JPH044591A - Method and device for induction heating - Google Patents
Method and device for induction heatingInfo
- Publication number
- JPH044591A JPH044591A JP10381490A JP10381490A JPH044591A JP H044591 A JPH044591 A JP H044591A JP 10381490 A JP10381490 A JP 10381490A JP 10381490 A JP10381490 A JP 10381490A JP H044591 A JPH044591 A JP H044591A
- Authority
- JP
- Japan
- Prior art keywords
- heating
- heated
- induction heating
- coils
- solenoid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 86
- 230000006698 induction Effects 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 239000000969 carrier Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、誘導加熱装置および誘導加熱方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an induction heating device and an induction heating method.
誘導加熱装置は、交流磁界によって被加熱物内に発生さ
せた渦電流損により、金属・カーボン・シリコン・ゲル
マニウム・溶融ガラスなどを加熱する装置である。従来
、被加熱物が板状の物の場合には、第４図のように、面
内で蛇行した二つの加熱コイル８Ａ、８Ｂを直列接続し
、さらに、互いのコイル面を向かい合わせて配置し−そ
の間隙に板状の被加熱物４Ａを設置し、コイルの両端に
誘導加熱電源３Ｂを接続して加熱を行っている。An induction heating device is a device that heats metal, carbon, silicon, germanium, molten glass, etc. using eddy current loss generated in the heated object by an alternating magnetic field. Conventionally, when the object to be heated is a plate-shaped object, as shown in Fig. 4, two heating coils 8A and 8B meandering in the plane are connected in series, and the coil surfaces are arranged facing each other. A plate-shaped object to be heated 4A is installed in the gap therebetween, and heating is performed by connecting an induction heating power source 3B to both ends of the coil.
また、シリコン等の半導体ロッドを加熱する場合には、
第５図のように、ソレノイド状の加熱コイルＩＡ中に半
導体のロッド１０を通し、その−端にロッド１０を貫通
して固定されたカーボンのリング９などを設置し、誘導
加熱電源３Ａをつなぐ６加熱方法としてはまず、ソレノ
イド状加熱コイルＩＡで、カーボンリング９中に渦電流
を発生させて加熱する。さらに、加熱されたカーボンリ
ング９からの熱輻射によって、カーボンリング９近傍の
半導体ロッド１０の領域に熱キャリアを発生させる。熱
キャリアの発生により抵抗が下がり、半導体ロッド１０
中にも渦電流が流れるようになって、さらに多くの熱キ
ャリアが発生するという正帰還がかかる。その結果、半
導体ロッド１０のソレノイド状態熱コイルＩＡ中に入っ
ている領域を溶解させることが出来るから、その溶解領
域をソレノイド状加熱コイルＩＡを移動させることによ
って、半導体ロッド１０全体の加熱、精製や結晶化を行
うものである。すなわち、カーボンリング９からの輻射
によって、正帰還の種となるキャリアを発生させるもの
である。Also, when heating semiconductor rods such as silicon,
As shown in Fig. 5, a semiconductor rod 10 is passed through a solenoid-shaped heating coil IA, and a carbon ring 9 or the like fixed through the rod 10 is installed at the lower end, and an induction heating power source 3A is connected. 6. As a heating method, first, an eddy current is generated in the carbon ring 9 using a solenoid heating coil IA to heat it. Furthermore, thermal radiation from the heated carbon ring 9 generates thermal carriers in the region of the semiconductor rod 10 near the carbon ring 9. The resistance decreases due to the generation of heat carriers, and the semiconductor rod 10
Eddy currents also begin to flow inside, creating positive feedback in which more heat carriers are generated. As a result, the region of the semiconductor rod 10 contained in the solenoid heating coil IA can be melted, and by moving the solenoid heating coil IA through the melted region, the entire semiconductor rod 10 can be heated, purified, and It performs crystallization. That is, radiation from the carbon ring 9 generates carriers that become the seeds of positive feedback.
しかしなから、第４図に示した蛇行した形状のコイルで
は、高い強度の磁界が得られないので、ソレノイド形状
のコイルに比較して大容量の誘導加熱電源が・必要であ
るという問題がある。更に、板状の被加熱物の面積増大
に比例させて、加熱コイルの面積を増加させなければな
らないので、電源の所要容量増大の問題は、大面積の板
状の物を加熱する場合には一層深刻となる。However, the meandering shaped coil shown in Figure 4 does not provide a high strength magnetic field, so there is a problem in that it requires a larger capacity induction heating power source compared to a solenoid shaped coil. . Furthermore, since the area of the heating coil must be increased in proportion to the increase in the area of the plate-shaped object to be heated, the problem of increasing the required capacity of the power supply becomes less important when heating a large-area plate-shaped object. It becomes even more serious.
