JPH0444392A - Fixing of wire - Google Patents
Fixing of wireInfo
- Publication number
- JPH0444392A JPH0444392A JP15171190A JP15171190A JPH0444392A JP H0444392 A JPH0444392 A JP H0444392A JP 15171190 A JP15171190 A JP 15171190A JP 15171190 A JP15171190 A JP 15171190A JP H0444392 A JPH0444392 A JP H0444392A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- piece
- fixed
- wire rod
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims abstract description 47
- 230000037431 insertion Effects 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 210000000078 claw Anatomy 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、基板に線材片を挿入し、基板の両面の回路を
接続する線材固定方法に関するものであ(従来の技術)
従来の線材固定方法について、第4図および第5図によ
り説明する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a wire fixing method for inserting a wire piece into a board and connecting circuits on both sides of the board (prior art). The method will be explained with reference to FIGS. 4 and 5.
第4図は、従来の線材挿入装置の挿入部を示す要部拡大
正面図、第5図は、従来の線材固定方法によって、両面
の回路を接続した状態を示す回路基板の要部拡大断面図
である。Fig. 4 is an enlarged front view of the main part showing the insertion section of the conventional wire insertion device, and Fig. 5 is an enlarged sectional view of the main part of the circuit board showing the state in which circuits on both sides are connected by the conventional wire rod fixing method. It is.
第4図において、線材挿入装置は、線材1の定尺供給装
置(図示せず)と、挿入頭(図示せず)に設けられた固
定刃2及び可動刃3からなる切断装置と、上記の切断装
置によって切り離された線材片1aを折り曲げる、2個
の受は傘4およびその両側で摺動する成形子5からなる
成形装置と、上記の受は金4との間で折曲げ成形された
線材片1aを保持し、回路基板6の挿入孔6aに挿入す
るブツシャ7とから構成されている。なお、上記の受は
金4は、挿入の際に退避する。In FIG. 4, the wire rod insertion device includes a fixed length feeding device (not shown) for wire rod 1, a cutting device consisting of a fixed blade 2 and a movable blade 3 provided on an insertion head (not shown), and the above-mentioned cutting device. The two receivers for bending the wire rod piece 1a cut off by the cutting device are formed by bending between a forming device consisting of an umbrella 4 and a forming element 5 sliding on both sides of the umbrella 4, and the metal 4. The pusher 7 holds the wire piece 1a and is inserted into the insertion hole 6a of the circuit board 6. Note that the above-mentioned receiver 4 is retracted during insertion.
上記のように構成された線材挿入装置の動作を説明する
。The operation of the wire insertion device configured as described above will be explained.
まず、定尺供給装置(図示せず)が線材1を所定量供給
する。挿入頭の可動刃3とブツシャ7が下降し線材1を
押えた後、固定刃2との間で切離す。First, a fixed length supply device (not shown) supplies a predetermined amount of wire 1. After the movable blade 3 and the bushing 7 of the insertion head descend and hold down the wire 1, they are separated from the fixed blade 2.
続いて、成形子5が下降し、受は金4との間で、図中に
二点鎖線で示したようにコの字形の線材片1aに成形す
る。次に、受は金4とブツシャ7で、コの字状の線材片
1aを挾持したまま、挿入頭(図示せず)が下降し、線
材片1aが挿入孔6aにその先端をのぞかせた時に、受
は金4が退避し、ブツシャ7のみがさらに下降して、線
材片1aを挿入孔6aに完全に挿入する。Subsequently, the forming element 5 is lowered, and the receiver is formed into a U-shaped wire rod piece 1a as shown by the two-dot chain line in the figure between the receiver and the gold 4. Next, the insertion head (not shown) is lowered while holding the U-shaped wire rod piece 1a with the metal 4 and bushing 7, and when the wire rod piece 1a shows its tip into the insertion hole 6a, , the metal 4 of the receiver is retracted, and only the pusher 7 is further lowered to completely insert the wire piece 1a into the insertion hole 6a.
