JPH044277A - Production of tacky film or sheet - Google Patents
Production of tacky film or sheetInfo
- Publication number
- JPH044277A JPH044277A JP10593990A JP10593990A JPH044277A JP H044277 A JPH044277 A JP H044277A JP 10593990 A JP10593990 A JP 10593990A JP 10593990 A JP10593990 A JP 10593990A JP H044277 A JPH044277 A JP H044277A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive composition
- film
- photopolymerization
- base material
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000203 mixture Substances 0.000 claims abstract description 71
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 28
- 239000002313 adhesive film Substances 0.000 claims description 8
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 239000000178 monomer Substances 0.000 abstract description 19
- 239000000758 substrate Substances 0.000 abstract description 8
- -1 acrylic ester Chemical class 0.000 abstract description 5
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 229920000915 polyvinyl chloride Polymers 0.000 abstract description 2
- 239000004800 polyvinyl chloride Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive effect Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は粘着フィルムまたはシートの製造方法に関する
。The present invention relates to a method for producing an adhesive film or sheet.
従来、フィルム状基材の表面に、感光性組成物層を設け
、光を照射して、この感光性組成物を重合させる粘着フ
ィルムまたはシートの製造方法は公知である。
例えば、特開昭５８−１１８８７３号公報には粘着フィ
ルムの製造方法と題して、フィルム状基材の上に感光性
組成物を塗布し、光を照射して感光性組成物を重合する
方法について記載されている。BACKGROUND ART Conventionally, a method for producing an adhesive film or sheet is known in which a photosensitive composition layer is provided on the surface of a film-like base material, and the photosensitive composition is polymerized by irradiation with light. For example, JP-A-58-118873 describes a method of coating a photosensitive composition on a film-like base material and polymerizing the photosensitive composition by irradiating it with light, entitled "Method for producing an adhesive film." Are listed.
上記製造方法を本発明者等が追試したところ、粘着性能
の悪い粘着フィルムしか製造できなかった。
更に、本発明者が研究を重ねた結果、この粘着性能が悪
いのは、重合させた粘着剤が、原料組成より異なること
が原因であることが判明した。
そこで、本発明は、上記問題を解決し、感光性組成物組
成の組成変化の少ない光重合方法で、重合させて、性能
のよい粘着フィルムまたはシートを製造する方法を提供
することを目的にする。When the present inventors tried the above-mentioned manufacturing method, only adhesive films with poor adhesive performance could be manufactured. Further, as a result of repeated research by the present inventors, it has been found that the reason for this poor adhesive performance is that the polymerized adhesive has a different raw material composition. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems and provide a method for producing a pressure-sensitive adhesive film or sheet with good performance by polymerizing a photosensitive composition using a photopolymerization method that causes little change in composition. .
本発明は、上記問題を解決し、上記目的を達成するため
になしたもので、フィルム状基材の表面に感光性組成物
層を設けた後、光重合室に導き、この光重合室内で感光
性組成物層を冷却しながら光を照射し、前記感光性組成
物をフィルム状基材上で重合するのである。
本発明に於いて、感光性組成物とは、モノマーと光重合
開始剤とからなる組成物であって、光を照射することに
より、重合して粘着剤となるものをいう。
かかる感光性組成物は、従来、多くのものが知られてい
る。例えば、アクリル系、ポリエステル系、エポキシ系
等多くの感光性組成物が知られている。
本発明ではこれら公知の感光性組成物はすべて使用可能
である。特に、アクリル系感光性組成物が好適である。
本発明において好適なアクリル系感光性組成物の例を示
すと、アクリル酸エステルモノマー、アクリル酸モノマ
ー、光重合開始剤、アクリル酸エステルモノマーに重合
可能なビニルモノマーとの混合物を主成分とする感光性
組成物がある。
本発明において、光とは可視光線、紫外線、電子線等の
電磁波を総称するものである。
本発明に使用するフィルム状基材とは、従来、粘着テー
プ、フィルム、あるいはシートに使用されている基材の
すべてを含むものである。例えば、ポリ塩化ビニルフィ
ルム、ポリエステルフィルム、ポリプロピレンフィルム
、ポリエチレンフィルム等の合成樹脂フィルムやクラフ
ト紙のような紙製品やセロファン等が好適に使用される
。
本発明においては、感光性組成物層を冷却しながら、光
を照射して感光性組成物を重合させるのであるが、この
際の冷却方法としては、光重合室内の雰囲気を冷却し、
間接的に感光性組成物層を冷却する方法と、フィルム状
基材または感光性組成物層を直接冷却する方法とがある
。
光重合室内を冷却する方法としては、光重合室外で冷却
された雰囲気ガスを光重合室内に導入する方法や光重合