また第５図に示した誘導加熱装置及び方法では、正帰還
の種となるキャリアを発生させるために、カーボンリン
グからの熱輻射を使用しているため、被加熱物の半導体
ロッドだけでなく、誘導加熱装置の他の部分も輻射熱に
よって加熱されてしまうという問題がある。さらに、大
面積の板状の半導体を加熱しようとすると、コイルと電
源の大型化が避けられないという問題がある。In addition, in the induction heating device and method shown in FIG. 5, thermal radiation from the carbon ring is used to generate carriers that become the seeds of positive feedback, so that not only the semiconductor rod of the object to be heated but also the There is a problem in that other parts of the induction heating device are also heated by the radiant heat. Furthermore, when attempting to heat a large-area plate-shaped semiconductor, there is a problem in that the coil and power supply must become larger.
第１の発明の誘導加熱装置は、直列接続されかつ、中心
軸が同一直線上に配置された二つのソレノイド状の加熱
コイルと、この加熱コイルの両端に接続された誘導加熱
電源と、前記加熱コイル間に被加熱物を設置し、加熱コ
イルの中心軸と垂直な面内でこの被加熱物を二次元的に
移動させる移動手段とを含んで構成される。The induction heating device of the first invention includes two solenoid-shaped heating coils connected in series and whose central axes are arranged on the same straight line, an induction heating power source connected to both ends of the heating coil, and the heating coil. The heated object is placed between the coils, and includes moving means for two-dimensionally moving the heated object in a plane perpendicular to the central axis of the heating coil.
第２の発明の誘導加熱装置は、直列接続されかつ、中心
軸が同一直線上に配置された二つのソレノイド状の加熱
コイルと、この加熱コイルの両端に接続された誘導加熱
電源と、前記加熱コイル間に被加熱物を設置し、加熱コ
イルの中心軸と垂直な面内でこの被加熱物を二次元的に
移動させる移動手段と、前記被加熱物に光を照射するた
めの光照射手段とを含んで構成される。The induction heating device of the second invention includes two solenoid-shaped heating coils connected in series and whose central axes are arranged on the same straight line, an induction heating power source connected to both ends of the heating coil, and the heating coil. A moving means for placing an object to be heated between the coils and moving the object two-dimensionally in a plane perpendicular to the central axis of the heating coil, and a light irradiation means for irradiating the object to be heated with light. It consists of:
第３の発明の誘導加熱方法は、ソレノイド状の加熱コイ
ルを用いて被加熱物を加熱する誘導加熱方法において、
前記被加熱物の被加熱領域に光を照射するものである。An induction heating method according to a third aspect of the invention is an induction heating method for heating an object to be heated using a solenoid-like heating coil.
The heating area of the object to be heated is irradiated with light.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例の誘導加熱装置の斜視図
である。FIG. 1 is a perspective view of an induction heating device according to a first embodiment of the present invention.
二つのソレノイド状加熱コイル１．２は、中心軸が同一
直線上に配置されて直列に接続されており、その両端は
誘導加熱電源３に接続されている。そして、板状被加熱
物４はこのソレノイド状加熱コイル１．２の間に設置さ
れ、その端部はＸ−Ｙテーブル５の支持棒５Ａに固定さ
れている。The two solenoidal heating coils 1.2 are connected in series with their central axes arranged on the same straight line, and both ends thereof are connected to the induction heating power source 3. The plate-shaped heated object 4 is installed between the solenoid-shaped heating coils 1.2, and its end portion is fixed to the support rod 5A of the XY table 5.
このＸ−Ｙテーブル５は、板状被加熱物４を加熱コイル
の中心軸と垂直な面内で二次元的に移動させることがで
きるように構成されている。This XY table 5 is configured to be able to move the plate-shaped heated object 4 two-dimensionally within a plane perpendicular to the central axis of the heating coil.
ソレノイド状加熱コイル１．２は、第４図に示した蛇行
した加熱コイル８Ａ、８Ｂに比較すると、同じ電流を流
しても強い強度の磁界を発生させることが出来る。その
うえに、ソレノイド状加熱コイル１．２は、直列に接続
され、その直径程度以下の距離にコイルの軸が直線状に
配置されているから、ソレノイド成力Ｕ熱コイル１．２
で発生させた磁束は、直径程度以下の二つのコイルの間
隙では磁束が洩れず、ソレノイドの軸方向にほぼ沿って
分布し、ソレノイド内とほぼ同じ強度の磁束密度を持っ
た、ソレノイドの断面積程度の領域を、ソレノイド状加
熱コイル１，２の間隙に形成することが可能となる。そ
のために第４図に示した従来型の誘導加熱装置に比較す
ると、小容量の電源で加熱することが可能となる。さら
に、被加熱物を二次元的に走査するＸ−Ｙテーブル５を
備えることによって、大面積の板状の物の加熱も可能に
している。Compared to the meandering heating coils 8A and 8B shown in FIG. 4, the solenoidal heating coil 1.2 can generate a magnetic field of greater strength even when the same current is applied. Moreover, since the solenoidal heating coils 1.2 are connected in series and the axes of the coils are arranged in a straight line at a distance less than or equal to the diameter of the solenoidal heating coils 1.2, the solenoidal heating coils 1.2
The magnetic flux generated in the solenoid does not leak in the gap between the two coils, which is less than the diameter of the coil, and is distributed almost along the axial direction of the solenoid. It becomes possible to form a region of about 100 yen in the gap between the solenoidal heating coils 1 and 2. Therefore, compared to the conventional induction heating device shown in FIG. 4, heating can be performed with a small capacity power source. Furthermore, by providing an X-Y table 5 that scans the object to be heated two-dimensionally, it is possible to heat a large-area plate-like object.
