coil 17. After that, the upper pole 15 made of a soft magnetic material is formed, and the terminal part (not shown) is plated with copper to a thickness of about 30 μm, and a protective film 25 made of an insulating layer is formed. . Through the above process, an 8-turn inductive write-only thin film magnetic head is formed in this example. Thereafter, the protective film 26 is lapped by polishing until the copper-plated part of the terminal part is fully exposed, finishing it into a flat surface. In the figure, a 13-turn inductive read-only thin film magnetic head is formed.
以上述べてきた２階建ヘツドにおいては、ひと
つのトランスデユーサーによつて読出し、書込み
を行なう必然がなく、各々の機能に合せてトラン
スデユーサーを最適設計出来、しかも書込み専用
薄膜磁気ヘツドで記録した情報を即座に読出し専
用薄膜磁気ヘツドで再生し、記録された情報のチ
エツクが行なえるなどの利点が実現されるが、こ
の様な２階建ヘツドの製造プロセス上の１つの大
きな問題は、上部、下部２つのヘツドすなわち書
込み専用薄膜磁気ヘツドおよび読出し専用薄膜磁
気ヘツドの位置を正確に一致させることが困難で
あるということである。つまり上、下両ヘツドの
ポールハイトゼロラインが第１図Ａ中央印Ａ−Ａ
で示した如く一致していること、更に、浮揚面側
から見た場合上、下両ヘツドの上下両ポール１
３，１５又は２０，２５のトラツク巾方向の中心
線が第１図Ｂ中矢印Ｂ−Ｂで示した如く一致して
いることが必要であるということである。もし両
ヘツドの位置がズレて形成されれば２階建ヘツド
の持つ意味は半減せざるをえず、前述した通り、
上、下両ヘツドの位置合せを、いかにして正確か
つ容易に行なうかが、プロセス上極めて大きな問
題である。しかも２階建ヘツドでは下部ヘツドの
保護膜となる絶縁層２５を成膜し平面研磨した後
では、この絶縁層２５が少なくとも20ミクロンも
あり顕微鏡に焦点深度の関係でこの絶縁層２５の
下部にある目合せマークを見ることができず、こ
の様な目合せマークを頼りに上部ヘツドの位置を
規定することは事実上不可能である。 In the two-story head described above, it is not necessary to read and write with a single transducer, and the transducer can be optimally designed to suit each function, and moreover, it is possible to record with a write-only thin-film magnetic head. Although the advantages such as being able to immediately reproduce recorded information on a read-only thin-film magnetic head and checking the recorded information are realized, one major problem in the manufacturing process of such a double-decker head is that It is difficult to precisely align the positions of the upper and lower two heads, the write-only thin-film magnetic head and the read-only thin-film magnetic head. In other words, the pole height zero line of both the upper and lower heads is marked A-A in the center of Figure 1A.
In addition, both upper and lower poles 1 of both upper and lower heads when viewed from the floating surface side.
It is necessary that the center lines of the tracks 3, 15 or 20, 25 in the track width direction coincide as shown by the arrow B--B in FIG. 1B. If the positions of both heads are shifted, the meaning of the two-story head will be halved, and as mentioned above,
How to accurately and easily align the upper and lower heads is an extremely important problem in the process. Moreover, in the case of a two-story head, after the insulating layer 25 that serves as a protective film for the lower head is formed and the surface is polished, the insulating layer 25 is at least 20 microns thick, and due to the depth of focus of the microscope, the lower part of the insulating layer 25 is Certain alignment marks cannot be seen and it is virtually impossible to rely on such alignment marks to define the position of the upper head.
本発明の目的は以上述べてきた２階建ヘツドの
上、下両ヘツドの位置を正確かつ容易に一致させ
る為の目合せマークを提供せんとするものであ
る。 SUMMARY OF THE INVENTION An object of the present invention is to provide alignment marks for accurately and easily aligning the positions of the upper and lower heads of the above-mentioned two-story head.
