JPH0444158U - - Google Patents
Info
- Publication number
- JPH0444158U JPH0444158U JP8592790U JP8592790U JPH0444158U JP H0444158 U JPH0444158 U JP H0444158U JP 8592790 U JP8592790 U JP 8592790U JP 8592790 U JP8592790 U JP 8592790U JP H0444158 U JPH0444158 U JP H0444158U
- Authority
- JP
- Japan
- Prior art keywords
- cooling liquid
- cooling
- semiconductor element
- immersed
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 claims 5
- 239000002826 coolant Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8592790U JPH0444158U (da) | 1990-08-15 | 1990-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8592790U JPH0444158U (da) | 1990-08-15 | 1990-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444158U true JPH0444158U (da) | 1992-04-15 |
Family
ID=31817336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8592790U Pending JPH0444158U (da) | 1990-08-15 | 1990-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444158U (da) |
-
1990
- 1990-08-15 JP JP8592790U patent/JPH0444158U/ja active Pending