第２図は本発明の第２の実施例の誘導加熱装置の斜視図
であり、第１の実施例と異なる所は、板状被加熱物４の
被加熱領域に光励起キャリアを発生させるための光照射
装置６を設けたことである。FIG. 2 is a perspective view of an induction heating apparatus according to a second embodiment of the present invention. This is because the light irradiation device 6 is provided.
光照射装置６としては１μｍ以下の波長の光７を発生さ
せるハロゲンランプやキャノンランプ。The light irradiation device 6 is a halogen lamp or a canon lamp that generates light 7 with a wavelength of 1 μm or less.
或いはレーザ装置を用いることができる。Alternatively, a laser device can be used.
このように本第２の実施例では光照射装置でキャリアを
発生できるため、第１の実施例と同様の効果を有すると
共に、大面積の板状の半導体を効率よく加熱できるとい
う利点がある。In this way, in the second embodiment, since carriers can be generated by the light irradiation device, it has the same effect as the first embodiment, and has the advantage that a large-area plate-shaped semiconductor can be efficiently heated.
第３図は本発明の第３の実施例の誘導加熱方法を説明す
るための装置の構成図であり、ＩＡはソレノイド状加熱
コイル、６はハロゲンランプ等の光照射装置、３Ａは誘
導加熱電源、１０は被加熱物の半導体ロッドである６本
実施例による誘導加熱方法では、半導体ロッド１０を加
熱するための種となるキャリアを熱的な励起ではなく、
光励起によって行う。本実施例では、光照射装置６によ
って、ソレノイド状加熱コイルＩＡ中の被加熱領域に光
を照射し、光励起キャリアを発生させる。FIG. 3 is a configuration diagram of an apparatus for explaining the induction heating method according to the third embodiment of the present invention, where IA is a solenoid heating coil, 6 is a light irradiation device such as a halogen lamp, and 3A is an induction heating power source. , 10 is a semiconductor rod of the object to be heated.6 In the induction heating method according to this embodiment, the carriers that serve as seeds for heating the semiconductor rod 10 are not thermally excited,
This is done by optical excitation. In this embodiment, the light irradiation device 6 irradiates the heated region in the solenoid-shaped heating coil IA with light to generate photoexcited carriers.
その光励起キャリアを正帰還の種として、被加熱物の半
導体ロッド１０を加熱する。The semiconductor rod 10 as the object to be heated is heated using the photoexcited carriers as seeds of positive feedback.
本実施例では、光による直接光励起を用いるために、第
５図に示した従来の加熱方法で問題となっていた、輻射
熱による不必要な部分の加熱が発生しない。また、光は
加熱中連続して照射してもよいし、加熱の初期だけに照
射しても、加熱中断続的に照射しても本発明を実施する
ことができる。In this embodiment, since direct optical excitation by light is used, unnecessary heating of unnecessary parts by radiant heat, which was a problem with the conventional heating method shown in FIG. 5, does not occur. Further, the present invention can be carried out by irradiating light continuously during heating, by irradiating only at the beginning of heating, or by irradiating light intermittently during heating.
以上説明したように本発明の誘電加熱装置および誘電加
熱方法によれば、大面積の板状の被加熱物を小容量の電
源で加熱することができる。また半導体ロッドを加熱す
る場合、従来必要であったカーボンリングが不要となる
ことから装置の小型化及び低価格化ができるという効果
がある。As explained above, according to the dielectric heating device and dielectric heating method of the present invention, a large-area plate-shaped object to be heated can be heated with a small-capacity power source. In addition, when heating a semiconductor rod, the conventionally required carbon ring is no longer necessary, so the device can be made smaller and less expensive.
