JPH0442742U - - Google Patents
Info
- Publication number
- JPH0442742U JPH0442742U JP8534790U JP8534790U JPH0442742U JP H0442742 U JPH0442742 U JP H0442742U JP 8534790 U JP8534790 U JP 8534790U JP 8534790 U JP8534790 U JP 8534790U JP H0442742 U JPH0442742 U JP H0442742U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- constriction
- sealing resin
- lead frame
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8534790U JPH0442742U (no) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8534790U JPH0442742U (no) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442742U true JPH0442742U (no) | 1992-04-10 |
Family
ID=31634445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8534790U Pending JPH0442742U (no) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442742U (no) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012127696A1 (ja) * | 2011-03-24 | 2012-09-27 | 三菱電機株式会社 | パワー半導体モジュール及びパワーユニット装置 |
-
1990
- 1990-08-10 JP JP8534790U patent/JPH0442742U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012127696A1 (ja) * | 2011-03-24 | 2012-09-27 | 三菱電機株式会社 | パワー半導体モジュール及びパワーユニット装置 |
| JP5701377B2 (ja) * | 2011-03-24 | 2015-04-15 | 三菱電機株式会社 | パワー半導体モジュール及びパワーユニット装置 |
| US9129931B2 (en) | 2011-03-24 | 2015-09-08 | Mitsubishi Electric Corporation | Power semiconductor module and power unit device |