JPH0442744U - - Google Patents
Info
- Publication number
- JPH0442744U JPH0442744U JP1990084545U JP8454590U JPH0442744U JP H0442744 U JPH0442744 U JP H0442744U JP 1990084545 U JP1990084545 U JP 1990084545U JP 8454590 U JP8454590 U JP 8454590U JP H0442744 U JPH0442744 U JP H0442744U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- semiconductor chip
- island
- die bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/07353—
-
- H10W72/321—
-
- H10W72/334—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W72/931—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084545U JPH0442744U (index.php) | 1990-08-13 | 1990-08-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084545U JPH0442744U (index.php) | 1990-08-13 | 1990-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442744U true JPH0442744U (index.php) | 1992-04-10 |
Family
ID=31633101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990084545U Pending JPH0442744U (index.php) | 1990-08-13 | 1990-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442744U (index.php) |
-
1990
- 1990-08-13 JP JP1990084545U patent/JPH0442744U/ja active Pending