室内に冷却装置を据え付けて光重合室内の雰囲気を冷却
する方法とがある。
又、フィルム状基材を冷却する方法としては、光重合室
内の中のロールあるいは板を冷却し、このロールあるい
は板に感光性組成物層を設けたフィルム状基材を接触さ
せながら、光重合室内を移動させる方法がある。又、感
光性組成物層を冷却する方法としては、冷却されたガス
を直接感光性組成物層に吹き付けることにより、この感
光性組成物を冷却する方法がある。
本発明において、感光性組成物の中のモノマーが蒸発し
ない程度に冷却すればよい。このときの冷却温度はモノ
マーの種類によって異なるが、多くの場合、８０℃以下
に冷却すればよい。The present invention has been made to solve the above problems and achieve the above objects, and after providing a photosensitive composition layer on the surface of a film-like base material, it is introduced into a photopolymerization chamber. The photosensitive composition layer is irradiated with light while being cooled, and the photosensitive composition is polymerized on the film-like base material. In the present invention, the photosensitive composition refers to a composition consisting of a monomer and a photopolymerization initiator, which polymerizes to become an adhesive when irradiated with light. Many such photosensitive compositions are conventionally known. For example, many photosensitive compositions such as acrylic, polyester, and epoxy are known. All of these known photosensitive compositions can be used in the present invention. In particular, acrylic photosensitive compositions are suitable. An example of an acrylic photosensitive composition suitable for the present invention is a photosensitive composition mainly containing an acrylic ester monomer, an acrylic acid monomer, a photopolymerization initiator, and a mixture of the acrylic ester monomer and a polymerizable vinyl monomer. There is a sexual composition. In the present invention, light is a general term for electromagnetic waves such as visible light, ultraviolet rays, and electron beams. The film-like base material used in the present invention includes all base materials conventionally used for adhesive tapes, films, or sheets. For example, synthetic resin films such as polyvinyl chloride film, polyester film, polypropylene film, and polyethylene film, paper products such as kraft paper, cellophane, and the like are preferably used. In the present invention, the photosensitive composition is polymerized by irradiating light while cooling the photosensitive composition layer. The cooling method at this time includes cooling the atmosphere inside the photopolymerization chamber,
There are two methods: one is to cool the photosensitive composition layer indirectly, and the other is to cool the film-like base material or the photosensitive composition layer directly. Methods for cooling the inside of the photopolymerization chamber include a method in which atmospheric gas cooled outside the photopolymerization chamber is introduced into the photopolymerization chamber, and a method in which a cooling device is installed inside the photopolymerization chamber to cool the atmosphere inside the photopolymerization chamber. In addition, as a method for cooling a film-like substrate, a roll or a plate in a photopolymerization chamber is cooled, and the film-like substrate provided with a photosensitive composition layer is brought into contact with this roll or plate, and the photopolymerization is carried out. There is a way to move it around the room. Further, as a method for cooling the photosensitive composition layer, there is a method of cooling the photosensitive composition layer by directly spraying a cooled gas onto the photosensitive composition layer. In the present invention, the photosensitive composition may be cooled to such an extent that the monomers in the composition do not evaporate. The cooling temperature at this time varies depending on the type of monomer, but in most cases, the cooling temperature may be 80° C. or lower.