第１図及び第２図は本発明の第１及び第２の実施例の誘
導加熱装置の斜視図、第３図は本発明の第３の実施例を
説明するための誘導加熱装置の構成図、第４図及び第５
図は従来例を説明するための誘導加熱装置の構成図であ
る。
１．２・・・ソレノイド状加熱コイル、３，３Ａ。
３Ｂ・・・誘導加熱電源、４，４Ａ・・・板状被加熱物
、５・・・Ｘ−Ｙテーブル、５Ａ・・・支持棒、６・・
・光照射装置、７・・・光、８Ａ、８Ｂ・・・蛇行した
加熱コイル、９・・・カーボンリング、１０・・・半導
体ロッド。1 and 2 are perspective views of induction heating devices according to first and second embodiments of the present invention, and FIG. 3 is a configuration diagram of an induction heating device for explaining a third embodiment of the present invention. , Figures 4 and 5
The figure is a configuration diagram of an induction heating device for explaining a conventional example. 1.2...Solenoid heating coil, 3,3A. 3B...Induction heating power source, 4,4A...Plate-shaped object to be heated, 5...X-Y table, 5A...Support rod, 6...
- Light irradiation device, 7... Light, 8A, 8B... Meandering heating coil, 9... Carbon ring, 10... Semiconductor rod.
Claims (1)
た二つのソレノイド状の加熱コイルと、この加熱コイル
の両端に接続された誘導加熱電源と、前記加熱コイル間
に被加熱物を設置し、加熱コイルの中心軸と垂直な面内
でこの被加熱物を二次元的に移動させる移動手段とを含
むことを特徴とする誘導加熱装置。 ２、直列接続されかつ、中心軸が同一直線上に配置され
た二つのソレノイド状の加熱コイルと、この加熱コイル
の両端に接続された誘導加熱電源と、前記加熱コイル間
に被加熱物を設置し、加熱コイルの中心軸と垂直な面内
でこの被加熱物を二次元的に移動させる移動手段と、前
記被加熱物に光を照射するための光照射手段とを含むこ
とを特徴とする誘電加熱装置。 ３、ソレノイド状の加熱コイルを用いて被加熱物を加熱
する誘導加熱方法において、前記被加熱物の被加熱領域
に光を照射することを特徴とする誘導加熱方法。[Claims] 1. Two solenoid-shaped heating coils connected in series and whose center axes are arranged on the same straight line, an induction heating power source connected to both ends of the heating coils, and a space between the heating coils. An induction heating device characterized by comprising: a moving means for moving an object to be heated two-dimensionally in a plane perpendicular to a central axis of a heating coil; 2. Two solenoid-shaped heating coils that are connected in series and whose central axes are arranged on the same straight line, an induction heating power source connected to both ends of the heating coils, and an object to be heated between the heating coils. and includes a moving means for two-dimensionally moving the object to be heated in a plane perpendicular to the central axis of the heating coil, and a light irradiation means for irradiating the object to be heated with light. Dielectric heating device. 3. An induction heating method in which a heated object is heated using a solenoid-shaped heating coil, the method comprising irradiating a heated region of the object with light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2103814A JP2765180B2 (en) | 1990-04-19 | 1990-04-19 | Induction heating device and induction heating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2103814A JP2765180B2 (en) | 1990-04-19 | 1990-04-19 | Induction heating device and induction heating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044591A true JPH044591A (en) | 1992-01-09 |
| JP2765180B2 JP2765180B2 (en) | 1998-06-11 |
Family
ID=14363877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2103814A Expired - Lifetime JP2765180B2 (en) | 1990-04-19 | 1990-04-19 | Induction heating device and induction heating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2765180B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5416341A (en) * | 1993-02-22 | 1995-05-16 | Nec Corporation | Substrate for a semiconductor device and method for manufacturing a semiconductor device from the substrate |
| WO2018101436A1 (en) * | 2016-12-02 | 2018-06-07 | ウシオ電機株式会社 | Method for manufacturing heat-treated metal plate, and heat treatment device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6161479B2 (en) * | 2013-09-10 | 2017-07-12 | 中部電力株式会社 | Induction heating device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50150854U (en) * | 1974-05-31 | 1975-12-15 |
-
1990
- 1990-04-19 JP JP2103814A patent/JP2765180B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50150854U (en) * | 1974-05-31 | 1975-12-15 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5416341A (en) * | 1993-02-22 | 1995-05-16 | Nec Corporation | Substrate for a semiconductor device and method for manufacturing a semiconductor device from the substrate |
| WO2018101436A1 (en) * | 2016-12-02 | 2018-06-07 | ウシオ電機株式会社 | Method for manufacturing heat-treated metal plate, and heat treatment device |
| JPWO2018101436A1 (en) * | 2016-12-02 | 2019-07-04 | ウシオ電機株式会社 | Method of producing heat-treated metal sheet, and heat treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2765180B2 (en) | 1998-06-11 |
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