第5図は回路基板6の挿入孔6aに挿入された線材片1
aが、クリンチされ固定された状態を示しており1回路
基板6の回路パターン8と線材片1aとは、はんだ9に
よって接続される。FIG. 5 shows the wire piece 1 inserted into the insertion hole 6a of the circuit board 6.
A shows a clinched and fixed state, and the circuit pattern 8 of one circuit board 6 and the wire piece 1a are connected by solder 9.
(発明が解決しようとする課題)
しかしながら、上記の方法では、挿入孔6aを2個設け
る必要があり、高密度実装および小形化、低コスト化が
難しいという問題があった。(Problems to be Solved by the Invention) However, in the above method, it is necessary to provide two insertion holes 6a, and there is a problem in that high-density mounting, miniaturization, and cost reduction are difficult.
本発明は上記の問題を解決するもので、最小スペースで
、回路基板両面の回路パターンを接続できる線材固定方
法を提供するものである。The present invention solves the above problems and provides a wire fixing method that can connect circuit patterns on both sides of a circuit board using a minimum space.
(課題を解決するための手段)
上記の課題を解決するため、本発明は、回路基板には1
個の挿入孔をあけ、線材片の中央を把持した挿入針を用
いて挿入孔に押し込み、U字状に成形された線材片のス
プリングバックで固定したり、線材片の一端を把持する
挿入孔と、挿入孔の下方に配置したクリンチブロックを
用い挿通後、両者を反対方向あるいは同方向に動かし線
材片をS字状又はコの字状に成形して固定するものであ
る。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a circuit board with one
Drill several insertion holes, push the wire rod piece into the insertion hole using an insertion needle that grips the center of the wire rod piece, and fix it with the springback of the wire rod piece formed in a U shape, or insert the wire rod piece into the insertion hole that grips one end of the wire rod piece. Then, after insertion using a clinch block placed below the insertion hole, both are moved in opposite directions or in the same direction, and the wire piece is formed into an S-shape or a U-shape and fixed.
(作 用)
上記の構成により、基板に設けた1個の挿入孔で、基板
両面の回路パターンを接続することができるため、高密
度実装および小形化、低コストを図ることができる。(Function) With the above configuration, the circuit patterns on both sides of the board can be connected with one insertion hole provided in the board, so high-density packaging, miniaturization, and low cost can be achieved.
(実施例)
本発明の実施例3例を、第1図ないし第3図により説明
する。(Example) Three examples of the present invention will be described with reference to FIGS. 1 to 3.
第1図は、本発明による線材固定方法の第1の実施例に
使用する線材挿入装置の要部拡大正面図で、本実施例が
第4図で示した従来例と異なる点は5回路基板6には1
個の挿入孔6aを形成した点と、従来の成形装置をブツ
シャ7に替って、先端に弾性を利用した把持爪10aを
有する挿入針10を設けた点である。その他は従来例と
変りがないので、同じ構成部品には同一符号を付して、
その説明を省略する。FIG. 1 is an enlarged front view of the main parts of the wire rod insertion device used in the first embodiment of the wire fixing method according to the present invention.The difference between this embodiment and the conventional example shown in FIG. 1 for 6
In addition, in place of the bushing 7 in the conventional molding device, an insertion needle 10 having a gripping claw 10a using elasticity at the tip is provided. The rest is the same as the conventional example, so the same components are given the same symbols.
The explanation will be omitted.
このような構成を有する線材挿入装置を用いた線材固定
方法について、説明する。A wire rod fixing method using a wire rod insertion device having such a configuration will be explained.
まず、定尺供給装置(図示せず)により、所定量の線材
1が供給される。次に、可動刃3と挿入針10が下降し
て、挿入針10の把持爪10aが線材1を挾持すると同
時に、固定刃2との間で線材1を切断する。続いて、線
材片1aの中央を挾持した挿入針10のみが下降し、挿
入孔6aに線材片1aを挿入する。その後挿入針10は
上昇し、挿入孔6aから抜けると5線材片1aはスプリ
ングバックにより挿入孔6a内に固定される。回路基板
6両面に形成された回路パターン8と、線材片1aとは
、はんだ9により接続される。First, a predetermined amount of wire 1 is supplied by a fixed length supply device (not shown). Next, the movable blade 3 and the insertion needle 10 descend, and the gripping claws 10a of the insertion needle 10 grip the wire 1, and at the same time cut the wire 1 between the movable blade 3 and the fixed blade 2. Subsequently, only the insertion needle 10 holding the center of the wire rod piece 1a is lowered, and the wire rod piece 1a is inserted into the insertion hole 6a. After that, the insertion needle 10 rises and comes out of the insertion hole 6a, and the five wire pieces 1a are fixed in the insertion hole 6a by springback. The circuit pattern 8 formed on both sides of the circuit board 6 and the wire piece 1a are connected by solder 9.