本発明者等がこの光重合方法を研究した結果、次のこと
が判明した。
即ち、一般に感光性組成物に光を照射して重合させると
重合熱が発生して、感光性組成物が高温になる。かかる
温度上昇は感光性組成物の厚みが大である程大である。
例えば、感光性組成物層の厚みが３００μｍのときでは
、感光性組成物の一温度は１５０°Ｃとなり、厚みが１
００μｍの時では１００°Ｃとなる。このように、感光
性組成物の温度が上昇すると、感光性組成物の中のモノ
マーが蒸発する。この際、このモノマーの種類によって
沸点、蒸発の潜熱が異なるから、蒸発量が異なる。
従って、光重合を行っている間に、感光性組成物の組成
が変化し、その結果、粘着性能の悪い粘着剤しか製造で
きないということが判明した。
本発明においては、光重合室内でこの感光性組成物層を
冷却しながら、光を照射して、重合するから、上記のよ
うな感光性組成物の中の七ツマ−の蒸発が殆ど起こらず
、従って、組成の変化も少なく、良好な粘着剤となる。
尚、かかる光重合方法では重合速度が温度に影響されな
い。実際、冷却しながら光を照射して重合しても、重合
速度は変化しないことが確認されている。As a result of research into this photopolymerization method by the present inventors, the following was found. That is, generally when a photosensitive composition is irradiated with light and polymerized, heat of polymerization is generated and the photosensitive composition becomes high temperature. Such temperature increase increases as the thickness of the photosensitive composition increases. For example, when the thickness of the photosensitive composition layer is 300 μm, one temperature of the photosensitive composition is 150°C, and the thickness is 1
When the temperature is 00 μm, the temperature is 100°C. Thus, as the temperature of the photosensitive composition increases, monomers within the photosensitive composition evaporate. At this time, since the boiling point and latent heat of evaporation differ depending on the type of monomer, the amount of evaporation differs. Therefore, it has been found that the composition of the photosensitive composition changes during photopolymerization, and as a result, only adhesives with poor adhesive performance can be produced. In the present invention, since the photosensitive composition layer is cooled in the photopolymerization chamber and irradiated with light for polymerization, evaporation of the 7-mer in the photosensitive composition as described above hardly occurs. Therefore, there is little change in the composition, making it a good adhesive. In this photopolymerization method, the polymerization rate is not affected by temperature. In fact, it has been confirmed that even if polymerization is performed by irradiating light while cooling, the polymerization rate does not change.
【実施例】
以下、図面を参照しながら、本発明の詳細な説明する。
第１図は本発明の一実施態様を判り易く示した説明図、
第２図は本発明の他の実施態様を示した説明図である。
第１図において、ｌは光重合室である。
２は光照射装置であり、ここから紫外線が重合室内に照
射される。
３はフィルム状基材であり、この上に感光性組成物層３
１が設けられている。
４は冷却板であり、図示されてない冷却装置で冷却され
た冷媒がこの冷却板４の中を通過して冷却板を冷却して
いる。そして、この冷却板４の表面上をフィルム状基材
３が接触しながら、通過する。
５は塗布装置であり、この塗布装置５でフィルム状基材
３の表面に感光性組成物を塗布する。
次に、この装置を使用して粘着フィルムを製造する方法
、および、その際の作用について説明する。
先ず、塗布装置５で、フィルム状基材３の上に感光性組
成物を塗布し、フィルム状基材３の表面に感光性組成物
層３１を設ける。その後、このフィルム状基材３を光重
合室１に導く。
この光重合室１内では、フィルム状基材３が冷却板４上
