JPH0442740U - - Google Patents

Info

Publication number
JPH0442740U
JPH0442740U JP8367790U JP8367790U JPH0442740U JP H0442740 U JPH0442740 U JP H0442740U JP 8367790 U JP8367790 U JP 8367790U JP 8367790 U JP8367790 U JP 8367790U JP H0442740 U JPH0442740 U JP H0442740U
Authority
JP
Japan
Prior art keywords
package
weight
external lead
lead terminals
insulating container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8367790U
Other languages
English (en)
Japanese (ja)
Other versions
JP2514898Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8367790U priority Critical patent/JP2514898Y2/ja
Publication of JPH0442740U publication Critical patent/JPH0442740U/ja
Application granted granted Critical
Publication of JP2514898Y2 publication Critical patent/JP2514898Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP8367790U 1990-08-07 1990-08-07 半導体素子収納用パッケージ Expired - Lifetime JP2514898Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8367790U JP2514898Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8367790U JP2514898Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0442740U true JPH0442740U (US06272168-20010807-M00014.png) 1992-04-10
JP2514898Y2 JP2514898Y2 (ja) 1996-10-23

Family

ID=31631540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8367790U Expired - Lifetime JP2514898Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2514898Y2 (US06272168-20010807-M00014.png)

Also Published As

Publication number Publication date
JP2514898Y2 (ja) 1996-10-23

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