JPH0446540U - - Google Patents
Info
- Publication number
- JPH0446540U JPH0446540U JP8928590U JP8928590U JPH0446540U JP H0446540 U JPH0446540 U JP H0446540U JP 8928590 U JP8928590 U JP 8928590U JP 8928590 U JP8928590 U JP 8928590U JP H0446540 U JPH0446540 U JP H0446540U
- Authority
- JP
- Japan
- Prior art keywords
- oil passage
- oil
- wafer processing
- wafer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 238000001312 dry etching Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Description
第1図は本考案の1実施例を示す断面概略図、
第2図は同前平面図、第3図、第4図は従来例の
1つを示すもので第3図は第4図のA−A矢視図
、第4図は第2図のB−B矢視図、第5図、第6
図は他の従来例を示すもので、第5図は第6図の
C−C矢視図、第6図は第5図のD−D矢視図で
ある。
7は電極板、21はウエーハ、31,32は伝
熱盤、33は流油路、39は配管、42は熱交換
器、43はヒータを示す。
FIG. 1 is a cross-sectional schematic diagram showing one embodiment of the present invention;
Fig. 2 is a front plan view of the same, Fig. 3 and Fig. 4 show one of the conventional examples, Fig. 3 is a view taken along arrow A-A in Fig. 4, and Fig. 4 is a view taken from B in Fig. 2. -B arrow view, Figure 5, Figure 6
The figures show another conventional example, in which FIG. 5 is a view along the line CC in FIG. 6, and FIG. 6 is a view along the line D-D in FIG. 7 is an electrode plate, 21 is a wafer, 31 and 32 are heat transfer plates, 33 is an oil passage, 39 is a pipe, 42 is a heat exchanger, and 43 is a heater.
Claims (1)
エーハ処理装置の電極に於いて、ウエーハが載置
される電極板を伝熱盤に取付け、該伝熱盤に流油
路を形成し、該流油路に熱媒体用油を循環流通さ
せる様にすると共に油循環路に冷却、加熱器を設
けたことを特徴とするウエーハ処理装置の電極。 In electrodes of wafer processing equipment that performs processes such as dry etching and CVD, an electrode plate on which a wafer is placed is attached to a heat transfer plate, an oil passage is formed on the heat exchange plate, and an oil passage is formed in the oil passage. An electrode for a wafer processing apparatus, characterized in that a heating medium oil is circulated and a cooling/heating device is provided in the oil circulation path.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8928590U JPH0446540U (en) | 1990-08-27 | 1990-08-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8928590U JPH0446540U (en) | 1990-08-27 | 1990-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0446540U true JPH0446540U (en) | 1992-04-21 |
Family
ID=31823163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8928590U Pending JPH0446540U (en) | 1990-08-27 | 1990-08-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0446540U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156830A (en) * | 2004-11-30 | 2006-06-15 | Mitsubishi Heavy Ind Ltd | Deposition apparatus and its manufacturing method |
-
1990
- 1990-08-27 JP JP8928590U patent/JPH0446540U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156830A (en) * | 2004-11-30 | 2006-06-15 | Mitsubishi Heavy Ind Ltd | Deposition apparatus and its manufacturing method |
JP4533732B2 (en) * | 2004-11-30 | 2010-09-01 | 三菱重工業株式会社 | Film forming apparatus and manufacturing method thereof |
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