を接触して、冷却されながら、通過するが、この通過中
にフィルム状基材３上に設けられた感光性組成物層３１
に光照射装置から光が照射され、感光性組成物はフィル
ム状基材３上で重合し、粘着剤となる。
この際、フィルム状基材３は冷却されているから、この
上に設けられている感光性組成物も冷却され、従って、
感光性組成物の中のモノマーの蒸発は殆ど起こらず、組
成の変化も少なく、良好な粘着剤となる。
次に、第２図に示された実施態様を説明する。
第２図において、１′は光重合室である。
２は光照射装置である。
３はフィルム状基材であり、この上に感光性組成物層３
１が設けられている。
４１は雰囲気ガス冷却装置であり、この冷却装置４１で
冷却された不活性ガスはフィルム状基材３の入口近くに
設けられたガス導入口４２から導入され、フィルム状基
材３の出口近くに設けられた排出口４３から排出される
。
次に、この装置を使用して粘着フィルムを製造する方法
およびその際の作用について説明する。
図示されてない塗布装置で、フィルム状基材３の上に感
光性組成物を塗布し、フィルム状基材３の表面に感光性
組成物層３１を設ける。
次に、この感光性組成物層３１が表面に設けられたフィ
ルム状基材３を光重合室１′内に導く。
この光重合室１′内には冷却された不活性ガスがガス導
入口４２から導入され、ガス排出口４３から排出されて
いる。このようにすると、この光重合室１′内の雰囲気
温度が下がり、感光性組成物のモノマーの蒸発を少なく
なると同時に、雰囲気の酸素濃度が減少し、重合し易い
状態になる。
このように温度が低くなり、酸素濃度が少なくなってい
る光重合室１′内にフィルム状基材３を導き、ここでこ
のフィルム状基材３の上に設けられた感光性組成物層３
１に、光照射装置２から光が照射される。すると、感光
性組成物はフィルム状基材３の上で重合し、粘着剤とな
る。
この際、光重合室１′内の雰囲気は温度が低くなってい
るから、感光性組成物のモノマーは蒸発せず、従って、
この感光性組成物がその組成を変更することなく重合し
、性能のよい粘着剤となる。
又、この光重合室１′内の雰囲気は酸素濃度が少なくな
っているから、光を照射すると、重合が阻止されず、極
めてスムーズに重合が進行する。
次に、実施例及び比較例を説明する。
実施例１〜３、比較例
２−エチルへキシルアクリレートを９５重量部、アクリ
ル酸を５重量部、架橋剤としてヘキサンジオールジアク
リレートを０． ２重量部、光重合開始剤として１−
（４−（２−ヒドロキシエトキシ）フェニル）−２−ヒ
ドロキシ−２−メチルプロパン−１−オン−イソホロジ
イソシアネートダイマーを２重量部を熔解槽に入れ、均
一になるように攪拌して感光性組成物を製造した。
この感光性組成物を塗布装置でフィルム状基材の上に塗
布し、第１図に示される光重合室に導き、この光重合室
内で感光性組成物を重合し、粘着剤を製造した。
光照射条件、モノマー液減少量、粘着剤の性能は第１表
の通りである。
実施例はいずれも比較例よりモノマー液減少量が少なく
粘着剤の性能がよかった。
尚、この実施例および比較例での物性の測定方法は次の
通りである。
分子量（重量平均分子量）
テトラヒドロフランに粘着剤を溶解し、２４時間放置し
た。この粘着剤から不溶物を取り除いて得た試料液を、
ゲル透過クロマトグラフィー（ＧＰＣ）により、標準ポ
リスチレンを基準として、屈折率検出計を用いて分子量
を測定した。
残存モノマー量
ポリエチレングリコール（ガスクロ工業（株）社製商品
名２０Ｍ）を担持したｃｈｒｏａ＋ｏｓｏｒｂ−を酸処
理した分離カラム、および水素塩イオン化検出器を有す
るガスクロマトグラフ（ＧＣ−６Ａ。
島津製作所製）を用いて残存モノマーを測定した。
尚、測定用試料は、粘着剤試料１００ｍｇを５ｃｃの酢
酸メチルに溶解した溶液から２ｃｃを採取し、この溶液
２ｃｃと２−エチルへキシルメタクリレートを酢酸メチ
ル溶液に溶解した内部標準液２ｃｃとを混合して調整し
た。
粘着力
４２８０番の紙ヤスリで研磨されたスチール板に、テー
プの一端から長さ１００〜１２０ｍｍ部分を２ｋｇのロ
ーラーで１往復させて貼り付け、２３°Ｃ１６５％ＲＨ
の条件で、このテープの他端をインストロン引張試験機
で３００ｍｍ／分の速度で１８０度角の反対方向に剥離
し、その時の剥離抗力を測定し、粘着力（ｇ／２５ ｍ
ｍ幅）とした。
ＳＰ保持力
４２８０番の紙ヤスリで研磨されたスチール板に、テー
プの一端部を接着面積が幅２５ｍｍ、長さが２５ｍｍと
なるように接着し、この上を２ｋｇのローラーで１往復
させて貼り付け、このテープの他端に１ｋｇの錘を固定
し、これを７０°Ｃの雰囲気で吊るし、このテープとと
もに錘が落下するまでの時間を測定して、保持力（時間
）とした。
第１表
＊２ＥＨＡ：２エチルへキシルアクリレートＡＡｃ
：アクリノＩ
尚、ＰｄＥＪＩｇ、：ｃよ訓反しｔ包い[Example] The present invention will be described in detail below with reference to the drawings. FIG. 1 is an explanatory diagram showing an embodiment of the present invention in an easy-to-understand manner,
FIG. 2 is an explanatory diagram showing another embodiment of the present invention. In FIG. 1, l is a photopolymerization chamber. 2 is a light irradiation device from which ultraviolet rays are irradiated into the polymerization chamber. 3 is a film-like base material, on which a photosensitive composition layer 3 is formed.