本発明によれば、書込み専用薄膜磁気ヘツドと
読出し専用薄膜磁気ヘツドとを集積化薄膜技術を
用いて基板の上部及び下部に重ねて成る薄膜磁気
ヘツドにおいて、前記上部ヘツドを形成する際の
位置合せマークが、前記下部ヘツドを所定プロセ
スにより形成する際に、あらかじめ前記基板上に
形成された端子上にメツキにより形成された厚膜
パターンに対して、この厚膜パターン上に機械的
に形成され、且つ前記下部ヘツドのポールに対し
て所定の位置関係を有した溝よりなることを特徴
とする薄膜磁気ヘツド用位置合せマークが得られ
る。 According to the present invention, in a thin film magnetic head in which a write-only thin film magnetic head and a read-only thin film magnetic head are stacked on top and bottom of a substrate using integrated thin film technology, alignment when forming the upper head is performed. A mark is mechanically formed on a thick film pattern formed by plating on a terminal previously formed on the substrate when forming the lower head by a predetermined process, In addition, there is obtained an alignment mark for a thin film magnetic head, which is characterized by being composed of a groove having a predetermined positional relationship with respect to the pole of the lower head.
または、前記厚膜パターン上に形成される前記
溝の深さＤが、下部ヘツドの保護膜形成後の平面
研磨時の、前記厚膜パターンの研磨量Ｐより大な
ることを特徴とする薄膜磁気ヘツド用位置合せマ
ークが得られる。 Alternatively, the depth D of the groove formed on the thick film pattern is greater than the polishing amount P of the thick film pattern during surface polishing after forming a protective film on the lower head. An alignment mark for the head is obtained.
以下に本発明の実施例について図面を参照しな
がら説明する。 Embodiments of the present invention will be described below with reference to the drawings.
尚、以下の説明においては位置合せマークとな
る厚膜パターンと端子とを兼用した例を示す
前述した様に第１図に示したような２階建ヘツ
ドはまず下部ヘツド（第１図では８ターンインダ
クテイブ書込み専用ヘツド）が周知のプロセス、
すなわち基板１１上に絶縁層１２を成膜しついで
軟磁性体より成る下部ポール１３を形成し、更に
ギヤツプとなる絶縁層１４が形成される。ついで
焼締めフオトレジスト層１６，１８およびコイル
１７を形成する。その後、軟磁性体より成る上部
ポール１５を形成し、第１図には図示されていな
いが、端子部に銅メツキを少なくとも30μｍ程度
メツキする。この様な状態にある下部ヘツドの概
略平面図を第２図Ａに示す。第２図Ａにおいて３
１は焼締めフオトレジスト層、３３および３５は
焼締めフオトレジスト層中に形成されたコイルの
一部であり３２は上部ポールである。更に３４，
３６はコイル端子部に30μｍ程度メツキされた銅
の厚膜パターンである。ここでこの銅メツキ膜３
４，３６上にポール３２の中心点を基準としてポ
ールの長手方向に対して所定の距離L1、これと
直交する方向に対して所定の距離L2の位置に第
２図Ａ中斜線で示した様にダイシングソーにより
溝加工を施こす。この状態を第２図Ａ中Ｘ−Ｘ部
の概略断面図で第３図Ａに示す。第３図Ａにおい
て端子４２上にメツキにより形成された銅厚膜パ
ターン４３に対して幅Ｗ、深さＤの溝がダイシン
グソーを用いて形成されている。その後、絶縁層
より成る保護膜４４が成膜され、上部ヘツドを形
成する為研磨を行ない表面を平面化する。この状
態を第３図Ｂに示す。 In addition, in the following explanation, an example will be shown in which the thick film pattern serving as the alignment mark also serves as the terminal.As mentioned above, the two-story head as shown in Fig. (turn inductive write-only head) is a well-known process,
That is, an insulating layer 12 is formed on a substrate 11, a lower pole 13 made of a soft magnetic material is formed, and an insulating layer 14 serving as a gap is further formed. Then, the hardened photoresist layers 16 and 18 and the coil 17 are formed. Thereafter, an upper pole 15 made of a soft magnetic material is formed, and although not shown in FIG. 1, the terminal portion is plated with copper to a thickness of at least 30 μm. A schematic plan view of the lower head in such a state is shown in FIG. 2A. 3 in Figure 2A
1 is a hardened photoresist layer, 33 and 35 are parts of a coil formed in the hardened photoresist layer, and 32 is an upper pole. 34 more,
36 is a thick copper film pattern plated to a thickness of about 30 μm on the coil terminal portion. Here, this copper plating film 3
4, 36 at a predetermined distance L 1 in the longitudinal direction of the pole from the center point of the pole 32 and a predetermined distance L 2 in the direction orthogonal thereto, indicated by diagonal lines in FIG. 2A. Use a dicing saw to create grooves in the same way. This state is shown in FIG. 3A, which is a schematic sectional view taken along line XX in FIG. 2A. In FIG. 3A, a groove having a width W and a depth D is formed using a dicing saw in a thick copper film pattern 43 formed on a terminal 42 by plating. Thereafter, a protective film 44 made of an insulating layer is formed, and the surface is planarized by polishing to form an upper head. This state is shown in FIG. 3B.
