JPH0444153U - - Google Patents
Info
- Publication number
- JPH0444153U JPH0444153U JP8614590U JP8614590U JPH0444153U JP H0444153 U JPH0444153 U JP H0444153U JP 8614590 U JP8614590 U JP 8614590U JP 8614590 U JP8614590 U JP 8614590U JP H0444153 U JPH0444153 U JP H0444153U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sealed
- wire
- hard rubber
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 5
- 229920001875 Ebonite Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8614590U JPH0444153U ( ) | 1990-08-17 | 1990-08-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8614590U JPH0444153U ( ) | 1990-08-17 | 1990-08-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0444153U true JPH0444153U ( ) | 1992-04-15 |
Family
ID=31817659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8614590U Pending JPH0444153U ( ) | 1990-08-17 | 1990-08-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0444153U ( ) |
-
1990
- 1990-08-17 JP JP8614590U patent/JPH0444153U/ja active Pending