1 is provided. 4 is a cooling plate, and a refrigerant cooled by a cooling device (not shown) passes through the cooling plate 4 to cool the cooling plate. Then, the film-like base material 3 passes over the surface of the cooling plate 4 while being in contact with it. 5 is a coating device, and this coating device 5 coats the surface of the film-like base material 3 with a photosensitive composition. Next, a method of manufacturing an adhesive film using this apparatus and its operation will be explained. First, a photosensitive composition is applied onto the film-like base material 3 using the coating device 5, and a photosensitive composition layer 31 is provided on the surface of the film-like base material 3. Thereafter, this film-like base material 3 is introduced into the photopolymerization chamber 1. In this photopolymerization chamber 1, the film-like substrate 3 passes through the cooling plate 4 while being in contact with the cooling plate 4, and during this passage, the photosensitive composition layer provided on the film-like substrate 3 is removed. 31
The photosensitive composition is irradiated with light from a light irradiation device, and the photosensitive composition is polymerized on the film-like base material 3 to become an adhesive. At this time, since the film-like base material 3 is cooled, the photosensitive composition provided thereon is also cooled, and therefore,
There is almost no evaporation of the monomer in the photosensitive composition, and there is little change in composition, resulting in a good pressure-sensitive adhesive. Next, the embodiment shown in FIG. 2 will be described. In FIG. 2, 1' is a photopolymerization chamber. 2 is a light irradiation device. 3 is a film-like base material, on which a photosensitive composition layer 3 is formed.
1 is provided. Reference numeral 41 denotes an atmospheric gas cooling device, and the inert gas cooled by this cooling device 41 is introduced from a gas inlet 42 provided near the entrance of the film-like base material 3, and is introduced near the exit of the film-like base material 3. It is discharged from the provided discharge port 43. Next, a method for producing an adhesive film using this apparatus and its operation will be explained. A photosensitive composition is applied onto the film-like base material 3 using a coating device (not shown), and a photosensitive composition layer 31 is provided on the surface of the film-like base material 3 . Next, the film-like base material 3 provided with the photosensitive composition layer 31 on its surface is guided into the photopolymerization chamber 1'. A cooled inert gas is introduced into the photopolymerization chamber 1' through a gas inlet 42 and discharged through a gas outlet 43. In this way, the atmospheric temperature in the photopolymerization chamber 1' is lowered, and the evaporation of the monomer of the photosensitive composition is reduced, and at the same time, the oxygen concentration of the atmosphere is reduced, making it easier to polymerize. The film-like base material 3 is guided into the photopolymerization chamber 1' where the temperature is lowered and the oxygen concentration is reduced, and here the photosensitive composition layer 3 provided on the film-like base material 3 is introduced.