第３図Ｂにおいて破線は保護膜４４が成膜され
たままの状態を示しており、その後既に述べた通
り研磨により平面化されメツキによる銅厚膜パタ
ーン４３の一部が露出することとなる。この時銅
厚膜パターンの研磨量Ｐと、溝深さＤとの間にＤ
＜P.なる関係があれば、この溝が研磨面上にあら
われ、この溝を目合せマークとして上部ヘツドが
形成されることとなる。すなわち、この溝と下部
ヘツドのポールとの位置関係をふまえて上部ヘツ
ド形成用のフオトマスクを構成し、上部ヘツドの
下部ポール形成用フオトマスク上に、前記溝に一
致する所定形状のパターンを配置し、かつ前記所
定形状のパターンと前記下部ポールパターンの位
置関係が、下部ヘツドとポールと前記溝との位置
関係と同一の位置関係である様に形成しておけ
ば、前記所定形状のパターンを溝に一致させるこ
とにより上部ヘツドを下部ヘツドに対して正確に
位置合せすることが可能となる。 In FIG. 3B, the broken line indicates the state in which the protective film 44 is left as it is formed, and then, as described above, it is polished to be planarized and a part of the copper thick film pattern 43 formed by plating is exposed. At this time, there is a difference between the polishing amount P of the copper thick film pattern and the groove depth D.
If there is a relationship such as <P., this groove will appear on the polishing surface, and the upper head will be formed using this groove as an alignment mark. That is, a photomask for forming the upper head is constructed based on the positional relationship between the groove and the pole of the lower head, and a pattern of a predetermined shape matching the groove is arranged on the photomask for forming the lower pole of the upper head. In addition, if the pattern of the predetermined shape and the lower pole pattern are formed in the same positional relationship as the positional relationship of the lower head, the pole, and the groove, the pattern of the predetermined shape can be formed in the groove. This alignment allows for accurate alignment of the upper head with respect to the lower head.
以上述べてきた様な下部ヘツドの保護膜形成後
の平面研磨によつてあらわれてくる位置合せマー
クを用いることにより、上部、下部両ヘツドの位
置合せを正確かつ容易に行なうことが可能となり
本発明によつてもたらされる効果は２階建ヘツド
の製造プロセス上極めて大きなものと言わざるを
えない。 By using the alignment marks that appear by surface polishing after forming the protective film on the lower head as described above, it is possible to accurately and easily align both the upper and lower heads, and the present invention It must be said that the effect brought about by this is extremely significant in terms of the manufacturing process of the two-story head.
尚、以上の説明においては第２図Ａに示した様
に、２つの銅厚膜パターン３４，３６上に前述の
所定位置関係に対応する溝を１本づつ加工するの
ではなく、例えば第２図Ｂ３６の如く、１つの銅
厚膜パターン上に十字型に溝を形成しても本発明
の意とするところは何ら損われず、又位置合せマ
ークとなる厚膜パターンと端子とが兼用されず
に、ウエハー上の所定位置に形成された厚膜パタ
ーンに対して溝加工を施しても良いことは当然で
ある。 In the above explanation, as shown in FIG. 2A, instead of forming grooves one by one on the two thick copper film patterns 34 and 36 corresponding to the above-mentioned predetermined positional relationship, for example, the second As shown in FIG. B36, even if a cross-shaped groove is formed on one copper thick film pattern, the spirit of the present invention is not impaired in any way, and the thick film pattern serving as an alignment mark also serves as a terminal. Of course, it is also possible to perform groove processing on a thick film pattern formed at a predetermined position on a wafer.