本実施例によれば、線材片1aは、スプリングバックに
よって、挿入孔6aに固定するため、クリンチ等の固定
機構用のデッドスペースが不要となり、高密度実装が可
能となる。According to this embodiment, since the wire rod piece 1a is fixed in the insertion hole 6a by springback, there is no need for a dead space for a fixing mechanism such as a clinch, and high-density mounting is possible.
第2図は、第2の実施例による線材固定後の回路基板の
要部拡大断面図である。線材片1aは挿入孔6aに挿入
された後、クリンチユニット(図示せず)により矢印B
、および矢印Cの方向にクリンチし固定する。その後は
んだ9により回路パターン8と接続を行う。FIG. 2 is an enlarged sectional view of a main part of a circuit board after wire rods are fixed according to the second embodiment. After the wire rod piece 1a is inserted into the insertion hole 6a, it is moved by an arrow B by a clinch unit (not shown).
, and clinch and fix in the direction of arrow C. Thereafter, connection with the circuit pattern 8 is made using solder 9.
以上のように本実施例によれば、クリンチユニットを用
いて挿入孔6aに固定するため、挿入孔6aの内径の精
度、傾き等による固定時のばらつきおよび固定不良を防
ぐ事ができる。As described above, according to this embodiment, since the clinch unit is used to fix the insertion hole 6a, it is possible to prevent variations in fixation and fixation defects due to the accuracy of the inner diameter of the insertion hole 6a, inclination, etc.
第3図は、第3の実施例による線材固定後の回路基板の
要部拡大断面図である。線材片1aを挿入孔6aに挿入
した後、挿入子11およびクリンチブロック12を矢印
り方向に作動させコの字に成形し挿入孔6aに線材片1
aを固定させる。又は1回路基板6を矢印Eの方向に作
動させてもよい。FIG. 3 is an enlarged sectional view of a main part of a circuit board after wire rods are fixed according to the third embodiment. After inserting the wire rod piece 1a into the insertion hole 6a, the inserter 11 and clinch block 12 are operated in the direction of the arrow to form a U-shape, and the wire rod piece 1 is inserted into the insertion hole 6a.
Fix a. Alternatively, one circuit board 6 may be operated in the direction of arrow E.
以上のように本実施例によれば、挿入子11とクリンチ
ブロック12或いは回路基板6のどちらかを移動して固
定するので、クリンチ方向を任意に決められ、隣接への
考慮が不要となる。As described above, according to this embodiment, since the inserter 11 and either the clinch block 12 or the circuit board 6 are moved and fixed, the clinch direction can be determined arbitrarily, and there is no need to consider the adjacency.
(発明の効果)
以上説明したように、本発明によれば、回路基板の1個
の挿入孔で線材片を固定し、基板両面の回路の接続を行
えるので、高密度実装および小形化、低コスト化が可能
となる。(Effects of the Invention) As explained above, according to the present invention, a wire piece can be fixed in one insertion hole of a circuit board and circuits on both sides of the board can be connected, resulting in high-density mounting, miniaturization, and low cost. Cost reduction becomes possible.