1, light is irradiated from a light irradiation device 2. Then, the photosensitive composition polymerizes on the film-like base material 3 and becomes an adhesive. At this time, since the temperature of the atmosphere in the photopolymerization chamber 1' is low, the monomer of the photosensitive composition does not evaporate, and therefore,
This photosensitive composition polymerizes without changing its composition, resulting in a pressure-sensitive adhesive with good performance. Furthermore, since the atmosphere in the photopolymerization chamber 1' has a low oxygen concentration, when light is irradiated, polymerization is not inhibited and proceeds extremely smoothly. Next, examples and comparative examples will be described. Examples 1 to 3, Comparative Example 2 - 95 parts by weight of ethylhexyl acrylate, 5 parts by weight of acrylic acid, and 0.5 parts of hexanediol diacrylate as a crosslinking agent. 2 parts by weight, 1- as a photoinitiator
Add 2 parts by weight of (4-(2-hydroxyethoxy)phenyl)-2-hydroxy-2-methylpropan-1-one-isophorodiisocyanate dimer to a melting tank and stir to uniformly form a photosensitive composition. manufactured something. This photosensitive composition was coated onto a film-like base material using a coating device and introduced into a photopolymerization chamber shown in FIG. 1, where the photosensitive composition was polymerized to produce an adhesive. The light irradiation conditions, monomer liquid reduction amount, and adhesive performance are shown in Table 1. In all of the Examples, the amount of monomer liquid decreased was smaller than in the Comparative Examples, and the performance of the adhesive was better. In addition, the method of measuring physical properties in this example and comparative example is as follows. Molecular Weight (Weight Average Molecular Weight) The adhesive was dissolved in tetrahydrofuran and left for 24 hours. The sample solution obtained by removing insoluble matter from this adhesive,
Molecular weight was measured by gel permeation chromatography (GPC) using a refractive index detector using standard polystyrene as a reference. Amount of residual monomer: A gas chromatograph (GC-6A, manufactured by Shimadzu Corporation) equipped with a separation column in which chroa+osorb- carrying polyethylene glycol (product name 20M, manufactured by Gascro Kogyo Co., Ltd.) was acid-treated, and a hydride ionization detector was used. The residual monomer was measured. The measurement sample was obtained by taking 2 cc of a solution of 100 mg of the adhesive sample dissolved in 5 cc of methyl acetate, and mixing 2 cc of this solution with 2 cc of an internal standard solution in which 2-ethylhexyl methacrylate was dissolved in a methyl acetate solution. and adjusted it. Paste a 100 to 120 mm length from one end of the tape to a steel plate polished with 4280 adhesive sandpaper by making one reciprocation with a 2 kg roller at 23°C, 165% RH.
Under these conditions, the other end of this tape was peeled off in the opposite direction at a 180 degree angle at a speed of 300 mm/min using an Instron tensile tester, and the peel force at that time was measured, and the adhesive force (g/25 m
m width). SP Holding Power Glue one end of the tape to a steel plate polished with 4280 sandpaper so that the adhesive area is 25 mm in width and 25 mm in length, and apply it by making one reciprocation with a 2 kg roller. A 1 kg weight was fixed to the other end of this tape, and this was hung in an atmosphere of 70°C. The time until the weight fell together with the tape was measured, and the holding force (time) was determined. Table 1 *2EHA: 2-ethylhexyl acrylate AAc
: Acryno I In addition, PdEJIg, : c Yo disobedience t wrapping
本発明は、光重合室でフィルム状基材の表面に設けられ
た感光性組成物層を冷却しながら、光を照射して、この
感光性組成物を重合するから、この感光性組成物の中の
モノマーの蒸発が少なくなり、性能の良い粘着剤が製造
でき、成果が大である。In the present invention, while cooling the photosensitive composition layer provided on the surface of a film-like substrate in a photopolymerization chamber, light is irradiated to polymerize the photosensitive composition. The evaporation of the monomer inside is reduced, and a pressure-sensitive adhesive with good performance can be produced, which is a great result.
第１図は本発明の一実施態様を判り易く示した説明図、
第２図は本発明の他の実施態様を示した説明図である。
１．１′−光重合室
２・−・・・・・−−−一−−−−光照射装置３−−−
−−−−−−−−−−−フィルム状基材４−−−−−−
−−−−−−−一冷却板４１・・・−一−−−！−冷却
装置FIG. 1 is an explanatory diagram showing an embodiment of the present invention in an easy-to-understand manner,
FIG. 2 is an explanatory diagram showing another embodiment of the present invention. 1.1'-Photopolymerization chamber 2---1---Light irradiation device 3---
----------Film-like base material 4------
----------1 cooling plate 41...-1--! -Cooling device
Claims (1)
後、光重合室に導き、この光重合室内で感光性粘着剤層
を冷却しながら光を照射し、前記感光性組成物をフィル
ム状基材上で重合させることを特徴とする粘着フィルム
またはシートの製造方法。(1) After providing a photosensitive composition layer on the surface of a film-like base material, the photosensitive adhesive layer is guided into a photopolymerization chamber and irradiated with light while cooling the photosensitive adhesive layer in the photopolymerization chamber. A method for producing an adhesive film or sheet, which comprises polymerizing on a film-like base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2105939A JP2806599B2 (en) | 1990-04-20 | 1990-04-20 | Method for producing adhesive film or sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2105939A JP2806599B2 (en) | 1990-04-20 | 1990-04-20 | Method for producing adhesive film or sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044277A true JPH044277A (en) | 1992-01-08 |
| JP2806599B2 JP2806599B2 (en) | 1998-09-30 |
Family
ID=14420820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2105939A Expired - Lifetime JP2806599B2 (en) | 1990-04-20 | 1990-04-20 | Method for producing adhesive film or sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2806599B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6339111B1 (en) | 1991-02-28 | 2002-01-15 | 3M Innovative Properties Company | Multi-stage irradiation process for production of acrylic based adhesives and adhesives made thereby |
| US6436532B1 (en) | 1991-02-28 | 2002-08-20 | 3M Innovative Properties Company | Multi-stage irradiation process for production of acrylic based adhesives and adhesives made thereby |
| JP2003049129A (en) * | 2001-08-03 | 2003-02-21 | Soken Chem & Eng Co Ltd | Method for producing acrylic adhesive tape and acrylic adhesive tape |
| JP4646457B2 (en) * | 2001-07-25 | 2011-03-09 | 日東電工株式会社 | Method and apparatus for producing pressure-sensitive adhesive sheet |
| JP2013018836A (en) * | 2011-07-08 | 2013-01-31 | Nitto Denko Corp | Method and apparatus for producing pressure sensitive adhesive sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921883A (en) * | 1982-07-27 | 1984-02-03 | ワイケイケイ株式会社 | Attachment of window unit to opening of building |
| JPS60152504A (en) * | 1984-01-19 | 1985-08-10 | Dai Ichi Kogyo Seiyaku Co Ltd | Production of self-adhesive polymer |
| JPS61211303A (en) * | 1985-03-18 | 1986-09-19 | Mitsubishi Rayon Co Ltd | Control of photo-initiated polymerization |
| JPS63118392A (en) * | 1986-08-29 | 1988-05-23 | ミネソタ マイニング アンド マニユフアクチユアリング カンパニ− | Unified pressure-sensitive adhesive tape and its production |
-
1990
- 1990-04-20 JP JP2105939A patent/JP2806599B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921883A (en) * | 1982-07-27 | 1984-02-03 | ワイケイケイ株式会社 | Attachment of window unit to opening of building |
| JPS60152504A (en) * | 1984-01-19 | 1985-08-10 | Dai Ichi Kogyo Seiyaku Co Ltd | Production of self-adhesive polymer |
| JPS61211303A (en) * | 1985-03-18 | 1986-09-19 | Mitsubishi Rayon Co Ltd | Control of photo-initiated polymerization |
| JPS63118392A (en) * | 1986-08-29 | 1988-05-23 | ミネソタ マイニング アンド マニユフアクチユアリング カンパニ− | Unified pressure-sensitive adhesive tape and its production |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6339111B1 (en) | 1991-02-28 | 2002-01-15 | 3M Innovative Properties Company | Multi-stage irradiation process for production of acrylic based adhesives and adhesives made thereby |
| US6436532B1 (en) | 1991-02-28 | 2002-08-20 | 3M Innovative Properties Company | Multi-stage irradiation process for production of acrylic based adhesives and adhesives made thereby |
| JP4646457B2 (en) * | 2001-07-25 | 2011-03-09 | 日東電工株式会社 | Method and apparatus for producing pressure-sensitive adhesive sheet |
| JP2003049129A (en) * | 2001-08-03 | 2003-02-21 | Soken Chem & Eng Co Ltd | Method for producing acrylic adhesive tape and acrylic adhesive tape |
| JP2013018836A (en) * | 2011-07-08 | 2013-01-31 | Nitto Denko Corp | Method and apparatus for producing pressure sensitive adhesive sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2806599B2 (en) | 1998-09-30 |
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