更に、第１図では下部ヘツドが書込み専用薄膜
ヘツドであり、上部ヘツドが読出し専用薄膜ヘツ
ドである例を示したが、逆の構成、即ち下部ヘツ
ドが読出し専用薄膜ヘツドであり、上部ヘツドが
書込み専用薄膜ヘツドであつても良い。又、読出
し専用薄膜ヘツドとしてインダクテイブヘツドの
例を示したが、これに限るわけではなく、例えば
金属強磁性体薄膜の磁気抵抗効果を用いた、所謂
磁気抵抗効果ヘツドあるいは半導体もしくは金属
強磁性体薄膜のホール効果を用いた所謂ホールヘ
ツドであつても良いことは明らかである。 Furthermore, although FIG. 1 shows an example in which the lower head is a write-only thin-film head and the upper head is a read-only thin-film head, the reverse configuration is possible, ie, the lower head is a read-only thin-film head and the upper head is a write-only thin-film head. It may also be a dedicated thin film head. Although an example of an inductive head is shown as a read-only thin film head, the present invention is not limited to this. For example, a so-called magnetoresistive head that uses the magnetoresistive effect of a metal ferromagnetic thin film, or a semiconductor or metal ferromagnetic head is used. It is clear that a so-called Hall head using the Hall effect of a body thin film may also be used.
第１図は２階建ヘツドの一例を示す概略断面
図、第２図、第３図は本発明の実施例を説明する
為の図面である。
１１，４１……基板、１２，１４，２０……絶
縁層、１３，１９……下部ポール、１６，１８，
２２，２４，３１……焼締めフオトレジスト層、
１５，２１，３２……上部ポール、１７，２３，
３３，３５……コイル、２５，２６，４４……保
護膜、３４，３６，４３……厚膜パターン、４２
……端子。
FIG. 1 is a schematic sectional view showing an example of a two-story head, and FIGS. 2 and 3 are drawings for explaining an embodiment of the present invention. 11, 41... Substrate, 12, 14, 20... Insulating layer, 13, 19... Lower pole, 16, 18,
22, 24, 31... Baking photoresist layer,
15, 21, 32... Upper pole, 17, 23,
33, 35... Coil, 25, 26, 44... Protective film, 34, 36, 43... Thick film pattern, 42
...Terminal.
Claims (1)
磁気ヘツドとを集積化薄膜技術を用いて基板の上
部及び下部に重ねて成る薄膜磁気ヘツドにおい
て、前記上部ヘツドを形成する際の位置合せマー
クが、前記下部ヘツドを所定プロセスにより形成
する際に、あらかじめ前記基板上に形成された端
子上にメツキにより形成された厚膜パターンに対
して、この厚膜パターン上に機械的に形成され、
且つ前記下部ヘツドのポールに対して所定の位置
関係を有した溝よりなることを特徴とする薄膜磁
気ヘツド用位置合せマーク。 ２ 厚膜パターン上に形成される溝の深さＤが、
下部ヘツドの保護膜形成後の平面研磨時の、前記
厚膜パターンの研磨量Ｐより大なることを特徴と
する特許請求の範囲第１項記載の薄膜磁気ヘツド
用位置合せマーク。[Scope of Claims] 1. In a thin-film magnetic head in which a write-only thin-film magnetic head and a read-only thin-film magnetic head are stacked on top and bottom of a substrate using integrated thin-film technology, the position when forming the upper head; When the lower head is formed by a predetermined process, the alignment mark is mechanically formed on the thick film pattern formed by plating on the terminal previously formed on the substrate. ,
An alignment mark for a thin film magnetic head, further comprising a groove having a predetermined positional relationship with respect to the pole of the lower head. 2 The depth D of the groove formed on the thick film pattern is
2. The alignment mark for a thin film magnetic head according to claim 1, wherein the polishing amount P of the thick film pattern is greater than the polishing amount P of the thick film pattern during surface polishing after forming a protective film on the lower head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2571482A JPS58143415A (en) | 1982-02-19 | 1982-02-19 | Positioning mark for thin-film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2571482A JPS58143415A (en) | 1982-02-19 | 1982-02-19 | Positioning mark for thin-film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58143415A JPS58143415A (en) | 1983-08-26 |
| JPH0447369B2 true JPH0447369B2 (en) | 1992-08-03 |
Family
ID=12173454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2571482A Granted JPS58143415A (en) | 1982-02-19 | 1982-02-19 | Positioning mark for thin-film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58143415A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4298569B2 (en) | 2004-04-06 | 2009-07-22 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | Thin film magnetic head and head gimbal assembly |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575877U (en) * | 1980-06-12 | 1982-01-12 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167026U (en) * | 1980-05-13 | 1981-12-10 |
-
1982
- 1982-02-19 JP JP2571482A patent/JPS58143415A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575877U (en) * | 1980-06-12 | 1982-01-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58143415A (en) | 1983-08-26 |
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