第1図は本発明による線材固定方法の第1の実施例を示
す線材挿入装置の要部拡大正面図、第2図は第2の実施
例による線材固定後の回路基板の要部拡大断面図、第3
図は本発明の第3の実施例による線材固定後の回路基板
の要部拡大断面図。
第4図は従来の線材挿入装置の要部拡大正面図、第5図
は従来の線材固定後の回路基板の要部拡大断面図である
。
1・・・線材、 1a・・・線材片、 2・・・固定刃
、3・・・可動刃、 4・・・受は金、 5・・・成
形子、 6・・・回路基板、 6a・・・挿入孔、7・
・・ブツシャ、 8・・・回路パターン、9・・・は
んだ、10・・・挿入針、10a・・・把持爪、 11
・・・挿入子、 12・・・クリンチブロック・
特許出願人 松下電器産業株式会社FIG. 1 is an enlarged front view of the main parts of a wire rod insertion device showing a first embodiment of the wire rod fixing method according to the present invention, and FIG. 2 is an enlarged sectional view of the main parts of a circuit board after wire rods are fixed according to the second embodiment. , 3rd
The figure is an enlarged cross-sectional view of a main part of a circuit board after wire rods are fixed according to a third embodiment of the present invention. FIG. 4 is an enlarged front view of a main part of a conventional wire insertion device, and FIG. 5 is an enlarged sectional view of a main part of a circuit board after fixing a conventional wire. DESCRIPTION OF SYMBOLS 1... Wire rod, 1a... Wire rod piece, 2... Fixed blade, 3... Movable blade, 4... Receiver is gold, 5... Forming element, 6... Circuit board, 6a ...insertion hole, 7.
... Button, 8... Circuit pattern, 9... Solder, 10... Insertion needle, 10a... Gripping claw, 11
...insertor, 12...clinch block Patent applicant Matsushita Electric Industrial Co., Ltd.
Claims (4)
面に形成された回路を接続することを特徴とする線材固
定方法。(1) A wire fixing method characterized by inserting and fixing a wire piece into one hole of a board and connecting circuits formed on both sides of the board.
材片のスプリングバックにより固定する請求項(1)記
載の線材固定方法。(2) The wire rod fixing method according to claim (1), wherein the wire rod piece is formed into a substantially U-shape, inserted into the insertion hole, and fixed by springback of the wire rod piece.
チし、固定する請求項(1)記載の線材固定方法。(3) The wire rod fixing method according to claim (1), wherein after inserting the wire rod piece into the insertion hole, the wire rod piece is clinched and fixed on both sides of the substrate.
は基板を任意方向に移動させ、略コの字に成形し固定す
る請求項(1)記載の線材固定方法。(4) The wire rod fixing method according to claim (1), wherein after inserting the wire rod piece into the insertion hole, the insertion unit section or the board is moved in an arbitrary direction, formed into a substantially U-shape, and fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15171190A JP2969366B2 (en) | 1990-06-12 | 1990-06-12 | Wire rod fixing method and wire rod insertion device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15171190A JP2969366B2 (en) | 1990-06-12 | 1990-06-12 | Wire rod fixing method and wire rod insertion device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0444392A true JPH0444392A (en) | 1992-02-14 |
JP2969366B2 JP2969366B2 (en) | 1999-11-02 |
Family
ID=15524606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15171190A Expired - Fee Related JP2969366B2 (en) | 1990-06-12 | 1990-06-12 | Wire rod fixing method and wire rod insertion device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2969366B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7803650B2 (en) | 2007-09-21 | 2010-09-28 | Samsung Electronics Co., Ltd. | Sensor thin film transistor, thin film transistor substrate having the same, and method of manufacturing the same |
JP2011011878A (en) * | 2009-07-02 | 2011-01-20 | Hakuryu Kikaisho Kofun Yugenkoshi | Tension adjusting architecture for cloth winding machine |
-
1990
- 1990-06-12 JP JP15171190A patent/JP2969366B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7803650B2 (en) | 2007-09-21 | 2010-09-28 | Samsung Electronics Co., Ltd. | Sensor thin film transistor, thin film transistor substrate having the same, and method of manufacturing the same |
JP2011011878A (en) * | 2009-07-02 | 2011-01-20 | Hakuryu Kikaisho Kofun Yugenkoshi | Tension adjusting architecture for cloth winding machine |
Also Published As
Publication number | Publication date |
---|---|
JP2969366B2 (en) | 1999-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |