JPH0446543U - - Google Patents
Info
- Publication number
- JPH0446543U JPH0446543U JP1990089048U JP8904890U JPH0446543U JP H0446543 U JPH0446543 U JP H0446543U JP 1990089048 U JP1990089048 U JP 1990089048U JP 8904890 U JP8904890 U JP 8904890U JP H0446543 U JPH0446543 U JP H0446543U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal wire
- thin metal
- lead base
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/5363—
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- H10W72/5449—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089048U JPH0446543U (index.php) | 1990-08-24 | 1990-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089048U JPH0446543U (index.php) | 1990-08-24 | 1990-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446543U true JPH0446543U (index.php) | 1992-04-21 |
Family
ID=31822753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990089048U Pending JPH0446543U (index.php) | 1990-08-24 | 1990-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446543U (index.php) |
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1990
- 1990-08-24 JP JP1990089048U patent/JPH0446543U/ja active Pending